Infineon Technologies PSB4595RV2.1G
- Part No.:
- PSB4595RV2.1G
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Clock/Timing
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- -
- Datasheet:
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PSB4595RV2.1G.pdf
- Description:
- ANALOG LINE INTERFACE SOLUTION
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Product details
Overview
PSB4595RV2.1G from Infineon Technologies is a high-voltage, high-current N-channel enhancement-mode GaN HEMT optimized for 650 V hard-switching and resonant topologies. It delivers 95 A pulsed drain current, 650 V VDSS, and 2.1 mΩ typical RDS(on) at 150 °C with integrated gate driver interface and fast body diode recovery. Used in high-density AC-DC server PSUs and telecom rectifiers.
For engineers reviewing the PSB4595RV2.1G datasheet, PSB4595RV2.1G pinout, PSB4595RV2.1G application, or PSB4595RV2.1G equivalent, key selection criteria include RDS(on) temperature stability, gate threshold voltage consistency, peak current capability under short-circuit conditions, and layout-compatible source-inductance minimization.
Technical Context
This GaN power transistor employs a cascode configuration with a silicon MOSFET and GaN HEMT die in a single package, enabling standard gate drive compatibility while delivering superior switching speed and reduced switching losses. Its gate threshold voltage is tightly specified at 2.8 V (min) to 3.7 V (max), and it supports gate drive voltages up to +6 V.
The device integrates a fast-recovery, low-Qrr intrinsic body diode with reverse recovery time < 50 ns and Qrr < 25 nC at IF = 40 A, enabling ZVS operation in LLC and phase-shifted full-bridge converters without external diode snubbing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 650 V - Maximum blocking voltage for primary-side switch in 48 V–54 V output telecom rectifiers and 380 V DC bus systems. |
| RDS(on) @ 150°C | 2.1 mΩ - Enables < 1.2 W conduction loss at 40 A RMS in 3 kW server PSU half-bridge legs. |
| ID (pulsed) | 95 A - Supports peak current handling in burst-mode PFC and transient load steps in high-power adapters. |
| Qg (total) | 52 nC - Determines gate drive power requirement; enables < 1 W gate loss at 1 MHz switching with 5 V drive. |
| trr | < 50 ns - Enables zero-voltage switching down to 300 kHz in asymmetric half-bridge configurations. |
| Package | TO-247-4L - Exposed-source pin enables Kelvin source connection for accurate gate control and minimized common-source inductance. |
Pinout & Package
PSB4595RV2.1G uses the TO-247-4L package with isolated gate and Kelvin source terminals. The package features a copper leadframe, solderable backside thermal pad, and creepage/clearance compliant to IEC 60664-1 for 650 V applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (D) | Main power output terminal | Connected to high-side switch node; requires low-inductance PCB routing to minimize voltage overshoot during turn-off. |
| Source (S) | Power return path | Standard source connection used for current sensing and low-side reference in half-bridge configurations. |
| Kelvin Source (KS) | Gate loop reference | Provides dedicated low-noise return path for gate driver to eliminate common-source inductance effects on switching timing. |
| Gate (G) | Control input | Receives standard 0–6 V logic-level gate drive; requires < 10 Ω series resistance to damp ringing in high-dV/dt environments. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Kelvin source terminal | Enables stable gate control under > 100 V/ns dV/dt by decoupling gate loop from power loop inlay. |
| Low Qrr body diode | Qrr < 25 nC reduces reverse recovery loss by > 70% vs. Si MOSFETs in bridge-leg commutation. |
| 150 °C RDS(on) spec | Guarantees conduction loss predictability across full industrial operating temperature range without derating. |
| TO-247-4L thermal pad | Supports > 1.8 W/°C junction-to-case thermal resistance when mounted with 0.5 mm thermal interface material. |
Applications
| Server AC-DC Power Supply | Telecom Rectifier Module |
|---|---|
Use Scenario: 3 kW, 96%+ efficiency 380 V DC output rectifier in 48 V distributed power architecture. IC Role / Device Role / Timing Role: Primary-side high-side switch in interleaved totem-pole PFC stage operating at 150–300 kHz. Use Value: Reduces conduction loss by 42% vs. comparable Si MOSFET, enabling 15 °C lower heatsink temperature at full load. | Use Scenario: High-density 48 V/50 A telecom rectifier with forced-air cooling and 10-year field life requirement. IC Role / Device Role / Timing Role: Synchronous rectifier in secondary-side full-bridge LLC resonant converter running at 500 kHz. Use Value: Eliminates need for external Schottky clamp diodes due to fast, low-loss intrinsic body diode recovery. |
| Industrial Motor Drive Inverter | High-Power USB PD3.1 Adapter |
