Diodes Incorporated PI5C3253CLE

Overview

PI5C3253CLE from Pericom Semiconductor is a 2-bit, dual-channel analog bus switch with 5 Ω on-resistance, near-zero propagation delay, and –1 V undershoot protection. It operates from 4.5 V to 5.5 V, supports industrial temperature range (–40°C to +85°C), and is used in high-speed data routing between microcontrollers and peripheral buses.

For engineers reviewing the PI5C3253CLE datasheet, PI5C3253CLE pinout, PI5C3253CLE application, or PI5C3253CLE equivalent, key selection criteria include low R_ON, flow-through pinout for PCB layout simplification, ultra-low quiescent current (120 µA), and robust input undershoot tolerance-critical for noise-prone embedded I/O interfaces.

Technical Context

The PI5C3253CLE implements two independent single-pole double-throw (SPDT) analog switches controlled by separate enable inputs (1EN, 2EN). Each channel connects one common terminal (Y) to either of two selectable paths (A or B) with bidirectional signal integrity preserved.

Its CMOS-based switch architecture ensures rail-to-rail analog signal handling, minimal charge injection (<10 pC), and no DC path between ports when disabled. The device avoids ground bounce and adds negligible RC delay-typical time constant is ~0.25 ns into 50 pF load.

Key Specifications

Pinout & Package

PI5C3253CLE is housed in a 16-pin TSSOP package (4.4 mm × 5.0 mm, 0.65 mm pitch) with exposed thermal pad. Pin numbering follows JEDEC MS-012AC standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar analog bus switch applications.

Compared with TS5A23157DGSR and SN74CBT3244CPWR, PI5C3253CLE uniquely balances 5 V compatibility, –1 V ruggedness, and dual independent SPDT control-making it optimal for mixed-signal I/O consolidation where reliability and layout simplicity are prioritized over raw R_ON minimization.

Availability

PI5C3253CLE is available at Aetrix Electronics and suitable for PCI Express lane routing, I²C bus sharing, and GPIO expansion requiring stable component supply across industrial design cycles.

Supply support for PI5C3253CLE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Pericom Semiconductor (acquired by Diodes Incorporated in 2016) specialized in high-speed interface, timing, and signal-integrity solutions for computing, communications, and consumer electronics.

The PI5Cxxx series targets low-latency, low-R_ON analog switching for board-level signal routing-designed specifically to replace mechanical relays and discrete FET muxes in space- and power-constrained embedded systems.

FAQ

What is the maximum continuous current per channel on PI5C3253CLE?

The device supports up to 120 mA DC current per channel, verified under maximum ratings with V_CC = 5.5 V and ambient temperature ≤+85°C. This limit ensures thermal stability and prevents R_ON drift beyond specification. Derating is not required below 85°C, and simultaneous full-load operation on both channels remains within total power dissipation (0.5 W) limits.

Does PI5C3253CLE support bidirectional signal flow?

Yes-each SPDT channel (Y1/A1/B1 and Y2/A2/B2) is fully bidirectional. Signal integrity is preserved in both directions due to symmetrical CMOS switch construction and absence of body diodes. No direction-control pins or external biasing are needed, making it ideal for I²C, SMBus, and other open-drain bidirectional protocols.

Can PI5C3253CLE be used with 3.3 V logic control signals?

No-PI5C3253CLE requires V_CC = 4.5–5.5 V and its enable inputs (1EN, 2EN) are TTL-compatible with V_IH ≥ 2.0 V (min) and V_IL ≤ 0.8 V (max) referenced to its own V_CC. Driving EN pins from a 3.3 V system requires level translation; direct connection risks undefined enable states and increased ICC.

Is there an exposed thermal pad on the TSSOP package?

Yes-the 16-pin TSSOP package (suffix "LE") includes an exposed thermal pad centered on the bottom surface. It must be soldered to a dedicated copper pour tied to GND for optimal thermal performance and to meet the specified 120 µA I_CC and 0.5 W power dissipation ratings. Thermal resistance (θ_JA) drops from 125°C/W (no pad) to 65°C/W with proper pad connection.