My Inquiry
My Account
NXP Semiconductors PPC5606BCLQ64
- Part No.:
- PPC5606BCLQ64
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
PPC5606BCLQ64.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,992
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PPC5606BCLQ64 from NXP Semiconductors is a 32-bit automotive microcontroller based on the e200z0h Power Architecture core, operating up to 64 MHz with 1 MB on-chip code flash, 64 KB data flash (ECC-protected), and 80 KB SRAM. It integrates six FlexCAN modules, ten LINFlex interfaces, six DSPI controllers, dual ADCs (10-bit and 12-bit), and supports real-time control in body electronics applications.
For engineers reviewing the PPC5606BCLQ64 datasheet, PPC5606BCLQ64 pinout, PPC5606BCLQ64 application, or PPC5606BCLQ64 equivalent, this device delivers deterministic timing via FMPLL, cross-triggered ADC synchronization, Nexus 2+ debug support, and robust power management for ASIL-B–capable automotive subsystems.
Technical Context
The PPC5606BCLQ64 implements the VLE (Variable-Length Encoding) instruction set for reduced code footprint while maintaining Power Architecture compliance. Its crossbar switch enables concurrent access to Flash, SRAM, and peripherals by multiple bus masters including eDMA and CPU.
It features a 64-channel eMIOS for flexible timer I/O (PWM, input capture, output compare), a 204-source INTC with configurable priority, and dual ADC subsystems - one dedicated 10-bit (15 channels) and one dedicated 12-bit (5 channels) - synchronized via CTU to eMIOS or PIT events.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h Power Architecture core with VLE support, enabling compact firmware for resource-constrained automotive ECUs. |
| Max Clock Speed | 64 MHz - ensures deterministic real-time response for body control modules and gateway functions. |
| Code Flash | 1 MB - sufficient for AUTOSAR-compliant software stacks with bootloader, diagnostics, and application logic. |
| Data Flash | 64 KB (4 × 16 KB), ECC-protected - provides reliable non-volatile storage for calibration data and configuration parameters. |
| SRAM | 80 KB - supports real-time task execution, CAN message buffering, and LIN protocol stack operation. |
| ADC System | Dual independent converters: 10-bit (15 ch) + 12-bit (5 ch), cross-triggered via CTU - enables synchronized sensor sampling across multiple domains. |
| Communication Peripherals | 6 × FlexCAN, 10 × LINFlex, 6 × DSPI, 1 × I²C - meets full vehicle network requirements for body domain controllers. |
Pinout & Package
LQFP-64 package (10 mm × 10 mm, 0.5 mm pitch) - compact footprint suitable for space-constrained automotive modules such as door control units and seat controllers.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_LV / VSS_LV | 1.2 V core supply pair | Must be decoupled with local 100 nF capacitor; powers CPU, MPU, and internal logic at low noise. |
| VDD_HV / VSS_HV | 3.3 V I/O supply pair | Supplies GPIO, CAN transceivers, and peripheral drivers; requires separate bulk + ceramic decoupling. |
| RESET | Active-low reset input | Pulled up internally after PHASE2; asserts low for ≥40 FIRC cycles during power-up sequencing. |
| XTAL / EXTAL | 32 kHz crystal oscillator interface | Supports RTC autonomous wakeup with 1 s resolution and 1-hour timeout; critical for low-power sleep modes. |
| PA[0]–PA[15] | General-purpose port A | Configurable as GPIO, LIN/CAN/DSPI signals, or eMIOS channels - enables multiplexed I/O for flexible board design. |
| PF[0]–PF[15] | General-purpose port F | Includes CAN TX/RX, DSPI MOSI/MISO, and eMIOS pins - used for high-speed peripheral interfacing and motor control PWM. |
Key Features
| Feature | Design Value |
|---|---|
| VLE instruction encoding | Reduces firmware size by ~30% vs. standard 32-bit encoding - lowers flash cost and improves cache efficiency in ECU boot code. |
| FMPLL with frequency modulation | Enables spread-spectrum clocking to reduce EMI emissions - simplifies EMC compliance for Class B automotive systems. |
| Memory Protection Unit (MPU) | 8-region descriptor support with 32-byte granularity - isolates AUTOSAR OS tasks and prevents memory corruption between safety-critical partitions. |
| Cross Trigger Unit (CTU) | Synchronizes ADC conversions with eMIOS timer events - eliminates software jitter in closed-loop motor control and battery monitoring. |
| Nexus 2+ debug interface | IEEE-ISTO 5001-2003 Class Two Plus compliant - enables real-time trace, hardware breakpoints, and non-intrusive profiling for ISO 26262 development. |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized management of lighting, window lift, mirror adjustment, and interior switches in modern vehicles. IC Role / Device Role / Timing Role: Main application processor executing AUTOSAR BSW and application SW, coordinating CAN/LIN communication and PWM-driven actuators. Use Value: 64 MHz deterministic execution, 10 × LINFlex, and 6 × FlexCAN enable simultaneous control of 12+ LIN slaves and 3 CAN networks without external bridge ICs. | Use Scenario: Integrated control of power windows, door locks, side mirrors, and anti-pinch sensors in driver/passenger doors. IC Role / Device Role / Timing Role: Real-time motor controller with eMIOS-based PWM generation and ADC-synchronized current sensing for brushless window motors. Use Value: Dual ADC (10-bit + 12-bit) with CTU synchronization allows simultaneous sampling of motor voltage, current, and position feedback within <1 µs jitter. |
| Seat Position Controller | Roof Module Gateway |
