My Inquiry
My Account
Diodes Incorporated PI7C9X2G304EVAQ2ZXAEX
- Part No.:
- PI7C9X2G304EVAQ2ZXAEX
- Manufacturer:
- Diodes Incorporated
- Category:
- Specialized
- Package:
- 136-VFQFN Dual Rows, Exposed Pad
- Datasheet:
-
PI7C9X2G304EVAQ2ZXAEX.pdf
- Description:
- PACKET SWITCH V-QFN100100-136 T&
- Quantity:
- Payment:
- Shipping:
Inventory:1,452
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PI7C9X2G304EVAQ2ZXAEX from Diodes Incorporated is an AEC-Q100 Grade 2 automotive-qualified PCIe® 2.1 packet switch with 3 ports (1× upstream x1/x2 + 2× downstream x1), 4-lane configuration, <150 ns typical latency, integrated 100 MHz clock buffer per downstream port, and operation from −40°C to +105°C - deployed in ADAS domain controllers and vehicle telematics gateways.
For engineers reviewing the PI7C9X2G304EVAQ2ZXAEX datasheet, PI7C9X2G304EVAQ2ZXAEX pinout, PI7C9X2G304EVAQ2ZXAEX application, or PI7C9X2G304EVAQ2ZXAEX equivalent, key selection criteria include PCIe 2.1 lane topology flexibility, L1.1 sub-state power management (35 mW), AEC-Q100 Grade 2 qualification, and support for ACS, LTR, and OBFF in safety-critical automotive platforms.
Technical Context
This switch implements a cut-through forwarding mode by default (with store-and-forward configurable), enabling sub-150 ns packet latency while maintaining PCIe 2.1 compliance across all ports. It supports full link power states (L0, L0s, L1, L2/L3Ready, L3) and device power states (D0, D3Hot, D3Cold) with 3.3 V auxiliary power retention in D3Cold.
The architecture includes integrated 100 MHz clock buffers for each downstream port, programmable driver current/de-emphasis per port, and hardware-level reliability features: end-to-end CRC, data poisoning, advanced error reporting, and IEEE 1149.1 JTAG debug interface - all validated for automotive-grade thermal and EMI resilience.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| PCIe Specification | Compliant with PCIe Base Spec 2.1 - ensures interoperability with legacy automotive SoCs and MCUs supporting Gen2 signaling. |
| Port Configuration | 1 upstream port (x1 or x2) + 2 downstream ports (x1 each) - enables fan-out from single PCIe root complex to multiple endpoints (e.g., camera, radar, infotainment). |
| Latency | <150 ns typical cut-through latency - critical for real-time ADAS sensor fusion where deterministic timing reduces jitter-induced frame misalignment. |
| Power Consumption | 300 mW typical in L0; 35 mW in PCI-PM L1.1 - enables thermally constrained modules (e.g., junction-box ECUs) to sustain low-power idle without firmware intervention. |
| Temperature Range | −40°C to +105°C ambient - meets under-hood and dashboard mounting requirements per AEC-Q100 Grade 2 qualification. |
| Package | 136-pin aQFN, 10 mm × 10 mm - provides high I/O density with exposed thermal pad for direct PCB heat sinking in compact automotive modules. |
| Clock Buffering | Integrated 100 MHz clock buffer per downstream port - eliminates need for external oscillators or fanout buffers, reducing BOM count and layout complexity. |
Pinout & Package
Package: 136-pin aQFN (10 mm × 10 mm) with exposed thermal pad, RoHS-compliant, halogen-free, and qualified to AEC-Q100 Grade 2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| REFCLK_P/N | Differential reference clock input | Accepts 100 MHz PCIe reference clock; required for link initialization and clock synchronization across all ports. |
| PERST# | PCIe reset signal (active-low) | Hardware reset line asserted during power-on or fault recovery; synchronizes internal state machines across all PCIe lanes. |
| CLKREQ# | Downstream port clock request | Per-port control signal enabling/disabling clock distribution to reduce dynamic power when port is idle. |
| I2C_SDA/SCL | Configuration interface | Two-wire serial bus for runtime register access, enabling dynamic reconfiguration of power states and link training parameters. |
| GPIO[7:0] | General-purpose I/O | Configurable as interrupt outputs or status indicators (e.g., link-up detection, error flagging) for host MCU monitoring. |
Key Features
| Feature | Design Value |
|---|---|
| Cut-through packet forwarding | Enables <150 ns latency path through switch fabric - preserves timing budgets in time-sensitive ADAS sensor aggregation paths. |
