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Microchip Technology PM5326H-FXI
- Part No.:
- PM5326H-FXI
- Manufacturer:
- Microchip Technology
- Category:
- Telecom
- Package:
- -
- Datasheet:
-
PM5326H-FXI.pdf
- Description:
- IC TELECOM INTERFACE 1292FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,483
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Product details
Overview
PM5326H-FXI from PMC-Sierra is a dual SONET/SDH framer/aggregator IC designed for OC-192/STM-64 and OC-48/STM-16 transport layer applications, delivering 20 Gbit/s aggregate capacity, supporting two independent SFI-4 interfaces (16-bit 622 MHz LVDS), and enabling STS-1 granularity frame alignment and pointer processing in telecom line cards.
For engineers reviewing the PM5326H-FXI datasheet, PM5326H-FXI pinout, PM5326H-FXI application, or PM5326H-FXI equivalent, key selection considerations include dual-framer configurability (STS-192c or 4×STS-48c), ESSI-based APS interface support, transport overhead extract/insert capability, and 1292-pin FCBGA package compatibility with high-density backplane routing.
Technical Context
The PM5326H-FXI integrates two independent framer cores, each configurable for either one STS-192/STM-64 stream or four STS-48/STM-16 streams, with full Section/Line/Path overhead termination, BIP-8 error detection (B1/B2/B3), and SD/SF alarm generation. It supports automatic traffic configuration detection across channelized, concatenated, and arbitrarily concatenated (STS-3c×N) modes.
It implements dual STS-1 Memory Switching Units (MSUs) for TSI and muxing in both transmit/receive paths, plus dedicated APS-port MSUs for local grooming; all controlled via 16-bit microprocessor interface and IEEE 1149.1 JTAG test port, operating on 1.2 V core with 2.5/3.3 V I/O.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Aggregate Capacity | 20 Gbit/s - enables dual OC-192/STM-64 or eight OC-48/STM-16 line-side connections |
| Framer Configuration | Dual independent framers - each supports STS-192c or 4×STS-48c, allowing flexible service aggregation |
| Line Interface | Two OIF SFI-4 ports - 16-bit 622 MHz LVDS duplex, direct SERDES/CRU interfacing without external glue logic |
| APS Interface | Two ESSI RASIO 3G sets - four 2.488 Gbit/s links per set, supporting working/protect/APS backplane connectivity |
| Overhead Handling | Full TOH extract/insert + DCC extraction - dedicated pins for section/line DCC and entire transport overhead access |
| Power Supply | 1.2 V core / 2.5 V or 3.3 V I/O - enables low-power operation while maintaining legacy interface voltage compatibility |
| Compliance | SONET OC-192/OC-48 & SDH STM-64/STM-16 - meets GR-253-CORE, ITU-T G.707/G.783, and Telcordia SR-GR-1254 |
Pinout & Package
PM5326H-FXI is housed in a 1292-pin Fine-Pitch Ball Grid Array (FCBGA) package with 27 × 27 mm body size, 0.8 mm ball pitch, and standard thermal pad layout optimized for telecom line card thermal management.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SFI4_TX[15:0], SFI4_RX[15:0] | OIF SFI-4 data lanes | Two independent 16-bit LVDS interfaces for line-side OC-192/STM-64 transmission and reception |
| ESSI_W1[3:0], ESSI_P1[3:0], ESSI_APS1[3:0] | Extended SONET Serial Interface links | First set of four 2.488 Gbit/s ESSI links for working/protect/APS backplane communication |
| ESSI_W2[3:0], ESSI_P2[3:0], ESSI_APS2[3:0] | Extended SONET Serial Interface links | Second set of four 2.488 Gbit/s ESSI links for redundant system-side interconnection |
| TOH_EXTR, TOH_INSR | Transport Overhead Extract/Insert | Dedicated parallel pins for full 9×9 byte TOH access, enabling real-time monitoring or regeneration |
| DCC_SECT, DCC_LINE | Section/Line DCC extraction | Separate pins for D1–D3 (section) and D4–D12 (line) bytes, supporting embedded OAM channel routing |
