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Diodes Incorporated PI4ULS3V16ZFE

Part No.:
PI4ULS3V16ZFE
Manufacturer:
Diodes Incorporated
Category:
Translators, Level Shifters
Package:
Datasheet:
AetrixPI4ULS3V16ZFE.pdf
Description:
IC TRANSLTR BIDIRECTIONAL 56TQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,457

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Product details

Overview

PI4ULS3V16ZFE from Diodes Incorporated (acquired Pericom Semiconductor) is a 16-bit universal bidirectional voltage-level shifter with automatic direction control, supporting independent 1.2V–3.6V operation on A and B ports. It enables asynchronous data translation between mismatched logic domains (e.g., 1.8V ↔ 3.3V), delivers up to 90 Mbps push-pull bus speed, provides 12mA drive capability per I/O, and operates across –40°C to +85°C for industrial embedded interfaces.

For engineers reviewing the PI4ULS3V16ZFE datasheet, PI4ULS3V16ZFE pinout, PI4ULS3V16ZFE application, or PI4ULS3V16ZFE equivalent, this page details its dual-rail level-shifting architecture, timing-critical skew performance (≤0.25 ns), output impedance selection (300 Ω / 2.2 kΩ), and isolation behavior under concurrent bidirectional traffic - all critical for high-speed mixed-voltage SoC interconnects.

Technical Context

The PI4ULS3V16ZFE implements true bidirectional translation without external direction control by detecting signal transitions on either port and enabling the corresponding path. Its dual-supply architecture (VCCA and VCCB independently configurable from 1.2V to 3.6V) supports asymmetric voltage translation such as 1.2V ↔ 2.5V or 1.8V ↔ 3.3V in both directions.

It features four control inputs (xOE, xSEL, TEST_EN, OUT_SEL) powered by VCCB, enabling dynamic output impedance selection (300 Ω low-Z or 2.2 kΩ high-Z), test-mode routing (A→B or B→A), and 3-state isolation. All 16 I/Os operate with independent bit-level translation and auto-tristate during simultaneous A/B activity.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Range VCCA and VCCB each support 1.2V to 3.6V - enables flexible mixed-voltage system integration without level-shifter stacking.
Max Data Rate 90 Mbps (push-pull, 10pF load) - sufficient for high-speed I²C, SPI, and GPIO expansion in modern MCU/FPGA designs.
Propagation Delay 3.5 ns (min, VCCA=3.3V/VCCB=3.3V) - ensures tight timing margins in synchronous peripheral interfaces.
Output Drive ±12 mA at VCCO = 3.0V - drives standard CMOS loads and short PCB traces without external buffers.
Skew (tsk) ≤0.25 ns (same-bank outputs) - preserves signal integrity in parallel bus applications requiring phase alignment.
ESD Protection ±2000V HBM, ±200V MM - meets industrial-grade robustness requirements for board-level handling and field operation.
Operating Temp –40°C to +85°C - validated for continuous operation in industrial control, automotive body electronics, and networking equipment.

Pinout & Package

Package: 56-pin TQFN (5 mm × 11 mm, 0.5 mm pitch, ZF code), lead-free and RoHS-compliant, with exposed thermal pad for enhanced power dissipation.

Pin/Terminal Circuit Role Design Meaning
xOE (A/B) Active-low 3-state enable Drives all associated I/Os into high-impedance when asserted - isolates buses during power sequencing or fault conditions.
xSEL Output loading selection Selects CL ≤ 10pF (H) to 50pF (L) - optimizes speed vs. noise immunity based on trace length and fanout.
xAx / xBx Bidirectional data terminals Auto-directional I/Os - no external direction line needed; internal logic detects edge direction and enables path accordingly.
TEST_EN / OUT_SEL Test and impedance control Enables diagnostic A↔B routing and selects 300 Ω (low-Z) or 2.2 kΩ (high-Z) output drive - aids signal integrity tuning.
VCCA / VCCB Independent supply rails Each powers one side of the translator - allows independent voltage domain assignment (e.g., VCCA=1.8V for core logic, VCCB=3.3V for legacy peripherals).
GND Common reference Single ground plane required - eliminates need for separate analog/digital grounds or isolation components.

