My Inquiry
My Account
Diodes Incorporated PI4ULS3V4103XEAEX
- Part No.:
- PI4ULS3V4103XEAEX
- Manufacturer:
- Diodes Incorporated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
PI4ULS3V4103XEAEX.pdf
- Description:
- IC TRNSLTR BIDIR 10X1QFN TR 3.5K
- Quantity:
- Payment:
- Shipping:
Inventory:3,499
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PI4ULS3V4103XEAEX from Diodes Incorporated is a bidirectional SIM card interface level shifter supporting 1.8V/3V SIM cards and host controllers operating at 1.1V–2.0V. It provides automatic voltage translation for RST, CLK, and bidirectional IO signals between host and SIM sides, with integrated power sequencing control via EN pin and meets EMV fault tolerance requirements. Used in GSM/TD-SCDMA handsets and wireless point-of-sale terminals.
For engineers reviewing the PI4ULS3V4103XEAEX datasheet, PI4ULS3V4103XEAEX pinout, PI4ULS3V4103XEAEX application, or PI4ULS3V4103XEAEX equivalent, key selection criteria include dual-voltage domain support (1.1–2.0V host / 1.65–3.6V SIM), 8kV HBM ESD on SIM pins, shutdown current ≤60μA, propagation delay ≤15ns, and X1QFN-10 (XEA) package compatibility.
Technical Context
The PI4ULS3V4103XEAEX implements independent level-shifting paths for RST, CLK, and bidirectional IO across two isolated voltage domains: VCC_HOST (1.1V–2.0V) and VCC_SIM (1.65V–3.6V). Its EN-controlled power gating ensures RST_SIM, CLK_SIM, and IO_SIM are pulled low during shutdown, preventing backfeed when VCC_SIM is unpowered.
Internal weak pull-ups (20kΩ on IO_HOST, 15kΩ on IO_SIM, 50kΩ on EN) enable open-drain host interfaces, while dynamic characteristics specify tPD ≤15ns, tR/tF ≤10ns, and output skew ≤2ns between CLK_SIM and IO_SIM - critical for ISO/IEC 7816-3 timing compliance in smart card transactions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Host Voltage Range | 1.1V to 2.0V - enables direct interfacing with ultra-low-voltage application processors and baseband ICs. |
| SIM Voltage Range | 1.65V to 3.6V - supports both 1.8V and 3V SIM cards without external regulators. |
| Propagation Delay | ≤15ns - ensures signal integrity within ISO/IEC 7816-3 clock cycle timing budgets. |
| ESD Protection | 8kV HBM on SIM pins, 2kV HBM on host pins - protects against handling and system-level ESD events per IEC 61000-4-2. |
| Shutdown Current | ≤60μA (VCC_SIM), ≤2μA (VCC_HOST) - minimizes battery drain during SIM card idle states. |
| Output Skew | ≤2ns between CLK_SIM and IO_SIM - maintains synchronous data sampling at up to 25MHz clock frequency. |
| IO Pull-up Resistors | 20kΩ (host side), 15kΩ (SIM side) - allows use with open-drain microcontroller GPIOs without external components. |
Pinout & Package
Package: 10-contact X1QFN (XEA), 1.4mm × 1.8mm, 0.4mm pitch, thermally enhanced exposed pad (GND).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 RST_HOST | Input | Host-side reset signal input; level-shifted to drive RST_SIM at SIM voltage level. |
| 2 CLK_HOST | Input | Host-side clock input; level-shifted and gated to generate CLK_SIM only after VCC stabilization. |
| 3 IO_HOST | I/O | Bidirectional data path with 20kΩ internal pull-up; compatible with open-drain host controllers sinking >1mA. |
| 4 GND | Power | Common ground reference for both domains; exposed thermal pad must be soldered to PCB ground plane. |
| 5 IO_SIM | I/O | SIM-side bidirectional data; requires SIM card to use open-drain driver sourcing >1mA. |
| 6 CLK_SIM | Output | Level-shifted, gated clock output to SIM; pulled low during shutdown or before VCC_SIM stabilization. |
| 7 RST_SIM | Output | Level-shifted reset output to SIM; held low until VCC_SIM reaches valid threshold. |
| 8 VCC_SIM | Power | Supply for SIM-side circuitry and level shifters; powers internal ESD diodes connected to SIM pins. |
| 9 VCC_HOST | Power | Supply for host-side interface and control logic; independent of VCC_SIM for flexible power sequencing. |
| 10 EN | Input | Enable control: HIGH activates level shifting, LOW forces shutdown and pin grounding. |
Key Features