Use Scenario: Motorized adjustment of seat height, fore/aft position, lumbar support, and heating elements in premium seating systems. IC Role / Device Role / Timing Role: Safety-aware actuator controller with MPU-enforced memory partitioning and watchdog supervision per ASIL-B requirements. Use Value: 80 KB SRAM buffers CAN messages and stores seat profile data; 64 KB ECC data flash retains calibrated motor limits across power cycles. | Use Scenario: Aggregation and routing of LIN messages from sunroof, ambient lighting, and panoramic roof sensors to the main body domain CAN network. IC Role / Device Role / Timing Role: Protocol gateway with LINFlex-to-FlexCAN bridging, real-time message filtering, and diagnostic event logging. Use Value: 10 LINFlex ports support daisy-chained sunroof sensors and RGB LED drivers; 6 FlexCAN modules handle multi-bus routing with timestamped message forwarding. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5607BCLQ64 | 1.5 MB code flash, 96 KB SRAM, 208 MAPBGA only | Higher memory capacity for complex gateway or ADAS-supporting body controllers | Select when >1 MB flash or >80 KB SRAM required; not pin-compatible with PPC5606BCLQ64. |
| S32K144HAT0MLHT | ARM Cortex-M4F core, 512 KB flash, 64 KB SRAM, AEC-Q100 Grade 1 | Native CAN FD support, S32DS toolchain, no Power Architecture legacy dependencies | Prefer for new designs requiring CAN FD, functional safety certification beyond ASIL-B, or ARM ecosystem alignment. |
Compared with MPC5607BCLQ64 and S32K144HAT0MLHT, the PPC5606BCLQ64 offers optimal balance of legacy Power Architecture software reuse, 1 MB flash for mid-tier body ECUs, and LQFP-64 packaging - making it ideal for cost-sensitive, volume automotive modules where CAN FD is not required.
Availability
PPC5606BCLQ64 is available at Aetrix Electronics and suitable for body control modules, door module controllers, seat position systems, and roof module gateways requiring stable component supply and long-term automotive qualification.
Supply support for PPC5606BCLQ64 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The MPC56xx family, including PPC5606BCLQ64, was designed specifically for automotive body electronics - delivering ASIL-B–capable real-time performance, integrated communication peripherals, and robust power management in compact packages.
FAQ
What is the maximum operating temperature range for PPC5606BCLQ64?
The PPC5606BCLQ64 is qualified for automotive operation from −40 °C to 125 °C ambient temperature. This extended range supports under-hood and cabin-mounted ECU deployments, including door modules exposed to direct sunlight and BCMs located near HVAC ducts. Thermal derating begins above 105 °C per NXP's recommended operating conditions in Rev. 10 datasheet.
Does PPC5606BCLQ64 support CAN FD?
No, PPC5606BCLQ64 does not support CAN FD. It integrates six FlexCAN modules compliant with ISO 11898-1:2015 Classical CAN (up to 1 Mbps). CAN FD capability is introduced in later NXP families like S32K and S32G. For PPC5606BCLQ64, all CAN communication must use standard 11-bit identifiers and fixed bit rates.
How many ADC channels does PPC5606BCLQ64 have, and are they shared?
The PPC5606BCLQ64 includes two independent ADC subsystems: a dedicated 10-bit ADC with 15 input channels and a dedicated 12-bit ADC with 5 input channels. Per Table 1 in the MPC5607B datasheet (which applies to PPC5606B), these are not shared - each has its own conversion resources and trigger inputs, enabling concurrent sampling without resource contention.
What debug interface does PPC5606BCLQ64 provide?
The PPC5606BCLQ64 provides a Nexus 2+ debug interface compliant with IEEE-ISTO 5001-2003 Class Two Plus, plus JTAG (IEEE 1149.1) for boundary scan testing. Nexus 2+ supports real-time trace, hardware breakpoints, and non-intrusive profiling - essential for ISO 26262 development and AUTOSAR OS validation.
Is PPC5606BCLQ64 pin-compatible with other MPC560xB variants?
No, PPC5606BCLQ64 is not pin-compatible with MPC5605B or MPC5607B due to differing package options and pin assignments. The "CLQ64" suffix denotes LQFP-64, while MPC5605B/MPC5607B are offered in 100/144/176 LQFP and 208 MAPBGA. Pin mapping, supply pin count, and peripheral multiplexing differ significantly across variants.
PPC5606BCLQ64 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 121
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 80K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 15x10b, 5x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
PPC5606BCLQ64 FAQ
1.How can I place an order for PPC5606BCLQ64 through Aetrix?
Please submit a Request for Quotation (RFQ) for PPC5606BCLQ64 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PPC5606BCLQ64 reliable?
The price and inventory of PPC5606BCLQ64 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PPC5606BCLQ64 is usually 5 days.
3.What payment methods are accepted for PPC5606BCLQ64?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PPC5606BCLQ64 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PPC5606BCLQ64?
PPC5606BCLQ64 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PPC5606BCLQ64 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PPC5606BCLQ64?
For technical support, including PPC5606BCLQ64 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PPC5606BCLQ64 requirements.
6.How does Aetrix verify that PPC5606BCLQ64 is sourced from the original manufacturer or authorized distributors?
All PPC5606BCLQ64 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PPC5606BCLQ64 meets industry standards.
7.What is the process for return or replacement of PPC5606BCLQ64?
All PPC5606BCLQ64 units undergo pre-shipment inspection (PSI). If there is an issue with PPC5606BCLQ64, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PPC5606BCLQ64 part is unused and in its original packaging.
Return procedure for PPC5606BCLQ64:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PPC5606BCLQ64 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
