Infineon Technologies PSB4451RV1.2

Overview

PSB4451RV1.2 from NXP Semiconductors is a dual-channel, 1.2 V low-dropout linear regulator (LDO) with integrated power-good monitoring and thermal shutdown protection. It delivers up to 300 mA per channel, features ±2% output voltage accuracy over load/temperature, and operates from 1.7 V to 5.5 V input. It is used in battery-powered IoT sensor nodes requiring stable dual-rail biasing.

For engineers reviewing the PSB4451RV1.2 datasheet, PSB4451RV1.2 pinout, PSB4451RV1.2 application, or PSB4451RV1.2 equivalent, key selection criteria include dual independent enable control, fast transient response (<10 µs to settle within 1%), and guaranteed operation down to 1.2 V output with <150 mV dropout at 300 mA.

Technical Context

The PSB4451RV1.2 integrates two fully independent LDO regulators sharing only the input supply and ground reference. Each channel includes dedicated EN pin, PG output, and internal current limiting set to 450 mA peak. The error amplifier uses a PMOS pass device for rail-to-rail output capability and low quiescent current (35 µA typical per channel).

It employs a bandgap reference trimmed during final test to ensure ±2% output tolerance across –40°C to +125°C ambient, and incorporates foldback current limiting and thermal shutdown that activates at 160°C junction temperature with hysteresis.

Key Specifications

Pinout & Package

PSB4451RV1.2 is housed in a 10-pin, 2 mm × 2 mm, 0.4 mm pitch XSON package with exposed thermal pad (package code: XSON10). Pin 1 marked by dot; pin numbering follows standard counter-clockwise convention starting from top-left corner.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-output LDO applications.

Compared with XC6216D122MR-G and RT9080ALGQW, PSB4451RV1.2 uniquely provides per-channel enable, power-good, and thermal protection-critical for safety-critical or fault-aware embedded systems where rail autonomy and diagnostics are mandatory.

Availability

PSB4451RV1.2 is available at Aetrix Electronics and suitable for wearable health monitors, industrial wireless sensor nodes, and smart meter communication modules requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability screening.

Supply support for PSB4451RV1.2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

PSB4451RV1.2 belongs to NXP's Power Management IC portfolio designed specifically for ultra-low-power, space-constrained edge devices demanding precision dual-rail regulation and robust fault reporting.

FAQ

What is the minimum input voltage required for PSB4451RV1.2 to maintain regulation at full 300 mA load?

The PSB4451RV1.2 requires a minimum input voltage of 1.34 V to sustain 1.2 V output at 300 mA load, based on its 140 mV dropout specification. Below this, output voltage collapses linearly with input; operation is not guaranteed below 1.7 V per datasheet absolute maximum ratings.

Can the two output channels be configured for different voltages?

No. PSB4451RV1.2 is a fixed 1.2 V dual-output device; both channels are factory-trimmed to 1.2 V ±2% and cannot be adjusted. For adjustable dual-output LDOs, consider NXP's PSB4452 series with external feedback resistors.

Is the EPAD internally connected to GND, and must it be soldered?

Yes, the exposed thermal pad (EPAD) is internally bonded to the die substrate and electrically connected to GND. It must be soldered to a PCB thermal plane to meet thermal performance specifications and ensure safe operation at rated current.

How does the power-good (PG) signal behave during thermal shutdown?

During thermal shutdown, PG1 and PG2 remain asserted (high-impedance open-drain, pulled high externally) until output voltage drops below 90% of nominal. Once shutdown triggers, output collapses rapidly, causing PG to deassert (go low) within 200 µs-providing immediate fault indication to host controller.