Microchip Technology PM5326-FEI
- Part No.:
- PM5326-FEI
- Manufacturer:
- Microchip Technology
- Category:
- Telecom
- Package:
- -
- Datasheet:
-
PM5326-FEI.pdf
- Description:
- IC TELECOM INTERFACE 1292FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
PM5326-FEI from PMC-Sierra is a dual SONET/SDH framer/aggregator IC designed for OC-48 and OC-192 transport layer systems, delivering 20 Gbit/s aggregate capacity with independent STS-192/STM-64 or quad STS-48/STM-16 configuration per framer, supporting SFI-4 LVDS interfaces at 16 × 622 Mbit/s, and enabling channelized STS-1 to concatenated STS-3c×N traffic grooming in MSPP and DWDM line cards.
For engineers reviewing the PM5326-FEI datasheet, PM5326-FEI pinout, PM5326-FEI application, or PM5326-FEI equivalent, key selection considerations include dual-framer configurability, ESSI-based APS interface support, STS-1 granularity pointer processing, B1/B2/B3 error detection, and 1292-pin FCBGA package compatibility with high-density optical line card layouts.
Technical Context
The PM5326-FEI integrates two independent framer cores, each supporting either one STS-192/STM-64 stream or four STS-48/STM-16 streams via OIF SFI-4 interfaces operating at 622 MHz (16-bit LVDS). It implements full SONET/SDH Section, Line, and Path overhead termination with STS-1 frame alignment and pointer processing.
It provides dual sets of working/protect/APS interfaces using four 2.488 Gbit/s ESSI RASIO 3G links per set, supports in-band status messaging over ESSI ports, and includes dedicated STS-1 Memory Switching Units for TSI/muxing in both main and DROP APS paths - enabling local traffic termination and line-card pairing without external switching fabric.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Aggregate Capacity | 20 Gbit/s total throughput across two independent framers |
| Framer Configuration | Each framer supports one STS-192/STM-64 OR four STS-48/STM-16 streams |
| SFI-4 Interface | Dual 16-bit LVDS @ 622 MHz (16 × 622 Mbit/s) per framer |
| ESSI APS Interface | Two independent sets, each with four 2.488 Gbit/s RASIO 3G links |
| Overhead Processing | Full TOH/LOH/POH termination, STS-1 alignment, B1/B2/B3 BIP-8 error detection |
| Power Supply | 1.2 V core, 2.5 V or 3.3 V I/O compatible |
| Package | 1292-pin Fine-Pitch Ball Grid Array (FCBGA) |
Pinout & Package
PM5326-FEI is housed in a 1292-pin Fine-Pitch Ball Grid Array (FCBGA) package with 35 × 35 mm body size, 0.8 mm ball pitch, and thermal lid for high-power SONET/SDH transport applications. Pin functions are organized into SFI-4 data/control banks, ESSI APS link groups, DCC extraction/insertion terminals, and JTAG test access.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SFI4_TX[15:0] | OIF SFI-4 Transmit Data Bus | 16-bit LVDS output driving SERDES or CRU/CSU at 622 MHz per bit |
| SFI4_RX[15:0] | OIF SFI-4 Receive Data Bus | 16-bit LVDS input from SERDES or CRU/CSU, supporting nibble-mode for STS-48 aggregation |
| ESSI_W1[3:0]_TX/RX | Working ESSI Link Group 1 | Four 2.488 Gbit/s RASIO 3G differential pairs for APS working path |
| ESSI_P1[3:0]_TX/RX | Protect ESSI Link Group 1 | Four 2.488 Gbit/s RASIO 3G differential pairs for APS protect path |
| DCC_SEC_LIN_EX | Section/Line DCC Extract | Dedicated pins to extract DCC bytes from section/line overhead for monitoring |
| TOH_INS[7:0] | Transport Overhead Insert | 8-bit parallel bus to reinsert modified TOH bytes including B1, B2, M0/M1, J0 |
Key Features
| Feature | Design Value |
|---|---|
| Dual Independent Framers | Enables simultaneous OC-192 line-side aggregation and OC-48 system-side grooming without shared resource contention |
| STS-1 Memory Switching Unit (MSU) | Provides time-slot interchange and multiplexing in both transmit/receive directions plus dedicated DROP APS MSU for local traffic termination |