Key Features

Feature Design Value
Automatic direction control Eliminates external direction signals and timing-critical control logic - reduces PCB routing complexity and firmware overhead.
Per-bit independent translation Each of 16 channels operates autonomously - supports mixed-voltage protocols where individual lines may differ in voltage domain or timing.
Configurable output impedance 300 Ω or 2.2 kΩ selection via OUT_SEL - mitigates reflections on long traces while maintaining rise/fall time control.
Simultaneous bidirectional tristate Auto-isolates both ports when conflicting edges arrive - prevents bus contention and latch-up during hot-plug or reset events.
Voltage-rail flexibility VCCA and VCCB independently set from 1.2V to 3.6V - accommodates next-gen ultra-low-power cores interfacing with legacy 3.3V peripherals.

Applications

Mobile SoC Interconnect FPGA-to-MCU Interface

Use Scenario: Connecting a 1.2V mobile application processor to a 2.5V camera sensor interface with minimal latency and no direction control overhead.

IC Role / Device Role / Timing Role: Bidirectional level shifter enabling I²C and parallel data lanes between voltage-mismatched subsystems.

Use Value: Eliminates need for discrete MOSFET-based shifters and direction logic, reducing BOM count and layout area by >40%.

Use Scenario: Bridging 1.8V FPGA I/O banks to 3.3V industrial MCU peripherals (UART, SPI, GPIO) in programmable logic controllers.

IC Role / Device Role / Timing Role: Voltage translator with sub-4ns propagation delay and <0.25ns skew - preserves setup/hold timing across 16-bit parallel control buses.

Use Value: Enables deterministic real-time response in closed-loop control systems without adding timing uncertainty from external direction management.

Automotive Body Control Module Industrial Sensor Hub

Use Scenario: Interfacing 3.3V CAN transceivers and 1.8V microcontroller GPIOs in vehicle door modules operating at –40°C to +85°C.

IC Role / Device Role / Timing Role: Robust level shifter with ±2000V HBM ESD rating and industrial temperature grade - sustains reliable communication under harsh EMC conditions.

Use Value: Reduces failure rate due to ESD-induced latch-up in assembly and field environments, eliminating need for additional TVS protection on each line.

Use Scenario: Aggregating multiple 1.2V/1.8V digital sensors (temperature, humidity, pressure) onto a 3.3V host microcontroller bus in factory automation gateways.

IC Role / Device Role / Timing Role: 16-channel translator with independent per-bit operation - supports heterogeneous sensor voltage domains on a single compact IC.

Use Value: Cuts interposer board count and routing layers by consolidating eight discrete 2-bit shifters into one TQFN-56 package.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level shifting applications.

Alternative Part Technical Difference Application Difference Selection Advice
TXS0108E 8-bit, fixed 1.65V–5.5V range; no output impedance selection; max 60 Mbps; only one VCC rail (VCCA), VCCB derived internally. Limited to 8 channels; lacks per-pin loading control and high-Z output mode - less suitable for mixed-slew-rate bus segments. Choose for cost-sensitive, lower-channel-count designs where VCCB derivation simplifies supply design.
SN74AVC16T245 16-bit, direction-controlled (not automatic); supports 1.2V–3.6V; 100 Mbps; requires external DIR signal and pull-up/pull-down network. Introduces timing-critical direction control path and additional passive components - increases layout complexity and firmware coordination overhead. Prefer when deterministic unidirectional flow dominates and precise control over direction timing is required.

Compared with TXS0108E and SN74AVC16T245, the PI4ULS3V16ZFE uniquely combines 16-bit automatic direction sensing, dual independent supplies, and selectable output impedance - making it optimal for high-density, mixed-voltage, and timing-critical embedded interconnects where control pin count and signal integrity are constrained.

Availability

PI4ULS3V16ZFE is available at Aetrix Electronics and suitable for industrial automation, automotive body electronics, and mobile SoC interconnects requiring stable component supply, extended temperature operation, and RoHS-compliant packaging.