| MPU_AD[15:0], MPU_CS, MPU_RD, MPU_WR | 16-bit microprocessor interface | Asynchronous parallel bus for register-level configuration, status readback, and alarm reporting |
Key Features
| Feature | Design Value |
|---|---|
| Automatic traffic mode detection | Identifies STS-1, concatenated, or STS-3c×N configurations without software reconfiguration |
| Independent STS-1 MSUs (main + APS) | Enables simultaneous time-slot interchange and local grooming at DROP APS port for line-card pairing |
| In-band status messaging over ESSI | Transports Transport/Path/Equipment Status directly on RASIO links, eliminating separate control buses |
| K1/K2 byte filtering & BER monitoring | Hardware-accelerated APS decision logic with bit-error-rate tracking per ESSI link |
| Diagnostic loopback modes | Supports line-side receive-to-transmit loopback and system-side interface loopback for field diagnostics |
Applications
| Add/Drop Multiplexer (ADM) | Multi-Service Provisioning Platform (MSPP) |
|---|---|
Use Scenario: Aggregating and grooming multiple OC-48/STM-16 tributaries into OC-192/STM-64 line rates while performing local add/drop. IC Role / Device Role / Timing Role: Dual framer performs STS-1 level multiplexing, overhead processing, and APS switching coordination. Use Value: Enables single-chip support for 8×OC-48 input with full path monitoring, BIP-8 error insertion, and K1/K2-driven protection switching. | Use Scenario: Providing unified transport layer for Ethernet, ATM, and TDM services in carrier-grade edge platforms. IC Role / Device Role / Timing Role: SONET/SDH framer/aggregator handles section/line/path layer termination and in-band status distribution. Use Value: Reduces component count by consolidating framing, switching, and APS functions previously requiring discrete ASICs. |
| Sub-Wavelength Cross Connect | DWDM Line Card |
Use Scenario: Performing granular STS-1 circuit switching across optical channels without full wavelength conversion. IC Role / Device Role / Timing Role: STS-1 MSU executes time-slot interchange and cross-connect mapping under centralized control. Use Value: Delivers sub-OC-3 bandwidth provisioning with hardware-accelerated pointer processing and alignment. | Use Scenario: Serving as the SONET/SDH transport engine in 100G-capable DWDM line cards with dual OC-192 interfaces. IC Role / Device Role / Timing Role: Framer terminates line-side SFI-4 signals and provides transport overhead transparency to upstream optics. Use Value: Supports 20 Gbit/s line rate with full TOH passthrough and DCC extraction for embedded management plane. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SONET/SDH framer/aggregator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PM5376-TSE Nx160 | Single-framer architecture with 160 Gbit/s max capacity; supports STS-48c/STM-16c only, no STS-192c mode | Targeted at high-port-count OC-48 metro nodes, not OC-192 backbone aggregation | Select when scaling OC-48 density >8 ports per card and STS-192 support is unnecessary |
| PM5377-TSE 240 | Enhanced dual-framer with 240 Gbit/s aggregate; adds integrated FEC and OTN G.709 mapping | Designed for OTN+SONET hybrid transport, requires additional OTN protocol stack integration | Select when migrating toward OTN-aware infrastructure with backward SONET compatibility |
Compared with PM5376-TSE Nx160 and PM5377-TSE 240, the PM5326H-FXI uniquely balances OC-192/OC-48 flexibility, full STS-1 granularity, and minimal external logic-making it optimal for legacy SONET-centric MSPP and ADM upgrades where OC-192 throughput and APS reliability are primary.
Availability
PM5326H-FXI is available at Aetrix Electronics and suitable for Multi-Service Provisioning Platforms (MSPP), Add/Drop Multiplexers (ADM), and Sub-Wavelength Cross Connects requiring stable component supply, long-term lifecycle support, and telecom-grade qualification.