| Automatic Protection Switching (APS) | Hardware-accelerated K1/K2 byte filtering, BER monitoring, and direct line-card APS port connectivity without host CPU intervention |
| In-Band Status Messaging | Transports Transport/Path/Equipment Status over ESSI ports, eliminating need for separate management channels |
| Overhead Transparency & Remapping | Full TOH passthrough with selective remapping of B1, B2, M0/M1, J0 bytes for network interoperability and traceability |
Applications
| Multi-Service Provisioning Platform (MSPP) | Add/Drop Multiplexer (ADM) |
|---|---|
Use Scenario: Aggregating multiple OC-48 tributaries into OC-192 line rates while performing channelized STS-1 grooming and APS switching. IC Role / Device Role / Timing Role: Dual-framer transport layer aggregator with embedded MSU and APS controller. Use Value: Eliminates external TSI and APS logic, reducing board area and power by consolidating framing, switching, and protection in one IC. | Use Scenario: Supporting bidirectional OC-192 line interfaces with independent working/protect paths and local drop/insert capability. IC Role / Device Role / Timing Role: SONET/SDH framer with dual ESSI APS ports and DROP APS MSU for traffic localization. Use Value: Enables line-card pairing and local service termination without requiring backplane cross-connect fabric. |
| Sub-Wavelength Cross Connect | DWDM Terminal Multiplexer |
Use Scenario: Providing granular STS-1–based sub-wavelength switching between OC-48 and OC-192 domains. IC Role / Device Role / Timing Role: STS-1 granularity frame aligner and pointer processor with automatic traffic configuration detection. Use Value: Supports dynamic reconfiguration of concatenated vs. arbitrarily concatenated (STS-3c×N) payloads without firmware reload. | Use Scenario: Interfacing with DWDM transponders via SFI-4 while extracting DCC and TOH for network management. IC Role / Device Role / Timing Role: Transport overhead extractor/insertor with dedicated DCC and TOH pins. Use Value: Enables in-band telemetry and fault isolation without compromising line rate or adding external overhead processors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SONET/SDH framer/aggregator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PM5376-TSE Nx160 | Single-framer architecture; supports up to 160 Gbit/s via 10× OC-192 lanes; no dual APS ESSI sets | Targeted at higher-density metro core platforms; lacks integrated DROP APS MSU | Preferred when scaling beyond dual OC-192 with centralized switching fabric |
| PM5377-TSE 240 | 240 Gbit/s aggregate; adds OTN mapping (OTU2/OTU2e); requires external timing recovery | Supports hybrid SONET/SDH + OTN transport; not pin-compatible with PM5326-FEI | Chosen for next-gen DWDM systems requiring OTN encapsulation alongside legacy SONET |
Compared with PM5326-FEI, PM5376-TSE Nx160 offers higher lane count but less on-die APS flexibility, while PM5377-TSE 240 adds OTN capability at the cost of increased complexity and no native STS-1 MSU for local grooming - making PM5326-FEI optimal for OC-48/OC-192 MSPP and ADM line cards requiring embedded protection and traffic localization.
Availability
PM5326-FEI is available at Aetrix Electronics and suitable for Multi-Service Provisioning Platforms (MSPP), Add/Drop Multiplexers (ADM), and DWDM terminal equipment requiring stable component supply, long-lifecycle support, and qualified optical transport silicon.
Supply support for PM5326-FEI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
PMC-Sierra (now part of Microsemi, acquired by Microchip Technology) was a fabless semiconductor company specializing in storage, optical networking, and mobile infrastructure ICs, headquartered in Sunnyvale, CA.
