Diodes Incorporated PI7C9X3G816GPBHFCE

Overview

PI7C9X3G816GP from Diodes Incorporated is an 8-port, 16-lane PCI Express Gen 3 packet switch with integrated reference clock buffer, supporting up to 8 GT/s per lane, full non-blocking switching fabric, and hot-plug capability. It operates in Base (fan-out) and Cross-Domain End-Point modes, enabling PCIe topology expansion in server backplanes and storage controllers.

For engineers reviewing the PI7C9X3G816GP datasheet, PI7C9X3G816GP pinout, PI7C9X3G816GP application, or PI7C9X3G816GP equivalent, key selection criteria include lane mapping flexibility (x1/x2/x4/x8 configurations), SMBus/I²C configuration interface, DMA-assisted cross-domain memory access, and support for surprised parallel/serial hot-plug sequences per PCIe specification rev 3.0.

Technical Context

The device implements a full PCIe Gen 3 transaction layer (TLP encapsulation/decapsulation), data link layer (ACK/NAK, flow control), and physical layer with 16 SerDes lanes distributed across eight configurable ports. It supports both root complex–to–endpoint and endpoint–to–endpoint routing via programmable address translation tables.

Its cross-domain end-point mode enables transparent BAR remapping between host domains using Direct Address Translation (DAT) and Address Look-Up Translation (ALUT), while integrated DMA engines handle local-to-remote domain memory transfers without CPU intervention - critical for low-latency storage and accelerator interconnects.

Key Specifications

Pinout & Package

PI7C9X3G816GP is housed in a 256-pin, 17 mm × 17 mm, 0.8 mm pitch LFBGA package with exposed thermal pad. Pin functions are grouped into PCIe differential pairs (TX/RX), configuration strapping (MODE[2:0], CLKREQ#), hot-plug control (PRSNT#, WAKE#), reference clock outputs (REFCLKOUT[1:0]), sideband management (SMBCLK/SMBDAT, I2C_SCL/I2C_SDA), and power domains (VCCIO, VCCA, VCCPLL).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe Gen 3 switch applications.

Compared with ASM1083 and PEX8747, PI7C9X3G816GP delivers optimal balance of lane count, power efficiency (5.8W typical), and feature set for mid-tier PCIe expansion - especially where cross-domain DMA and integrated clocking reduce system-level component count and layout risk.

Availability

PI7C9X3G816GP is available at Aetrix Electronics and suitable for server backplane expansion, enterprise NVMe storage chassis, and GPU/CPU co-processing interconnects requiring stable component supply and long-term industrial lifecycle support.

Supply support for PI7C9X3G816GP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, headquartered in California, with design centers across Asia and manufacturing in Taiwan, China, and Malaysia.

The PI7C9X3G series targets PCIe infrastructure applications, delivering cost-optimized, low-power packet switches for storage, computing, and industrial edge systems requiring Gen 3 performance and robust hot-plug operation.

FAQ

Does PI7C9X3G816GP support PCIe Gen 4?

No. The device is specified exclusively for PCIe Gen 3 (8 GT/s) operation. Its SerDes PHY, equalization settings, and compliance testing are limited to Gen 3 electrical specifications. Attempting Gen 4 signaling results in link training failure or unstable operation.

Can PI7C9X3G816GP operate without an external EEPROM?

Yes. Strapping pins (MODE[2:0]) allow boot into default configuration without EEPROM. However, full functionality - including custom port mapping, cross-domain settings, and SMBus address assignment - requires EEPROM programming per Diodes' recommended initialization flow.

What thermal management is required for continuous operation?

The device requires a minimum 4-layer PCB with dedicated thermal vias under the exposed pad and ≥250 mm² copper pour on inner layers. At 5.8W typical power dissipation, junction temperature remains below 105°C with 40°C ambient and 200 LFM airflow - validated per JEDEC JESD51-2.

Is JTAG boundary scan supported for production testing?

Yes. Pins TCK, TMS, TDI, TDO, and TRST# implement IEEE 1149.1-compliant boundary scan. Diodes provides BSDL files and test patterns for structural interconnect testing and I/O pin verification during board assembly.