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Diodes Incorporated PI7C9X3G606GPQ3FCAEX

Part No.:
PI7C9X3G606GPQ3FCAEX
Manufacturer:
Diodes Incorporated
Category:
Specialized
Package:
144-LFBGA
Datasheet:
AetrixPI7C9X3G606GPQ3FCAEX.pdf
Description:
PACKET SWITCH FC-LFBGA100100-144
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,269

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Product details

Overview

PI7C9X3G606GPQ3FCAEX from Diodes Incorporated is an AEC-Q100 Grade 3 automotive PCIe 3.0 packet switch with 6 ports and 6 lanes, supporting ≤150 ns typical packet forwarding latency, 7 power states (P0–P1.2PG), and integrated PCIe Gen3 clock buffer for downstream ports. It enables zonal ECU interconnect, ADAS sensor fusion, and multi-host failover via up to 3 Cross-Domain End-Point (CDEP) ports in automotive central controller architectures.

For engineers reviewing the PI7C9X3G606GPQ3FCAEX datasheet, PI7C9X3G606GPQ3FCAEX pinout, PI7C9X3G606GPQ3FCAEX application, or PI7C9X3G606GPQ3FCAEX equivalent, key selection criteria include PCIe 3.0 lane bifurcation support, RAS features (end-to-end ECC, DPC, surprise hot removal), CDEP port configurability, and FC LFBGA-144 thermal performance at −40°C to +85°C.

Technical Context

This switch implements full PCIe 3.0 protocol stack (PHY, Data Link, Transaction layers) with adaptive CTLE/5-tap DFE RX equalization and 3-tap programmable TX equalization to maintain signal integrity over >30 dB channel loss. It supports elastic bifurcation, configurable upstream (up to 2 ports) and downstream (up to 15 ports) topologies, and dual-clock modes (Base/CDSR).

The device integrates side-band interfaces including I²C/SMBus, SPI EEPROM, and IEEE 1149.1/1149.6 JTAG for configuration and diagnostics. Its RAS architecture delivers classified error reporting (correctable/non-fatal/fatal), end-to-end data protection, and Downstream Port Containment (DPC) for automotive safety-critical domains.

Key Specifications

ParameterValue and Actual Design Meaning
PCIe GenerationGen3 compliant per PCI Express Base Spec 3.1; enables 8 GT/s per lane with SSC isolation on up to 3 ports.
Ports / Lanes6 configurable ports, 6 total lanes; supports 1×6, 2×3, or 3×2 upstream/downstream splits for zonal topology flexibility.
Latency<150 ns typical cut-through forwarding; critical for real-time ADAS sensor data aggregation and low-jitter cockpit control.
Power States7 defined states (P0/P0s/P1/P1.1/P1.2/P2/P1.2PG); ASPM L1 sub-states (P1.1/P1.2) reduce idle-link power in telematics gateways.
Operating Temp−40°C to +85°C ambient; qualified to AEC-Q100 Grade 3 for under-hood and cabin-mounted ECUs.
Clock ArchitectureIntegrated Gen3 clock buffer with Common/SRNS/SRIS reference structures; eliminates external clock IC in infotainment head units.
RAS FeaturesEnd-to-end ECC, Downstream Port Containment (DPC), surprise hot removal, and serial host plug type for field-upgradable modules.

Pinout & Package

Package: FC LFBGA (FCA144), 144-pin Fine-Pitch Chip-Scale Package, 10 mm × 10 mm, MSL-3, lead-free and halogen-free.

Pin/TerminalCircuit RoleDesign Meaning
CLK_IN[0:1]Reference Clock InputDual differential input for PCIe reference clocks; supports SRIS/SSC isolation and automatic clock selection.
PERST#PCIe ResetActive-low global reset; synchronized across all ports to ensure deterministic initialization in multi-host systems.
PRSNT#_0–5Hot-Plug Presence DetectIndividual presence pins per downstream port; enable safe surprise removal detection per AEC-Q100 requirements.
SCL/SDAI²C/SMBus InterfaceTwo-wire interface for runtime configuration of power states, link training, and RAS registers without JTAG.
TCK/TMS/TDO/TDIJTAG Boundary ScanIEEE 1149.1-compliant test access port; supports PRBS loopback, PHY Eye™ calibration, and MAC Viewer™ diagnostics.

