Diodes Incorporated PI6C5921512ZDIEX

Overview

PI6C5921512ZDIEX from Diodes Incorporated is a 12-output LVDS fanout buffer with differential inputs, selectable reference inputs (REF_IN0/REF_IN1), up to 1.5 GHz output frequency, ultra-low additive phase jitter (< 0.01 ps RMS at 156.25 MHz, 12 kHz–20 MHz), and separate VDD/VDDO supplies for level shifting-used in high-speed clock distribution for telecom backplanes and network switches.

For engineers reviewing the PI6C5921512ZDIEX datasheet, PI6C5921512ZDIEX pinout, PI6C5921512ZDIEX application, or PI6C5921512ZDIEX equivalent, key selection criteria include input select logic (IN_SEL), LVDS output skew (≤30 ps), propagation delay (620–700 ps), dual supply support (2.5 V / 3.3 V), and industrial temperature range (–40 °C to +85 °C).

Technical Context

The PI6C5921512 operates as a low-jitter clock fanout buffer with dual differential reference inputs multiplexed via IN_SEL, supporting both single-ended and differential clock sources through internal biasing (VREF_AC0/VREF_AC1). It uses separate core (VDD) and output (VDDO) supplies to enable voltage-level translation across LVDS outputs.

Its architecture delivers matched propagation paths across all 12 LVDS output pairs (Q0+/- to Q11+/-), achieving ≤30 ps intra-device output skew and <0.01 ps typical additive jitter. The device includes pulldown/pullup resistors (200 kΩ) on control pins and supports AC- or DC-coupled LVDS, LVPECL, and CMOS inputs per application configurations.

Key Specifications

Pinout & Package

Package: 40-pin TQFN (ZD40), 6 mm × 6 mm, 0.5 mm pitch, exposed thermal pad (to be connected to GND).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LVDS fanout buffer applications.

Compared with IDT8T49N242A and ICS85310AMLF, the PI6C5921512ZDIEX uniquely combines 12 LVDS outputs, dual-selectable inputs, separate VDD/VDDO rails, and sub-0.01 ps jitter - making it optimal for high-density, multi-source, low-phase-noise clock distribution in telecom infrastructure.

Availability

PI6C5921512ZDIEX is available at Aetrix Electronics and suitable for 10G/25G Ethernet switches, optical transport line cards, and high-speed backplane computing requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for PI6C5921512ZDIEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal ICs, with design centers in Asia, Europe, and the U.S., serving industrial, computing, communications, and consumer markets.

The PI6C5921512 belongs to Diodes' high-performance clock buffer product line, engineered specifically for low-jitter, multi-output clock distribution in telecom, datacom, and high-speed computing platforms.

FAQ

What input signal types does the PI6C5921512ZDIEX support?

The device accepts differential inputs (LVDS, LVPECL) and single-ended signals (CMOS, LVTTL) on either REF_IN0 or REF_IN1, using internal biasing via VREF_AC0/VREF_AC1. Single-ended inputs require external resistor dividers to set common-mode voltage near VDD/2, as shown in Figure 1 of DS40090 Rev 1-2.

How is output voltage level controlled on the PI6C5921512ZDIEX?

Output voltage level is determined solely by VDDO supply voltage (2.5 V or 3.3 V), independent of VDD. The LVDS drivers are designed to deliver 200–400 mV differential swing over 100 Ω loads, with VOH = 1.4 V and VOL = 1.0 V referenced to VDDO/2, per DC Electrical Specifications on page 5 of DS40090.

Can the PI6C5921512ZDIEX drive unterminated transmission lines?

No. All 12 LVDS outputs require proper 100 Ω differential termination at the load end to maintain signal integrity and specified jitter performance. The datasheet specifies output characteristics assuming 100 Ω termination (page 5, "LVDS Output Swing vs. Frequency" and "Configuration Test Load Board" on page 9).

What is the function of the thermal pad on the TQFN package?

The exposed thermal pad is electrically connected to GND and must be soldered to a PCB ground plane. It provides primary thermal conduction path (ΘJC = 10.52 °C/W) and reduces junction temperature by ~15 °C under typical operating conditions, directly improving jitter stability and long-term reliability.