Microchip Technology PM5326H-FI

Overview

PM5326H-FI from PMC-Sierra is a dual SONET/SDH framer/aggregator IC designed for OC-192/STM-64 and OC-48/STM-16 transport layer systems, delivering 20 Gbit/s aggregate capacity, supporting two independent SFI-4 interfaces (16-bit 622 MHz LVDS), and enabling STS-1 granularity pointer processing and BIP-8 error detection in telecom line cards.

For engineers reviewing the PM5326H-FI datasheet, PM5326H-FI pinout, PM5326H-FI application, or PM5326H-FI equivalent, this device serves as a high-density framer/aggregator for channelized, concatenated, and arbitrarily concatenated SONET/SDH traffic with automatic configuration detection, ESSI-based APS control, and transport overhead extract/insert capability.

Technical Context

The PM5326H-FI integrates two independent framer cores, each configurable for either one STS-192/STM-64 or four STS-48/STM-16 streams, with full Section/Line/Path overhead termination, STS-1 alignment, and B1/B2/B3 error monitoring. It supports both nibble-mode and full-width SFI-4 operation across two OIF-compliant interfaces.

Its architecture includes dual Memory Switching Units (MSUs) - one for main TSI/muxing and another at the DROP APS port - enabling local grooming, line-card pairing, and line-to-line passthrough with independent working/protect path switching via dedicated ESSI RASIO 3G links (2.488 Gbit/s × 4 per interface).

Key Specifications

Pinout & Package

PM5326H-FI is housed in a 1292-pin FCBGA package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid. Pin assignments are defined per PMC-Sierra's official pinout documentation (PMC-2001648, Issue 5), with dedicated banks for SFI-4 I/O, ESSI RASIO links, DCC extraction/insertion, APS control, and JTAG test access.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SONET/SDH framer/aggregator applications.

Compared with PM5326H-FI, PM5376-TSE Nx160 and PM5377-TSE 240 offer higher aggregate bandwidth and extended packet-aware features but require larger PCB area, higher power, and more complex configuration - making PM5326H-FI optimal for cost- and space-constrained OC-192/OC-48 line cards where dual-framer density and low-latency APS are critical.

Availability

PM5326H-FI is available at Aetrix Electronics and suitable for Multi-Service Provisioning Platforms (MSPP), Add/Drop Multiplexers (ADM), and Sub-Wavelength Cross Connects requiring stable component supply, long-term lifecycle support, and traceable sourcing for telecom infrastructure deployment.

Supply support for PM5326H-FI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

PMC-Sierra (now part of Microsemi, acquired by Microchip Technology) was a fabless semiconductor company specializing in storage, optical transport, and mobile infrastructure ICs, headquartered in Sunnyvale, CA.

The PM5326H-FI belongs to PMC-Sierra's ARROW family of SONET/SDH framers, engineered specifically for high-density, low-power OC-48/OC-192 transport layer aggregation and grooming in carrier-class line cards.

FAQ

What is the primary function of the PM5326H-FI in SONET/SDH systems?

The PM5326H-FI functions as a dual framer/aggregator IC that terminates and processes SONET/SDH Section, Line, and Path overhead, performs STS-1 granularity frame alignment and pointer processing, and enables traffic aggregation across OC-192/STM-64 and OC-48/STM-16 rates. Its role in the PM5326H-FI is to provide full transport-layer visibility and control while supporting automatic configuration detection and in-band status messaging.

Does the PM5326H-FI support both OC-192 and OC-48 simultaneously?

Yes, the PM5326H-FI supports two independent framer instances: one can be configured for OC-192/STM-64 while the other handles four OC-48/STM-16 streams, or both can operate in OC-48 mode to support up to eight streams via nibble-mode SFI-4. This flexibility is built into the PM5326H-FI's hardware architecture and requires no external multiplexing logic.

How does the PM5326H-FI handle Automatic Protection Switching (APS)?

The PM5326H-FI implements APS through two dedicated ESSI port groups (W1/P1/APS1 and W2/P2/APS2), each with four 2.488 Gbit/s RASIO 3G links. It performs K1/K2 byte filtering, BER monitoring, and direct line-card APS signaling - all without host CPU involvement. The PM5326H-FI uses these interfaces to coordinate sub-50 ms protection switching across working and protect paths in telecom backplanes.

What package type and pin count does the PM5326H-FI use?

The PM5326H-FI is packaged in a 1292-pin Flip-Chip Ball Grid Array (FCBGA) with 35 × 35 mm body size and 1.0 mm ball pitch. This package supports high-speed signal integrity for its dual SFI-4 and multiple ESSI interfaces. Thermal performance and routing density are optimized for telecom line-card layouts used with the PM5326H-FI.

Can the PM5326H-FI extract and insert transport overhead bytes independently?

Yes, the PM5326H-FI provides dedicated parallel pins (TOH_EXTR[7:0] and TOH_INSRT[7:0]) for full transport overhead byte access at STS-1 granularity, enabling real-time extraction and insertion without overhead processor overhead. This capability is integral to the PM5326H-FI's design and allows network management systems to modify specific TOH bytes (e.g., J0, B1, B2) in-line.