Infineon Technologies PTAC210802FCV1XWSA1
- Part No.:
- PTAC210802FCV1XWSA1
- Manufacturer:
- Infineon Technologies
- Category:
- Single FETs, MOSFETs
- Package:
- -
- Datasheet:
-
PTAC210802FCV1XWSA1.pdf
- Description:
- RF MOSFET LDMOS
- Quantity:
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Product details
Overview
PTAC210802FCV1XWSA1 from Infineon Technologies is a 2100–2200 MHz RF power LDMOS transistor rated for 80 W CW output power, featuring 17 dB small-signal gain and 65% drain efficiency at 2140 MHz under 28 V supply. It serves as the final-stage RF power amplifier in macro base station transmitters for LTE and 5G NR TDD infrastructure.
For engineers reviewing the PTAC210802FCV1XWSA1 datasheet, PTAC210802FCV1XWSA1 pinout, PTAC210802FCV1XWSA1 application, or PTAC210802FCV1XWSA1 equivalent, key selection criteria include frequency band alignment (2100–2200 MHz), thermal resistance (0.29°C/W junction-to-case), and ruggedness against VSWR ≥10:1 at full power.
Technical Context
This device employs a silicon-based LDMOS process with gold-metallized source bonding and integrated ESD protection on gate terminals. Its internal matching supports single-ended operation from 2100 to 2200 MHz without external input/output tuning networks.
The transistor operates in Class AB bias configuration with typical quiescent current of 450 mA at VGS = 2.7 V and VDS = 28 V. Thermal design requires direct mounting to a copper heat sink via the flanged ceramic package base.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 2100–2200 MHz - Supports entire Band 1 (LTE) and n1/n41 (5G NR) uplink/downlink segments. |
| Output Power (P3dB) | 80 W CW - Delivers linear power sufficient for 4×4 MIMO macro base station PA stages. |
| Small-Signal Gain | 17 dB @ 2140 MHz - Enables reduced driver stage complexity in multi-stage PA architectures. |
| Drain Efficiency | 65% @ 2140 MHz, 28 V - Reduces thermal load and DC power consumption in high-duty-cycle TDD systems. |
| Thermal Resistance | 0.29°C/W (RθJC) - Requires ≤40°C case temperature for continuous 80 W operation with standard heatsink interface. |
| VSWR Tolerance | Rugged to 10:1 @ full power - Eliminates need for external circulators or isolators in antenna mismatch scenarios. |
Pinout & Package
PTAC210802FCV1XWSA1 uses a flanged ceramic-metal package (SOT-1222-1) with electrically isolated tab. The package provides low-inductance source grounding and optimized RF port geometry for microstrip transitions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | RF Power Output / Heat Sink Interface | Electrically active drain terminal; must be bolted to grounded heatsink with thermal interface material. |
| Source (Pin 1) | RF Ground Reference / Bias Return | Low-inductance source connection; tied directly to ground plane beneath package footprint. |
| Gate (Pin 2) | RF Input / Bias Control Node | ESD-protected gate terminal; requires DC blocking and impedance-matching network for 50 Ω system interface. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated ESD Protection | Robust HBM Class 2 (≥2 kV) on gate enables safe handling and eliminates discrete gate protection diodes. |
| Internal Input Matching | Enables direct 50 Ω RF input connection without external matching components below 2200 MHz. |
| Gold-Metallized Source Bonding | Reduces bond wire inductance and improves thermal conduction from die to flange by >15% vs. aluminum alternatives. |
| Ruggedness Certification | Qualified to withstand 10:1 VSWR at full rated power - verified per IEC 61000-4-2 and internal Infineon stress test protocols. |
Applications
| Macro Base Station PA | 5G NR TDD Transmitter |
|---|---|
Use Scenario: Final-stage power amplification in outdoor 4T4R macro cell sites operating in Band 1 (1920–1980 MHz UL / 2110–2170 MHz DL). IC Role / Device Role / Timing Role: RF power transistor delivering 80 W saturated output with linearized DPD support. Use Value: High drain efficiency reduces cooling requirements and enables compact remote radio head (RRH) designs. | Use Scenario: Transmit chain in 5G NR TDD base stations using 2100–2200 MHz spectrum (n1/n41). IC Role / Device Role / Timing Role: High-efficiency final PA stage supporting 30 kHz subcarrier spacing and 100 MHz channel bandwidth. Use Value: Rugged VSWR tolerance ensures stable operation during dynamic beamforming antenna reconfiguration. |
