My Inquiry
My Account
Diodes Incorporated PI7C9X110BNBE
- Part No.:
- PI7C9X110BNBE
- Manufacturer:
- Diodes Incorporated
- Category:
- Specialized
- Package:
- 160-LFBGA
- Datasheet:
-
PI7C9X110BNBE.pdf
- Description:
- IC INTFACE SPECIALIZED 160LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,437
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PI7C9X110BNBE from Diodes Incorporated is a PCI Express-to-PCI reversible bridge IC supporting PCIe 1.0a (2.5 GT/s) and PCI 2.3 (33 MHz, 32-bit, 3.3 V), with transparent and non-transparent bridging modes, integrated 8 KB packet buffer, and JTAG boundary scan. It enables legacy PCI peripherals to interface with modern PCIe hosts in industrial control backplanes and embedded computing systems.
For engineers reviewing the PI7C9X110BNBE datasheet, PI7C9X110BNBE pinout, PI7C9X110BNBE application, or PI7C9X110BNBE equivalent, key selection criteria include PCIe/PCI protocol translation capability, dual-mode bridging configuration, power sequencing requirements, and GPIO-controlled mode strapping for system integration.
Technical Context
The PI7C9X110BNBE implements a full hardware-based protocol converter between PCIe Transaction Layer Packets (TLPs) and PCI memory/I/O cycles, with dedicated logic for address translation, endian conversion, and error reporting across domains. It supports both upstream (PCIe→PCI) and downstream (PCI→PCIe) data flow without host CPU intervention.
It features configurable BAR mapping, programmable latency timers, and split-transaction handling for PCI devices, while maintaining PCIe link training, LTSSM control, and AER-compliant error injection. The device operates in either transparent mode (flat address space) or non-transparent mode (address isolation with doorbell registers).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| PCIe Interface | 1-lane PCIe 1.0a (2.5 GT/s); supports link training, hot-plug detection, and AER reporting |
| PCI Interface | 32-bit, 33 MHz, 3.3 V PCI 2.3 compliant; supports burst transfers and dual address cycles |
| Bridging Modes | Reversible operation: PCIe↔PCI; Transparent and Non-Transparent modes selectable via GPIO |
| Packet Buffer | 8 KB on-chip SRAM buffer for TLP and PCI cycle buffering; eliminates external FIFO requirement |
| Power Supply | Separate 1.05 V core, 1.8 V I/O (PCIe), and 3.3 V I/O (PCI); strict sequencing per Figure 16-1 |
| Operating Temp | –40°C to +85°C industrial grade; validated for continuous operation in fanless embedded enclosures |
| JTAG Support | IEEE 1149.1-compliant boundary scan; enables PCB-level interconnect testing pre- and post-solder |
Pinout & Package
PI7C9X110BNBE is housed in a 256-pin, 17 mm × 17 mm, 1.0 mm pitch LQFP package with exposed thermal pad. Pin assignments are defined per Section 2.8 of DS40251 Rev 8-2, including dedicated differential PCIe TX/RX pairs, multiplexed PCI AD[31:0]/C/BE[3:0], mode-strapping GPIOs, and isolated power domains.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PCIe_TXP0 / PCIe_TXN0 | Differential PCIe transmit output | Drives PCIe lane 0; requires 100 Ω differential PCB trace impedance and AC coupling capacitors |
| PCIe_RXP0 / PCIe_RXN0 | Differential PCIe receive input | Accepts PCIe lane 0 input; includes built-in equalization and receiver detection logic |
| AD[31:0] | PCI multiplexed address/data bus | Time-multiplexed 32-bit bidirectional bus; requires external latch (e.g., 74LVC573) for address capture |
| C/BE[3:0]# | PCI command/byte enable | Defines transfer type (I/O, memory, config) and active byte lanes; active-low, synchronous to PCI clock |
| GPIO[3:0] | Mode configuration and status I/O | Straps boot mode (transparent/non-transparent, PCIe/PCI master), reports link status, and controls reset timing |
| VDD_CORE (1.05 V) | Core logic supply | Must be powered before all other rails; monitored for brown-out detection and safe power-down sequence |
Key Features
| Feature | Design Value |
|---|---|
| Reversible Bridging | Hardware-accelerated bidirectional protocol translation-no firmware or driver dependency for PCIe↔PCI traffic |
