Diodes Incorporated PI4ULS3V16ZFEX

Overview

PI4ULS3V16ZFEX from Diodes Incorporated (acquired Pericom Semiconductor) is a 16-bit universal bidirectional voltage-level shifter with automatic direction control, supporting independent 1.2V–3.6V rails on A and B ports. It enables asynchronous data translation between mismatched logic domains (e.g., 1.8V ↔ 3.3V), delivers up to 90 Mbps push-pull bus speed, provides ±12 mA drive capability per I/O, and operates across –40°C to +85°C for industrial embedded interconnects.

For engineers reviewing the PI4ULS3V16ZFEX datasheet, PI4ULS3V16ZFEX pinout, PI4ULS3V16ZFEX application, or PI4ULS3V16ZFEX equivalent, key selection criteria include dual-rail voltage flexibility, automatic direction sensing without external control lines, sub-5 ns propagation delay at 3.3V, configurable output impedance (300 Ω / 2.2 kΩ), and TQFN-56 package thermal performance (33 °C/W).

Technical Context

The PI4ULS3V16ZFEX implements true bidirectional level shifting via internal pass-gate architecture with dynamic direction detection-no external DIR signal required. Each of its 16 channels operates independently, with A-side and B-side I/Os referenced to separate VCCA and VCCB supplies, enabling simultaneous translation across non-matching voltage domains.

Control logic (xOE, xSEL, TEST_EN, OUT_SEL) is powered by VCCB and supports output isolation, test-mode routing (A→B or B→A), and selectable output drive strength. Timing skew is guaranteed ≤0.3 ns between same-bank outputs, and bus speeds reach 90 MHz under 10 pF load with VCCA = VCCB = 3.3 V.

Key Specifications

Pinout & Package

Package: 56-pin TQFN (5 mm × 11 mm, 0.5 mm pitch, ZF code), thermally enhanced with exposed pad for PCB heat dissipation (θ_JA = 33 °C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level shifting applications.

Compared with TXS0108E and SN74AVC16T245, PI4ULS3V16ZFEX uniquely combines 16-bit width, fully independent dual-rail operation, and zero-pin-direction-control-making it optimal for high-channel-count, mixed-voltage, and firmware-light embedded interconnects.

Availability

PI4ULS3V16ZFEX is available at Aetrix Electronics and suitable for mobile baseband design, industrial PLC backplane integration, and automotive body control module production requiring stable component supply and long-term lifecycle assurance.

Supply support for PI4ULS3V16ZFEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated acquired Pericom Semiconductor in 2017 and integrates its high-performance interface solutions into a broad portfolio of signal integrity, power management, and discrete components.

The PI4ULS3V16ZFEX belongs to Pericom's ULS (Universal Level Shifter) product line, engineered specifically for seamless voltage-domain bridging in multi-rail SoC systems, server memory subsystems, and industrial edge controllers.

FAQ

Can PI4ULS3V16ZFEX translate between 1.2 V and 5 V logic levels?

No. Absolute maximum ratings limit I/O voltage to VCCX + 0.5 V, and recommended operating conditions cap VCCA/VCCB at 3.6 V. Applying 5 V to any I/O pin-even while powered at 3.3 V-exceeds safe operating limits and risks permanent damage. For 5 V interfaces, use a dedicated 5 V-tolerant shifter like the NTS0108P.

Is external pull-up required on the xOE pin?

Yes. To ensure high-impedance state during power-up/power-down, xOE must be pulled high to VCCB via an external resistor. The minimum value depends on the driver's sink current; for typical 100 µA sink capability, a 47 kΩ resistor suffices. Leaving xOE floating may cause bus contention or undefined I/O states.

Does PI4ULS3V16ZFEX support hot-swap or live-insertion?

It supports controlled hot-swap when VCCA and VCCB are sequenced properly: apply GND first, then VCCB, then VCCA, and finally assert signals. The device's I/Os tolerate –0.5 V to VCCX + 0.5 V in high-Z state, and its 2000 V HBM ESD rating protects against handling discharge-but system-level hot-swap requires external current limiting and sequencing circuitry.

What is the function of the TSTx pins?

TSTx pins are internal test nodes used during wafer sort and final test. In normal operation, they must be tied to GND per datasheet guidance. Leaving them unconnected or floating may cause unpredictable behavior, increased leakage, or failure to meet timing specifications due to parasitic coupling.