| Per-port driver tuning | Programmable output current and de-emphasis per lane - compensates for channel loss variations across different PCB trace lengths in multi-ECU architectures. |
| ACS and SR-IOV support | Enables peer-to-peer traffic isolation and virtualized endpoint sharing - required for consolidated domain controller architectures running multiple OS instances. |
| LTR and OBFF | Provides latency tolerance hints and buffer flush triggers to platform power manager - improves system-wide ASPM coordination in multi-domain automotive gateways. |
| End-to-end CRC + data poisoning | Detects and flags corrupted packets at egress - prevents propagation of invalid sensor data in safety-critical ADAS decision loops. |
Applications
| ADAS Domain Controller | Vehicle Telematics Gateway |
|---|---|
Use Scenario: Aggregating camera, radar, and ultrasonic sensor data streams into a centralized processing unit for real-time object detection and path planning. IC Role / Device Role / Timing Role: PCIe 2.1 packet switch providing deterministic low-latency interconnect between heterogeneous sensors and AI accelerator SoC. Use Value: Sub-150 ns cut-through latency ensures synchronized timestamp alignment across sensor inputs, reducing motion blur artifacts in fused perception models. | Use Scenario: Bridging cellular modem, Wi-Fi 6 AP, and OTA update controller to a central automotive application processor via shared PCIe root complex. IC Role / Device Role / Timing Role: Fan-out switch enabling concurrent high-bandwidth communication channels without CPU intervention or software arbitration. Use Value: Integrated 100 MHz clock buffers eliminate external timing components, reducing BOM cost and board area in space-constrained gateway modules. |
| In-Vehicle Wireless Router | V2X Communication Module |
Use Scenario: Supporting simultaneous 5G NR, DSRC, and Wi-Fi 6 connectivity in premium vehicle cabins with QoS-aware traffic routing. IC Role / Device Role / Timing Role: PCIe switch managing bandwidth allocation and priority queuing across multiple wireless interface ICs. Use Value: ACS support isolates peer-to-peer traffic between modems, preventing interference during concurrent firmware updates and live streaming. | Use Scenario: Enabling secure, low-latency exchange of cooperative awareness messages between adjacent vehicles and roadside units in V2V/V2I applications. IC Role / Device Role / Timing Role: Deterministic PCIe interconnect layer ensuring sub-millisecond message handoff between GNSS, IMU, and V2X transceiver ICs. Use Value: AEC-Q100 Grade 2 qualification guarantees stable operation at 105°C ambient - essential for under-bumper V2X module placement near exhaust systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCIe 2.1 packet switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Microchip LAN9668 | 8-port Ethernet switch with PCIe 2.1 upstream; no native PCIe downstream ports - requires bridge ICs for PCIe endpoint connectivity. | Targets Ethernet-centric gateways; lacks native PCIe fan-out capability for sensor-rich ADAS stacks. | Select when primary interconnect is Ethernet-based and PCIe is only needed for host uplink - not for multi-sensor PCIe endpoint expansion. |
| NXP S32G399A | Automotive MPU with integrated PCIe 2.1 switch (2-port), but fixed topology and no configurable upstream/downstream lane assignment. | Best suited for tightly coupled compute+switch integration; cannot replace discrete fan-out switches in modular ECU designs. | Select when system consolidation is prioritized over flexibility - not for scalable, field-upgradable sensor hub architectures. |
Compared with LAN9668 and S32G399A, PI7C9X2G304EVAQ2ZXAEX delivers dedicated, configurable PCIe 2.1 fan-out with AEC-Q100 Grade 2 validation, making it uniquely suitable for modular ADAS sensor hubs requiring deterministic latency, per-port power gating, and independent clock buffering.
Availability
PI7C9X2G304EVAQ2ZXAEX is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, telematics gateways, and V2X communication modules requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant sourcing.
Supply support for PI7C9X2G304EVAQ2ZXAEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, specializing in high-reliability solutions for automotive, industrial, and computing markets - ISO/TS 16949 certified with focus on AEC-Q100-qualified components.