| Feature | Design Value |
|---|---|
| Automatic bidirectional level translation | Eliminates need for external MOSFET translators or discrete resistor networks in SIM interface designs. |
| EMV-compliant fault tolerance | Ensures robust operation under SIM card hot-insertion, voltage transients, and supply sequencing faults per payment terminal standards. |
| Independent domain power control | Allows VCC_HOST and VCC_SIM to power up/down asynchronously without latch-up or leakage through ESD diodes. |
| Integrated weak pull-ups | Reduces BOM count by eliminating four external resistors (IO_HOST, IO_SIM, EN, and optional RST/CLK terminations). |
| Thermally optimized X1QFN package | 1.4mm × 1.8mm footprint with exposed GND pad enables high-density mobile PCB layouts while maintaining <40°C/W θJA. |
Applications
| GSM Mobile Handsets | Wireless Point-of-Sale Terminals |
|---|---|
Use Scenario: Dual-SIM smartphones requiring simultaneous 1.8V and 3V SIM card support with ultra-low-power standby modes. IC Role / Device Role / Timing Role: Level translator and power sequencer for ISO/IEC 7816-3 compliant RST/CLK/IO signaling between AP baseband and SIM socket. Use Value: Enables single-chip SIM interface for mixed-voltage SIM configurations while meeting 25MHz clock timing and EMV fault tolerance. | Use Scenario: Battery-powered handheld payment terminals using removable 1.8V SIM cards for cellular connectivity. IC Role / Device Role / Timing Role: Voltage translator and ESD-hardened interface between low-voltage MCU GPIOs and SIM card contacts. Use Value: Reduces system-level ESD failure rate with 8kV HBM protection on SIM pins and cuts standby current to ≤60μA. |
| TD-SCDMA Feature Phones | Multi-SIM IoT Gateways |
Use Scenario: Legacy TD-SCDMA handsets migrating to newer SIM form factors while retaining existing 1.2V host controller designs. IC Role / Device Role / Timing Role: Bidirectional level shifter enabling 1.2V host I/O to drive 1.8V SIM signals without violating VIH/VIL thresholds. Use Value: Extends lifecycle of legacy baseband ICs by bridging voltage gap with guaranteed 0.75×VCC_HOST VIH and 0.25×VCC_HOST VIL margins. | Use Scenario: Industrial IoT gateways with triple-SIM failover requiring independent power control per SIM slot. IC Role / Device Role / Timing Role: Per-SIM level translation and enable-controlled isolation to prevent cross-slot interference during hot-swap events. Use Value: Supports independent EN pin control per SIM channel, enabling selective activation and reducing total system leakage by >90%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SIM card interface level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX14541EATA+ | Single-supply operation (2.2V–3.6V), no separate VCC_HOST rail; fixed 1.8V SIM output only. | Limited to 1.8V SIM cards; cannot support 3V SIM or sub-1.2V hosts. | Select when system uses only 1.8V SIMs and host operates ≥2.2V - reduces component count but sacrifices voltage flexibility. |
| TXS0102DCUR | Two-channel bidirectional translator; no built-in SIM-specific ESD (2kV HBM only); no EMV fault tolerance features. | Requires external ESD protection and power sequencing logic for SIM compliance. | Select for non-EMV applications like embedded SIM readers where cost is prioritized over certification readiness. |
Compared with MAX14541EATA+ and TXS0102DCUR, the PI4ULS3V4103XEAEX uniquely supports dual-voltage SIM cards (1.8V/3V), offers 8kV HBM ESD on SIM pins, integrates EMV-compliant fault handling, and enables sub-1.2V host operation - making it the only drop-in solution for certified payment and cellular handset designs.
Availability
PI4ULS3V4103XEAEX is available at Aetrix Electronics and suitable for GSM mobile handsets, wireless point-of-sale terminals, and TD-SCDMA feature phones requiring stable component supply, long-term lifecycle support, and automotive-grade traceability.
Supply support for PI4ULS3V4103XEAEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and interface solutions for consumer, industrial, and automotive markets.