Supply support for PM5326H-FXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
PMC-Sierra was a fabless semiconductor company specializing in storage, optical transport, and mobile infrastructure ICs before its acquisition by Microsemi in 2016; its optical products remain widely deployed in carrier networks.
The PM5326H-FXI belongs to the ARROW family of SONET/SDH framers, engineered specifically for high-reliability, low-latency transport layer aggregation in telecom line cards where OC-192/STM-64 interoperability and APS robustness are critical.
FAQ
What is the maximum supported line rate for PM5326H-FXI?
The PM5326H-FXI supports two independent OC-192/STM-64 line rates (9.953 Gbit/s each) via its dual OIF SFI-4 interfaces, achieving 20 Gbit/s aggregate capacity. Each framer can be configured for STS-192c or four STS-48c streams, with full overhead processing and pointer alignment at all rates. The device does not support OC-768 or higher line rates.
Does PM5326H-FXI support automatic protection switching (APS) with hardware K1/K2 processing?
Yes, the PM5326H-FXI includes dedicated hardware for K1/K2 byte filtering, BER monitoring, and APS state machine execution across both ESSI interface sets. It supports direct line-card APS connections via system-side APS ports and enables centralized APS control through in-band status messaging on ESSI links-no external APS controller is required for basic 1+1 or 1:1 switching.
Can PM5326H-FXI handle STS-1 level traffic grooming and time-slot interchange?
Yes, the PM5326H-FXI integrates two independent STS-1 Memory Switching Units (MSUs): one for main framer TSI/muxing and another at the DROP APS port. This enables hardware-accelerated STS-1 level grooming, local traffic termination, and line-card pairing without host CPU intervention-critical for low-latency cross-connect functionality in MSPPs.
What package type and pin count does PM5326H-FXI use?
The PM5326H-FXI uses a 1292-pin Fine-Pitch Ball Grid Array (FCBGA) package with 27 mm × 27 mm body size and 0.8 mm ball pitch. This package supports high-speed signal integrity for SFI-4 and ESSI interfaces, includes thermal vias for line-card thermal dissipation, and is compatible with standard telecom PCB fabrication processes.
How does PM5326H-FXI handle transport overhead (TOH) and DCC extraction?
The PM5326H-FXI provides dedicated parallel pins (TOH_EXTR/TOH_INSR) for full 9×9-byte transport overhead access and separate pins (DCC_SECT/DCC_LINE) for extracting section (D1–D3) and line (D4–D12) DCC bytes. This enables real-time TOH monitoring, regeneration, and embedded OAM channel routing without requiring external FIFOs or glue logic.
PM5326H-FXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Function:
- SONET/SDH
- Interface:
- SFI-4
- Number of Circuits:
- -
- Voltage - Supply:
- 1.2V
- Current - Supply:
- -
- Power (Watts):
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1292-FCBGA
PM5326H-FXI FAQ
1.How can I place an order for PM5326H-FXI through Aetrix?
Please submit a Request for Quotation (RFQ) for PM5326H-FXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PM5326H-FXI reliable?
The price and inventory of PM5326H-FXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PM5326H-FXI is usually 5 days.
3.What payment methods are accepted for PM5326H-FXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PM5326H-FXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PM5326H-FXI?
PM5326H-FXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PM5326H-FXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PM5326H-FXI?
For technical support, including PM5326H-FXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PM5326H-FXI requirements.
6.How does Aetrix verify that PM5326H-FXI is sourced from the original manufacturer or authorized distributors?
All PM5326H-FXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PM5326H-FXI meets industry standards.
7.What is the process for return or replacement of PM5326H-FXI?
All PM5326H-FXI units undergo pre-shipment inspection (PSI). If there is an issue with PM5326H-FXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PM5326H-FXI part is unused and in its original packaging.
Return procedure for PM5326H-FXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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