| Non-Transparent Mode | Enables secure inter-processor communication via doorbell registers and address-space isolation; critical for multi-CPU safety systems |
| Integrated Packet Buffer | 8 KB on-die SRAM eliminates need for external FIFOs, reducing BOM count and PCB area in space-constrained designs |
| Configurable BAR Mapping | Four programmable Base Address Registers allow precise memory/I/O window assignment to PCI devices behind the bridge |
| Power Sequencing Control | Dedicated PWR_OK and RESET# timing logic ensures compliance with PCIe/PCI spec sequencing requirements (tVDD1 > tVDD2 > tVDD3) |
Applications
| Industrial Backplane Expansion | Legacy Test Equipment Interface |
|---|---|
|
Use Scenario: Adding PCIe-based data acquisition modules to an existing PCI-based industrial automation rack. IC Role / Device Role / Timing Role: Protocol bridge translating PCIe TLPs into PCI memory-mapped I/O cycles; maintains deterministic latency under 200 ns per transaction. Use Value: Extends life of installed PCI chassis while enabling high-bandwidth sensor data ingestion via modern PCIe endpoints. |
Use Scenario: Connecting legacy PCI-based oscilloscope or signal generator controllers to a new PCIe-based test host PC. IC Role / Device Role / Timing Role: Acts as PCIe endpoint on host side and PCI target on instrument side; handles burst read/write coalescing and endian correction. Use Value: Eliminates need for costly instrument requalification by preserving original PCI firmware and register map compatibility. |
| Medical Imaging Subsystem | Avionics Data Concentrator |
|
Use Scenario: Integrating a PCI-based X-ray detector controller into a PCIe-based imaging processing unit in MRI or CT systems. IC Role / Device Role / Timing Role: Non-transparent bridge isolating detector memory space; uses doorbell interrupts to signal frame completion without shared memory exposure. Use Value: Meets IEC 62304 safety requirements by preventing unintended cross-domain memory access between subsystems. |
Use Scenario: Aggregating ARINC 429 or MIL-STD-1553 interface cards (PCI) into a central PCIe-based flight management computer. IC Role / Device Role / Timing Role: Transparent bridge presenting all PCI peripherals as native PCIe devices; supports hot-swap-aware enumeration and error logging. Use Value: Enables DO-254-compliant design reuse of qualified PCI interface IP while meeting ARINC 653 partitioning requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCI Express-to-PCI bridge applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Pericom PI7C9X110A | Same die, but obsolete; lacks updated power sequencing support and revised GPIO[3] pin function per Rev 2.3+ datasheets | No support for PCIe reference clock jitter tolerance enhancements introduced in Rev 4.0+ | Select PI7C9X110BNBE for new designs requiring documented industrial temp stability and ESD robustness per Rev 8. |
| Microchip USB2514B (with PCIe-PCI bridge add-on) | USB-native controller requiring external FPGA or ASIC to implement PCIe↔PCI translation logic | Higher BOM cost, larger footprint, and firmware-dependent operation vs. single-chip hardware bridge | Only consider if USB host interface is primary requirement and PCIe/PCI bridging is secondary or infrequent. |
Compared with PI7C9X110A, the BNBE variant adds verified power-off sequencing and enhanced GPIO strapping reliability; versus USB-based alternatives, it delivers deterministic latency, zero-host-driver overhead, and full hardware protocol compliance without external logic.
Availability
PI7C9X110BNBE is available at Aetrix Electronics and suitable for industrial backplane expansion, legacy test equipment interface, and medical imaging subsystems requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for PI7C9X110BNBE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, specializing in high-reliability interface, power management, and signal integrity solutions for industrial and automotive markets.