The PI7C9X2G304EVAQ2ZXAEX belongs to Diodes' automotive PCIe switch product line, engineered specifically for deterministic, low-power, thermally robust interconnect in next-generation domain controller and vehicle gateway architectures.
FAQ
Does PI7C9X2G304EVAQ2ZXAEX support PCIe 3.0?
No. The device is compliant only with PCIe Base Specification Revision 2.1 (5 GT/s). It does not support PCIe 3.0 (8 GT/s) signaling, equalization, or protocol extensions. Systems requiring Gen3 bandwidth must select alternate switches such as Diodes' PI7C9X2G604EVQ or Microchip's Switchtec PFX series.
Can PI7C9X2G304EVAQ2ZXAEX operate without an external EEPROM?
Yes. The device supports pin-strapped default configuration and can boot using factory-programmed registers. An external EEPROM is optional and used only when custom configuration (e.g., vendor ID, subsystem ID, or advanced power settings) is required beyond default values.
What thermal management provisions exist for the 136-pin aQFN package?
The package includes an exposed thermal pad on the bottom surface, designed for solder attachment to a large copper pour on the PCB. Diodes recommends ≥4 thermal vias (0.3 mm diameter) connecting the pad to inner-layer ground planes to achieve ≤35°C/W junction-to-board thermal resistance under typical automotive airflow conditions.
Is JTAG debugging supported in automotive runtime environments?
Yes. IEEE 1149.1 JTAG is fully implemented and accessible via dedicated TCK/TMS/TDI/TDO pins. It remains functional across all power states (including D3Hot) and supports boundary-scan testing, register read/write, and debug trace - validated for use in production diagnostics and field failure analysis per ISO 26262 ASIL-B workflows.
PI7C9X2G304EVAQ2ZXAEX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 136-VFQFN Dual Rows, Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Packet Switch, 3-Port/4-Lane
- Interface:
- Bus, I2C, JTAG, PCI Express, SMBus
- Voltage - Supply:
- 0.95V ~ 1.1V
- Supplier Device Package:
- 136-aQFN (10x10)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
PI7C9X2G304EVAQ2ZXAEX FAQ
1.How can I place an order for PI7C9X2G304EVAQ2ZXAEX through Aetrix?
Please submit a Request for Quotation (RFQ) for PI7C9X2G304EVAQ2ZXAEX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PI7C9X2G304EVAQ2ZXAEX reliable?
The price and inventory of PI7C9X2G304EVAQ2ZXAEX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI7C9X2G304EVAQ2ZXAEX is usually 5 days.
3.What payment methods are accepted for PI7C9X2G304EVAQ2ZXAEX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI7C9X2G304EVAQ2ZXAEX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PI7C9X2G304EVAQ2ZXAEX?
PI7C9X2G304EVAQ2ZXAEX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PI7C9X2G304EVAQ2ZXAEX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PI7C9X2G304EVAQ2ZXAEX?
For technical support, including PI7C9X2G304EVAQ2ZXAEX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI7C9X2G304EVAQ2ZXAEX requirements.
6.How does Aetrix verify that PI7C9X2G304EVAQ2ZXAEX is sourced from the original manufacturer or authorized distributors?
All PI7C9X2G304EVAQ2ZXAEX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI7C9X2G304EVAQ2ZXAEX meets industry standards.
7.What is the process for return or replacement of PI7C9X2G304EVAQ2ZXAEX?
All PI7C9X2G304EVAQ2ZXAEX units undergo pre-shipment inspection (PSI). If there is an issue with PI7C9X2G304EVAQ2ZXAEX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PI7C9X2G304EVAQ2ZXAEX part is unused and in its original packaging.
Return procedure for PI7C9X2G304EVAQ2ZXAEX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PI7C9X2G304EVAQ2ZXAEX Tags
-
NVT4857UKAZ
NXP USA Inc.
-
TCA8418RTWR
Texas Instruments
-
PCA9546APWR
Texas Instruments
-
MD0100N8-G
Microchip Technology
-
PCA9548APW,118
NXP USA Inc.
-
PCA9540BDP,118
NXP USA Inc.
-
PCA9548APWR
Texas Instruments
-
PCA9546APW,118
NXP USA Inc.
-
PTN3360DBS,518
NXP USA Inc.
-
PCA9546ABS,118
NXP USA Inc.
-
PCA9518PWR
Texas Instruments
-
PCA9545APW,118
NXP USA Inc.
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