The PI4ULS3V4103XEAEX belongs to Diodes' Pericom® interface product line, engineered specifically for smart card and SIM card interface compliance - emphasizing EMV fault tolerance, low-power shutdown, and mixed-voltage interoperability in space-constrained portable devices.
FAQ
What is the minimum host supply voltage supported by PI4ULS3V4103XEAEX?
The device supports VCC_HOST down to 1.1V, enabling direct connection to modern ultra-low-voltage application processors and baseband ICs. At 1.2V host supply, it guarantees VIH ≥0.75×VCC_HOST (≥0.9V) and VIL ≤0.25×VCC_HOST (≤0.3V) for reliable logic-level recognition on RST_HOST, CLK_HOST, and IO_HOST pins.
How does PI4ULS3V4103XEAEX handle power sequencing when VCC_SIM is unpowered?
When VCC_SIM is off, the device disables CLK_SIM, RST_SIM, and IO_SIM outputs and pulls them low. Internal ESD diodes remain connected to VCC_SIM, so voltages applied to SIM-side pins while VCC_SIM is unpowered cause leakage current - design must avoid such conditions or ensure SIM-side signals are tri-stated during VCC_SIM power-off.
Can PI4ULS3V4103XEAEX interface with both 1.8V and 3V SIM cards simultaneously?
No - the device supports either 1.8V or 3V SIM cards per instance, selected by setting VCC_SIM to the target voltage (1.65–1.95V for 1.8V SIMs; 2.7–3.6V for 3V SIMs). It does not auto-detect SIM voltage class; configuration is static per board design and must match the installed SIM card's specification.
Is the X1QFN-10 (XEA) package RoHS and halogen-free compliant?
Yes - PI4ULS3V4103XEAEX is fully RoHS 3 compliant (2015/863/EU), lead-free, and halogen-free per Diodes' definition: <900ppm bromine, <900ppm chlorine (total Br+Cl <1500ppm), and <1000ppm antimony. The "E" suffix in the part number explicitly denotes Pb-free and Green packaging.
PI4ULS3V4103XEAEX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 1
- Voltage - VCCA:
- 1.1 V ~ 2 V
- Voltage - VCCB:
- 1.65 V ~ 3.6 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Open Drain, Push-Pull
- Data Rate:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-XFQFN
PI4ULS3V4103XEAEX FAQ
1.How can I place an order for PI4ULS3V4103XEAEX through Aetrix?
Please submit a Request for Quotation (RFQ) for PI4ULS3V4103XEAEX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PI4ULS3V4103XEAEX reliable?
The price and inventory of PI4ULS3V4103XEAEX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI4ULS3V4103XEAEX is usually 5 days.
3.What payment methods are accepted for PI4ULS3V4103XEAEX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI4ULS3V4103XEAEX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PI4ULS3V4103XEAEX?
PI4ULS3V4103XEAEX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PI4ULS3V4103XEAEX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PI4ULS3V4103XEAEX?
For technical support, including PI4ULS3V4103XEAEX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI4ULS3V4103XEAEX requirements.
6.How does Aetrix verify that PI4ULS3V4103XEAEX is sourced from the original manufacturer or authorized distributors?
All PI4ULS3V4103XEAEX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI4ULS3V4103XEAEX meets industry standards.
7.What is the process for return or replacement of PI4ULS3V4103XEAEX?
All PI4ULS3V4103XEAEX units undergo pre-shipment inspection (PSI). If there is an issue with PI4ULS3V4103XEAEX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PI4ULS3V4103XEAEX part is unused and in its original packaging.
Return procedure for PI4ULS3V4103XEAEX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PI4ULS3V4103XEAEX Tags
-
74LVC1T45GW,125
Nexperia USA Inc.
-
74LVCH2T45DC,125
Nexperia USA Inc.
-
SN74LVC1T45DBVR
Texas Instruments
-
SN74LVC1T45DRLR
Texas Instruments
-
SN74LVC1T45DPKR
Texas Instruments
-
SN74LVC2T45DCTR
Texas Instruments
-
74LVC2T45GT,115
Nexperia USA Inc.
-
SN74LVC1T45YZPR
Texas Instruments
-
LSF0102DCUR
Texas Instruments
-
SN74LVC1T45DCKR
Texas Instruments
-
TXS0102DCTR
Texas Instruments
-
FXLP34P5X
onsemi
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