Supply support for PI4ULS3V16ZFE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated acquired Pericom Semiconductor in 2017, integrating its high-performance interface solutions into a broad portfolio of analog and mixed-signal ICs serving industrial, computing, and communications markets.

The PI4ULS3V16ZFE belongs to Pericom's ULS (Ultra-Low Skew) level-shifter family, designed specifically for high-speed, mixed-voltage SoC-to-peripheral bridging in space-constrained and thermally demanding embedded systems.

FAQ

What is the minimum recommended pull-up resistor value for the xOE pin during power-up?

The xOE pin must be tied to VCC through a pull-up resistor to ensure high-impedance state at power-up. Minimum resistance is determined by the driver's current-sinking capability: for typical 4mA sink strength, a 10 kΩ resistor limits current to 0.33 mA at 3.3V, satisfying JESD78 latch-up immunity while ensuring fast deassertion. Values below 4.7 kΩ risk excessive current draw.

Can PI4ULS3V16ZFE translate between 1.2V and 5V logic domains?

No. Absolute maximum ratings limit VCCA and VCCB to –0.5V to +4.6V, but recommended operating range is strictly 1.2V to 3.6V per rail. Applying 5V violates specification and risks permanent damage. For 1.2V ↔ 5V translation, a two-stage approach (e.g., 1.2V→3.3V then 3.3V→5V) or dedicated 5V-tolerant shifter like NLSX5014 is required.

How does the device behave when both A and B ports receive valid signals simultaneously?

When transitions occur on both sides at once, all AX and BX pins enter high-impedance state automatically - preventing bus contention and current shoot-through. This behavior is inherent to the internal arbitration logic and requires no external intervention, making it ideal for hot-plug or asynchronous reset scenarios.

Is the exposed thermal pad electrically connected, and how should it be handled on the PCB?

Yes, the exposed pad is internally connected to GND. It must be soldered to a solid copper thermal pad on the PCB with ≥4 thermal vias (0.3mm diameter) to an inner ground plane. Failure to connect it degrades thermal performance (θJA rises from 33°C/W to >60°C/W), risking junction temperature exceedance above 125°C under sustained 12mA per pin loading.

PI4ULS3V16ZFE Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
ULS
Package/Case:
Packaging:
Tray
Product Status:
Obsolete
Translator Type:
Voltage Level
Channel Type:
Bidirectional
Number of Circuits:
2
Channels per Circuit:
8
Voltage - VCCA:
1.2 V ~ 3.6 V
Voltage - VCCB:
1.2 V ~ 3.6 V
Input Signal:
-
Output Signal:
-
Output Type:
Tri-State, Non-Inverted
Data Rate:
180Mbps
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Features:
Auto-Direction Sensing
Mounting Type:
Surface Mount
Supplier Device Package:
56-WFQFN Exposed Pad

PI4ULS3V16ZFE FAQ

1.How can I place an order for PI4ULS3V16ZFE through Aetrix?

Please submit a Request for Quotation (RFQ) for PI4ULS3V16ZFE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PI4ULS3V16ZFE reliable?

The price and inventory of PI4ULS3V16ZFE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI4ULS3V16ZFE is usually 5 days.

3.What payment methods are accepted for PI4ULS3V16ZFE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI4ULS3V16ZFE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PI4ULS3V16ZFE?

PI4ULS3V16ZFE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PI4ULS3V16ZFE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PI4ULS3V16ZFE?

For technical support, including PI4ULS3V16ZFE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI4ULS3V16ZFE requirements.

6.How does Aetrix verify that PI4ULS3V16ZFE is sourced from the original manufacturer or authorized distributors?

All PI4ULS3V16ZFE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI4ULS3V16ZFE meets industry standards.

7.What is the process for return or replacement of PI4ULS3V16ZFE?

All PI4ULS3V16ZFE units undergo pre-shipment inspection (PSI). If there is an issue with PI4ULS3V16ZFE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PI4ULS3V16ZFE part is unused and in its original packaging.

Return procedure for PI4ULS3V16ZFE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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