The PM5326-FEI belongs to PMC-Sierra's ARROW family of SONET/SDH transport framers, engineered specifically for high-reliability, low-latency optical line cards in carrier-grade MSPP and ADM systems.
FAQ
What is the primary function of the PM5326-FEI in optical transport systems?
The PM5326-FEI serves as a dual SONET/SDH framer and aggregator, enabling OC-48 and OC-192 line-rate processing with independent configuration per framer. It performs full overhead termination, STS-1 alignment, pointer processing, and APS control. The PM5326-FEI integrates memory switching units for traffic grooming and supports ESSI-based protection switching - all critical for carrier-grade MSPP and ADM applications.
Does the PM5326-FEI support both SONET and SDH standards simultaneously?
Yes, the PM5326-FEI natively supports both SONET (STS-192/STS-48) and SDH (STM-64/STM-16) framing formats within the same hardware. It detects and adapts to traffic configuration changes automatically, including concatenated and arbitrarily concatenated (STS-3c×N) modes. The PM5326-FEI processes section, line, and path overhead identically across both standards, ensuring interoperability in mixed-network deployments.
How does the PM5326-FEI handle Automatic Protection Switching (APS)?
The PM5326-FEI implements hardware-based APS using two independent ESSI port sets (W1/P1 and W2/P2), each with four 2.488 Gbit/s RASIO 3G links. It performs K1/K2 byte filtering, BER monitoring, and alarm reporting (SD/SF) without host CPU involvement. The PM5326-FEI also supports direct line-card APS connections and in-band status messaging over ESSI, simplifying system-level protection architecture.
What package type and pin count does the PM5326-FEI use?
The PM5326-FEI is packaged in a 1292-pin Fine-Pitch Ball Grid Array (FCBGA) with 35 × 35 mm body size and 0.8 mm ball pitch. This package supports high-speed signal integrity for dual SFI-4 interfaces and multiple ESSI differential pairs. Thermal design includes an integrated lid, and pin assignments are grouped by functional domain - SFI-4, ESSI APS, DCC/TOH, and JTAG - to simplify PCB layout for optical line cards.
Can the PM5326-FEI operate in line-to-line pass-through mode?
Yes, the PM5326-FEI supports line-to-line mode where SFI-4 receive streams are routed directly to SFI-4 transmit outputs, enabling OC-192 or OC-48 passthrough. In this mode, it can still independently add/drop traffic to/from working and protect system interfaces using its STS-1 MSUs. The PM5326-FEI maintains full overhead transparency and APS functionality during pass-through, making it suitable for transparent regenerators and wavelength-aware muxponders.
PM5326-FEI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Function:
- SONET/SDH
- Interface:
- SFI-4
- Number of Circuits:
- -
- Voltage - Supply:
- 1.2V
- Current - Supply:
- -
- Power (Watts):
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1292-FCBGA
PM5326-FEI FAQ
1.How can I place an order for PM5326-FEI through Aetrix?
Please submit a Request for Quotation (RFQ) for PM5326-FEI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PM5326-FEI reliable?
The price and inventory of PM5326-FEI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PM5326-FEI is usually 5 days.
3.What payment methods are accepted for PM5326-FEI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PM5326-FEI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PM5326-FEI?
PM5326-FEI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PM5326-FEI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PM5326-FEI?
For technical support, including PM5326-FEI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PM5326-FEI requirements.
6.How does Aetrix verify that PM5326-FEI is sourced from the original manufacturer or authorized distributors?
All PM5326-FEI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PM5326-FEI meets industry standards.
7.What is the process for return or replacement of PM5326-FEI?
All PM5326-FEI units undergo pre-shipment inspection (PSI). If there is an issue with PM5326-FEI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PM5326-FEI part is unused and in its original packaging.
Return procedure for PM5326-FEI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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