Key Features

FeatureDesign Value
Cross-Domain End-Point (CDEP)Up to 3 configurable CDEP ports enable secure host-to-host communication and failover routing between zonal controllers without external fabric switches.
Adaptive Equalization5-tap DFE + CTLE RX and 3-tap TX feed-forward equalizer compensate >30 dB channel loss-enabling 20+ cm PCB trace lengths in vehicle harnesses.
Performance VisibilityPer-port ingress/egress packet counters and timer-based statistics support real-time bandwidth monitoring for OTA update scheduling in telematics ECUs.
Thermal SensorOn-die temperature monitor reports operational junction temperature via SMBus; triggers thermal throttling before exceeding +125°C Tj max.
OBFF/LTR SupportOptimized Buffer Flush Fill and Latency Tolerance Reporting reduce wake latency in infotainment SoC sleep states, improving system-level power efficiency.

Applications

Zonal Central ControllerADAS Sensor Fusion Hub

Use Scenario: Aggregating Ethernet, CAN FD, and PCIe endpoints across vehicle zones into a centralized domain controller.

IC Role / Device Role / Timing Role: PCIe 3.0 packet switch managing traffic between SoCs, AI accelerators, and storage; provides deterministic latency and CDEP-based inter-host arbitration.

Use Value: Eliminates need for discrete PCIe bridges and reduces BOM count by integrating clock buffering, RAS, and failover routing in one AEC-Q100-qualified device.

Use Scenario: Consolidating camera, radar, and lidar sensor data streams into a single processing unit for real-time object detection.

IC Role / Device Role / Timing Role: Low-latency (<150 ns) cut-through switch enabling time-synchronized ingestion of multi-modal sensor payloads into AI SoCs.

Use Value: Maintains sub-150 ns jitter across 6-lane links even after 30 dB channel loss-critical for frame-aligned sensor fusion timing.

Telematics Control UnitCockpit Domain Controller

Use Scenario: Connecting cellular modem, GNSS receiver, and eSIM to application processor while supporting OTA firmware updates.

IC Role / Device Role / Timing Role: PCIe 3.0 switch with ASPM L1.1/L1.2 power gating and OBFF; manages bursty data transfers with minimal wake latency.

Use Value: Reduces average power by 37% vs. legacy Gen2 switches during LTE/5G idle periods-extending battery-backed operation in emergency call modules.

Use Scenario: Interconnecting digital cluster, HUD, and infotainment head unit SoCs in a unified cockpit domain with shared GPU and memory resources.

IC Role / Device Role / Timing Role: Multi-host PCIe switch with up to 8 DMA channels and CDEP ports enabling peer-to-peer GPU memory sharing and display pipeline synchronization.

Use Value: Enables simultaneous rendering across three displays with <5 µs inter-SoC latency-meeting ISO 26262 ASIL-B timing constraints.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe 3.0 packet switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Microchip LAN96688-port Ethernet switch with integrated PCIe 2.1 bridge; no native PCIe 3.0 switching or CDEP capability.Targeted at Ethernet-centric gateways; lacks PCIe lane aggregation and RAS features required for ADAS compute consolidation.Select only if primary interface is 10/100/1000BASE-T and PCIe is secondary; not suitable for PCIe-native zonal architectures.
NXP S32G399AAutomotive MCU with integrated PCIe 3.0 root complex (not switch); supports only 1 upstream port and no downstream port expansion.Designed for gateway SoC integration-not for multi-host, multi-endpoint PCIe fabric extension.Choose when PCIe endpoint connectivity is fixed and centralized; avoid when scalable port count or CDEP failover is required.

Compared with LAN9668 and S32G399A, PI7C9X3G606GPQ3FCAEX uniquely delivers native PCIe 3.0 switching with 6 configurable ports, CDEP-enabled host-to-host communication, and AEC-Q100 Grade 3 RAS-making it the only solution for scalable, safety-certifiable PCIe fabrics in next-gen zonal ECUs.

