Infineon Technologies PSB 50510 E V1.3-G

Overview

PSB 50510 E V1.3-G from Infineon Technologies is a single-chip ISDN S/T interface transceiver IC supporting full-duplex 2B+D operation at 160 kbps, featuring integrated line driver, receiver, echo canceller, and D-channel controller. It operates from a 3.3 V supply, consumes 480 mW typical power, and complies with ITU-T I.430 and ETSI TS 101 639 standards for European ISDN terminal equipment.

For engineers reviewing the PSB 50510 E V1.3-G datasheet, PSB 50510 E V1.3-G pinout, PSB 50510 E V1.3-G application, or PSB 50510 E V1.3-G equivalent, key selection criteria include B-channel timing jitter (< 0.5 UI), on-chip D-channel HDLC processing, differential line interface compatibility, and LBGA-256 thermal performance in telecom line card designs.

Technical Context

The PSB 50510 E V1.3-G implements a fully integrated physical layer (Layer 1) ISDN S/T interface with adaptive line impedance matching (135 Ω ±10%), programmable transmit amplitude (±1.2 V to ±2.4 V), and digital echo cancellation achieving >35 dB suppression. Its embedded D-channel controller supports LAPD framing, CRC-16 generation/checking, and automatic TEI assignment.

It integrates a 32-bit RISC microcontroller core for protocol handling, supports external memory via 16-bit parallel bus, and includes hardware timers, GPIOs, and interrupt controllers - enabling standalone S/T termination without external MCU in basic configurations.

Key Specifications

Pinout & Package

PSB 50510 E V1.3-G is housed in a 256-pin Low-Profile Ball Grid Array (LBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and exposed thermal pad for enhanced heat dissipation in telecom modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ISDN S/T interface applications.

Compared with TLE6240G and PCD333, PSB 50510 E V1.3-G delivers the highest integration density (LBGA-256), lowest power per channel (480 mW), and autonomous D-channel handling - making it optimal for new compact ISDN terminal and multi-port line card designs requiring minimal external logic.

Availability

PSB 50510 E V1.3-G is available at Aetrix Electronics and suitable for ISDN terminal adapters, multi-port PBX line cards, industrial modem modules, and remote access servers requiring stable component supply and long-term lifecycle support.

Supply support for PSB 50510 E V1.3-G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and wired/wireless communication ICs, with global R&D centers and ISO/TS 16949-certified manufacturing.

The PSB 50510 E V1.3-G belongs to Infineon's legacy Telecom Interface product line, designed specifically for European ISDN infrastructure equipment requiring full I.430 compliance, low-power line termination, and embedded protocol acceleration.

FAQ

What clock sources does PSB 50510 E V1.3-G support?

The PSB 50510 E V1.3-G accepts either a 19.44 MHz fundamental-mode crystal directly connected to CLKIN/CLKOUT pins or an external 19.44 MHz CMOS clock signal. Its internal PLL generates all required internal clocks-including 38.88 MHz for B-channel sampling and 1.536 MHz for D-channel timing-without requiring additional clock synthesizers.

Does PSB 50510 E V1.3-G require external line transformers?

No. The PSB 50510 E V1.3-G integrates fully differential line drivers and receivers with programmable output amplitude and on-chip 135 Ω termination, enabling direct connection to the ISDN line via discrete 1:1 pulse transformers or capacitive coupling networks-no external active line interface ICs or transformer driver stages are needed.

How is D-channel LAPD handled in PSB 50510 E V1.3-G?

The PSB 50510 E V1.3-G contains a dedicated hardware LAPD controller that autonomously processes SABME, UA, DISC, and FRMR frames, performs CRC-16 generation and checking, manages TEI assignment and conflict resolution, and buffers up to eight 260-byte frames-relieving the host processor of all Layer 2 protocol overhead.

What thermal design considerations apply to the LBGA-256 package?

The LBGA-256 package features an exposed thermal pad requiring solder connection to a minimum 200 mm² copper pour on the PCB's inner ground plane. Thermal vias (≥8×0.3 mm diameter) must be placed under the pad, and recommended layout achieves θ_JA ≤ 32 °C/W, enabling full-load operation at 70 °C ambient without heatsinks.