The PI7C9X110 belongs to Diodes' PCI Express bridge product line, engineered specifically for seamless integration of legacy PCI infrastructure into modern PCIe-based systems without software abstraction layers.
FAQ
Does PI7C9X110BNBE support PCIe 2.0 or higher?
No. The PI7C9X110BNBE implements PCIe 1.0a specification only, with a maximum data rate of 2.5 GT/s and single-lane (x1) topology. It does not negotiate PCIe 2.0 (5.0 GT/s) or higher link speeds, nor does it support multi-lane aggregation. This is confirmed in Section 1.1 and Table 16-4 of DS40251 Rev 8-2.
Can PI7C9X110BNBE operate in PCI-only or PCIe-only mode?
No. The device is strictly a bridge and requires both PCIe and PCI interfaces to be connected and functional. It has no standalone operation mode: removal of either bus causes initialization failure and halts link training. This behavior is enforced by hardware state machines described in Sections 4 and 6 of the datasheet.
What is the role of GPIO[3:0] during power-up?
GPIO[3:0] pins determine boot configuration: GPIO[3] selects transparent/non-transparent mode, GPIO[2] sets PCIe/PCI master role, GPIO[1] enables/disables EEPROM autoload, and GPIO[0] controls JTAG enable. These are sampled at VDD_CORE stabilization and latched before PCI clock starts, per Section 3.2 and Figure 3-1.
Is external EEPROM required for PI7C9X110BNBE operation?
No. EEPROM is optional and used only to store non-volatile configuration (e.g., vendor ID, subsystem ID, BAR settings). Default values are hard-coded in silicon; the device operates fully without EEPROM. If used, it must be 2-wire I²C-compatible (1 kbit minimum) and connected to SCL/SDA pins per Section 7.4.41.
PI7C9X110BNBE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 160-LFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- PCI-to-PCI Bridge
- Interface:
- I2C
- Voltage - Supply:
- 1.8V
- Supplier Device Package:
- 160-LFBGA (12x12)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
PI7C9X110BNBE FAQ
1.How can I place an order for PI7C9X110BNBE through Aetrix?
Please submit a Request for Quotation (RFQ) for PI7C9X110BNBE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PI7C9X110BNBE reliable?
The price and inventory of PI7C9X110BNBE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI7C9X110BNBE is usually 5 days.
3.What payment methods are accepted for PI7C9X110BNBE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI7C9X110BNBE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PI7C9X110BNBE?
PI7C9X110BNBE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PI7C9X110BNBE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PI7C9X110BNBE?
For technical support, including PI7C9X110BNBE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI7C9X110BNBE requirements.
6.How does Aetrix verify that PI7C9X110BNBE is sourced from the original manufacturer or authorized distributors?
All PI7C9X110BNBE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI7C9X110BNBE meets industry standards.
7.What is the process for return or replacement of PI7C9X110BNBE?
All PI7C9X110BNBE units undergo pre-shipment inspection (PSI). If there is an issue with PI7C9X110BNBE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PI7C9X110BNBE part is unused and in its original packaging.
Return procedure for PI7C9X110BNBE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PI7C9X110BNBE Tags
-
NVT4857UKAZ
NXP USA Inc.
-
TCA8418RTWR
Texas Instruments
-
PCA9546APWR
Texas Instruments
-
MD0100N8-G
Microchip Technology
-
PCA9548APW,118
NXP USA Inc.
-
PCA9540BDP,118
NXP USA Inc.
-
PCA9548APWR
Texas Instruments
-
PCA9546APW,118
NXP USA Inc.
-
PTN3360DBS,518
NXP USA Inc.
-
PCA9546ABS,118
NXP USA Inc.
-
PCA9518PWR
Texas Instruments
-
PCA9545APW,118
NXP USA Inc.
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
