Diodes Incorporated PI4ULS3V08MZLEX

Overview

PI4ULS3V08MZLEX from Diodes Incorporated (acquired Pericom Semiconductor) is an 8-bit universal bidirectional voltage-level shifter with automatic direction control, supporting independent 1.2V–3.6V rails on A and B ports. It enables asynchronous data translation between mismatched logic domains without external direction signals, delivers ≤5.0 ns propagation delay at 3.3V/3.3V, supports 90 Mbps push-pull bus speeds, and features 12 mA drive capability per I/O. It is used in mobile device interconnects between application processors and low-voltage peripherals.

For engineers reviewing the PI4ULS3V08MZLEX datasheet, PI4ULS3V08MZLEX pinout, PI4ULS3V08MZLEX application, or PI4ULS3V08MZLEX equivalent, key selection criteria include dual-rail voltage flexibility (1.2V–3.6V), automatic bidirectional operation, sub-6 ns tPD across rail combinations, 32-pin TQFN package thermal performance, and industrial temperature support (–40°C to +85°C).

Technical Context

The PI4ULS3V08MZLEX implements true bidirectional level translation using internal sensing circuitry that detects signal direction dynamically-no external DIR pin required. Each of its eight channels operates independently, allowing mixed-voltage communication between buses such as 1.8V I²C and 3.3V GPIO banks.

It supports configurable output impedance via OUT_SEL and test mode activation via TEST_EN, both powered by VCCB. The device uses separate VCCA and VCCB supplies to define input/output voltage domains, with I/O pins tolerant up to VCCx + 0.5V and clamp current rated at ±50 mA.

Key Specifications

Pinout & Package

Package: 32-contact TQFN (3 mm × 6 mm, 0.5 mm pitch, exposed thermal pad).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level shifting applications.

Compared with TXS0108E and SN74AVC8T245, PI4ULS3V08MZLEX uniquely supports 1.2V operation, integrates output impedance selection, and eliminates direction-control timing constraints-making it optimal for compact, low-power, multi-rail mobile and wearable designs.

Availability

PI4ULS3V08MZLEX is available at Aetrix Electronics and suitable for mobile device interface design, eMMC/SDIO host translation, and industrial sensor hub integration requiring stable component supply across long production lifecycles.

Supply support for PI4ULS3V08MZLEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated acquired Pericom Semiconductor in 2017 and now manufactures high-performance interface, timing, and signal-integrity solutions for consumer, industrial, and communications markets.

This device belongs to Diodes' legacy Pericom voltage translation portfolio, engineered specifically for low-power, multi-rail interoperability in space-constrained portable electronics and IoT edge nodes.

FAQ

What is the minimum valid supply voltage for reliable operation on either port?

The PI4ULS3V08MZLEX is fully specified down to 1.2V on both VCCA and VCCB rails. At 1.2V, it maintains ≤7.0 ns propagation delay, 2 mA drive strength, and guaranteed logic thresholds per JESD8-12. Operation below 1.2V is not characterized and may result in undefined state transitions or increased leakage.

Can unused I/O pins be left floating?

No. Per datasheet Section 3, all unused I/O pins must be tied to either their associated VCC rail (VCCA or VCCB) or GND to prevent floating inputs from inducing shoot-through current, oscillation, or excessive ICC. Leaving them unconnected violates recommended operating conditions and risks latch-up under transient stress.

How does the automatic direction control behave during simultaneous A→B and B→A transitions?

When signals arrive simultaneously on both sides, all AX and BX pins enter high-impedance state (tri-state) to prevent bus contention. This behavior is inherent to the internal sensing architecture and requires no external arbitration-ensuring safe, glitch-free operation during asynchronous handshake scenarios.

Is the exposed thermal pad electrically connected internally?

Yes-the exposed pad is internally connected to GND and must be soldered to a PCB thermal pad tied to the system ground plane. Thermal resistance (θJA) is specified assuming full pad soldering; omitting this connection increases junction temperature by >15°C at 100 mW dissipation and risks long-term reliability failure.