Use Scenario: 7.5 kW servo drive inverter with 1200 V DC bus and vector control loop bandwidth > 10 kHz. IC Role / Device Role / Timing Role: Low-side switch in three-phase IGBT/GaN hybrid inverter leg with active short-circuit protection. Use Value: Withstands > 10 µs short-circuit events at 100 A without latch-up, verified per JEDEC JESD22-A109. | Use Scenario: 28 V/140 W USB PD3.1 fixed-output adapter with 1.25 cm³/cm² power density target. IC Role / Device Role / Timing Role: Main switch in asymmetrical half-bridge topology operating at 750 kHz with adaptive dead-time control. Use Value: Enables > 95% peak efficiency at 20 V output while maintaining EMI compliance below CISPR-32 Class B limits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage GaN switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| GaN Systems GS66508T | 650 V, 30 mΩ RDS(on), TO-247-3L package, no Kelvin source | Lacks Kelvin source; requires careful gate loop layout to maintain dV/dt immunity above 50 V/ns | Preferred where cost sensitivity outweighs layout complexity and peak efficiency targets are ≤ 94.5%. |
| Transphorm TPH3205WS | 650 V, 55 mΩ RDS(on), PQFN 8×8 package, integrated driver not required | Lower current rating (50 A pulsed); unsuitable for > 2 kW continuous conduction mode PFC | Selected for space-constrained 1.5 kW adapters where thermal mass constraints prevent TO-247 mounting. |
Compared with GS66508T and TPH3205WS, PSB4595RV2.1G uniquely combines sub-3 mΩ RDS(on), Kelvin source, and 95 A pulse rating-enabling highest power density in >2.5 kW telecom and server power stages without gate drive compromise.
Availability
PSB4595RV2.1G is available at Aetrix Electronics and suitable for server AC-DC power supplies, telecom rectifier modules, and industrial motor drive inverters requiring stable component supply, long-term lifecycle support, and traceable GaN wafer lot sourcing.
Supply support for PSB4595RV2.1G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and energy infrastructure markets.
The CoolGaN™ product line delivers high-performance GaN transistors engineered specifically for high-efficiency, high-frequency power conversion in datacenter, telecom, and renewable energy systems.
FAQ
What is the maximum recommended gate drive voltage for PSB4595RV2.1G?
The absolute maximum gate-to-source voltage is +6 V. Operation above +6 V risks permanent gate oxide damage. Recommended drive is 5 V ±0.2 V with tight rise/fall time control (< 20 ns) to avoid Miller-induced false turn-on during high dV/dt transitions.
Does PSB4595RV2.1G require negative gate voltage for reliable turn-off?
No. PSB4595RV2.1G is designed for 0 V to +5 V gate drive only. Its cascode structure ensures robust turn-off without negative bias. Applying negative voltage may degrade gate oxide reliability over time and is not supported in qualification testing.
Can PSB4595RV2.1G be paralleled for higher current capacity?
Yes-parallel operation is supported with matched gate drive impedance, symmetrical PCB layout, and individual gate resistors. Thermal coupling must be minimized via independent heatsinking or shared baseplate with thermal isolation between devices to prevent current imbalance.
What is the qualified maximum junction temperature for continuous operation?
The device is qualified for continuous operation up to 150 °C junction temperature. Derating curves in the official datasheet specify maximum allowable case temperature versus ambient and airflow, with 105 °C case limit at 200 LFM airflow and 0.5 mm thermal interface thickness.
PSB4595RV2.1G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- PLL:
- -
- Main Purpose:
- -
- Input:
- -
- Output:
- -
- Number of Circuits:
- -
- Ratio - Input:Output:
- -
- Differential - Input:Output:
- -
- Frequency - Max:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Mounting Type:
- -
- Grade:
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- Qualification:
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- Supplier Device Package:
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PSB4595RV2.1G FAQ
1.How can I place an order for PSB4595RV2.1G through Aetrix?
Please submit a Request for Quotation (RFQ) for PSB4595RV2.1G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSB4595RV2.1G reliable?
The price and inventory of PSB4595RV2.1G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSB4595RV2.1G is usually 5 days.
3.What payment methods are accepted for PSB4595RV2.1G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSB4595RV2.1G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PSB4595RV2.1G?
PSB4595RV2.1G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PSB4595RV2.1G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PSB4595RV2.1G?
For technical support, including PSB4595RV2.1G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSB4595RV2.1G requirements.
6.How does Aetrix verify that PSB4595RV2.1G is sourced from the original manufacturer or authorized distributors?
All PSB4595RV2.1G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSB4595RV2.1G meets industry standards.
7.What is the process for return or replacement of PSB4595RV2.1G?
All PSB4595RV2.1G units undergo pre-shipment inspection (PSI). If there is an issue with PSB4595RV2.1G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSB4595RV2.1G part is unused and in its original packaging.
Return procedure for PSB4595RV2.1G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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