Availability

PI7C9X3G606GPQ3FCAEX is available at Aetrix Electronics and suitable for zonal central controllers, ADAS sensor fusion hubs, and telematics control units requiring stable component supply, AEC-Q100 compliance, and long-term automotive lifecycle support.

Supply support for PI7C9X3G606GPQ3FCAEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, specializing in high-reliability solutions for automotive, industrial, and computing markets.

The PI7C9X3G Automotive PCIe 3.0 Packet Switch product line was engineered specifically for zonal ECU architectures-delivering RAS, multi-host CDEP, and signal integrity robustness required in ADAS, central controller, and telematics applications.

FAQ

What is the maximum number of endpoints supported by PI7C9X3G606GPQ3FCAEX?

The device supports up to 15 PCIe endpoints, including SSDs, AI accelerators, and sensor SoCs. This is achieved through its 6-port architecture with elastic bifurcation-allowing flexible allocation of lanes across downstream ports while maintaining full PCIe 3.0 compliance and sub-150 ns forwarding latency.

Does PI7C9X3G606GPQ3FCAEX support PCIe 4.0 or higher?

No. PI7C9X3G606GPQ3FCAEX is strictly compliant with PCI Express Base Specification Revision 3.1 (Gen3). It does not support Gen4 signaling rates (16 GT/s) or associated features such as PAM4 encoding, FLIT mode, or updated LTSSM states. Its design targets automotive Gen3 ecosystems where signal integrity over long harness traces is prioritized over raw bandwidth.

How is thermal management implemented in this device?

Thermal management uses an on-die temperature sensor reporting junction temperature via SMBus/I²C. When temperature exceeds configurable thresholds, the device initiates thermal throttling-including dynamic reduction of TX swing and equalization settings-to maintain operation within −40°C to +85°C ambient while preventing permanent damage above +125°C junction temperature.

Can PI7C9X3G606GPQ3FCAEX be used in non-automotive applications?

While functionally capable in industrial or computing environments, PI7C9X3G606GPQ3FCAEX is qualified only to AEC-Q100 Grade 3 and manufactured in IATF 16949-certified facilities. Its RAS features, extended temperature range, and automotive-specific validation (e.g., DPC, surprise hot removal) are optimized for vehicle use-making it unsuitable for commercial-grade deployments where cost or qualification overhead is prohibitive.

PI7C9X3G606GPQ3FCAEX Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
144-LFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
Packet Switch, 6-Port/6-Lane
Interface:
PCI Express
Voltage - Supply:
-
Supplier Device Package:
144-FC-LFBGA (10x10)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount

PI7C9X3G606GPQ3FCAEX FAQ

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Please submit a Request for Quotation (RFQ) for PI7C9X3G606GPQ3FCAEX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PI7C9X3G606GPQ3FCAEX reliable?

The price and inventory of PI7C9X3G606GPQ3FCAEX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI7C9X3G606GPQ3FCAEX is usually 5 days.

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PI7C9X3G606GPQ3FCAEX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PI7C9X3G606GPQ3FCAEX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PI7C9X3G606GPQ3FCAEX?

For technical support, including PI7C9X3G606GPQ3FCAEX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI7C9X3G606GPQ3FCAEX requirements.

6.How does Aetrix verify that PI7C9X3G606GPQ3FCAEX is sourced from the original manufacturer or authorized distributors?

All PI7C9X3G606GPQ3FCAEX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI7C9X3G606GPQ3FCAEX meets industry standards.

7.What is the process for return or replacement of PI7C9X3G606GPQ3FCAEX?

All PI7C9X3G606GPQ3FCAEX units undergo pre-shipment inspection (PSI). If there is an issue with PI7C9X3G606GPQ3FCAEX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PI7C9X3G606GPQ3FCAEX part is unused and in its original packaging.

Return procedure for PI7C9X3G606GPQ3FCAEX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

PI7C9X3G606GPQ3FCAEX Tags

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