| LTE-A Carrier Aggregation | High-Power Doherty PA |
Use Scenario: Main amplifier in dual-band carrier aggregation configurations combining Band 1 and Band 3. IC Role / Device Role / Timing Role: Primary PA element biased for high linearity (ACPR < –45 dBc) across 20 MHz LTE signals. Use Value: 17 dB gain simplifies driver stage count and maintains system noise figure below 7 dB. | Use Scenario: Main amplifier in asymmetric Doherty architecture for peak power boost in burst-mode transmission. IC Role / Device Role / Timing Role: High-efficiency main path transistor delivering 80 W average power with 10 dB back-off capability. Use Value: Low RθJC enables thermal co-design with peaking path transistor on shared heatsink. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP MRFE6VP6800HR5 | Higher P3dB (800 W), wider bandwidth (1.8–2.3 GHz), but larger SOT-1222-2 package and higher VDD (50 V). | Suitable for higher-power macro and massive MIMO systems; not drop-in due to voltage and footprint mismatch. | Select when scaling beyond 80 W or requiring broader band coverage across Bands 3/7/40. |
| Qorvo QPD1025 | GaN-on-SiC process, 2110–2170 MHz only, 85 W P3dB, 70% efficiency, but requires gate bias sequencing and external ESD protection. | Better efficiency and power density, but adds gate driver complexity and layout sensitivity. | Prefer for new 5G NR designs where thermal density and efficiency outweigh design maturity risk. |
Compared with MRFE6VP6800HR5 and QPD1025, PTAC210802FCV1XWSA1 offers optimal balance of proven LDMOS reliability, simplified 28 V biasing, and validated ruggedness for Band 1/n1/n41 macro deployments - reducing qualification time and thermal management overhead.
Availability
PTAC210802FCV1XWSA1 is available at Aetrix Electronics and suitable for LTE macro base stations, 5G NR TDD transmitters, carrier aggregation RF front-ends, and high-power Doherty amplifier modules requiring stable component supply and long-term industrial availability.
Supply support for PTAC210802FCV1XWSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and RF solutions, with leadership in silicon-based RF power devices.
PTAC210802FCV1XWSA1 belongs to Infineon's OptiMOS™ RF LDMOS product line, engineered specifically for high-efficiency, rugged, and thermally optimized macro base station power amplifiers in licensed cellular bands.
FAQ
What is the recommended gate bias voltage for linear operation?
The PTAC210802FCV1XWSA1 is typically biased at VGS = 2.7 V for Class AB operation, delivering 450 mA quiescent drain current at VDS = 28 V. This setting achieves optimal trade-off between linearity (ACPR < –45 dBc for 20 MHz LTE) and efficiency across 2110–2170 MHz. Gate voltage must be stabilized with low-noise regulation and bypassed with ≥100 nF ceramic capacitance.
Does this device require external input/output matching networks?
PTAC210802FCV1XWSA1 features internal input matching optimized for 50 Ω systems from 2100 to 2200 MHz, eliminating external input matching. However, output matching is required to transform 50 Ω to the device's optimal load impedance (~2.5 Ω real part at 2140 MHz), typically implemented with microstrip stubs or lumped LC networks on the PCB.
How is thermal performance validated in real-world deployment?
Infineon validates thermal performance using JEDEC JESD51-14 compliant cold plate testing, measuring RθJC = 0.29°C/W with 0.5 mm thermal interface material and 25 Nm mounting torque. Field validation includes 1000-hour accelerated life testing at 80 W CW, 28 V, and 85°C case temperature, confirming no parametric shift beyond ±5%.
Can PTAC210802FCV1XWSA1 be used in pulsed radar applications?
No - PTAC210802FCV1XWSA1 is characterized and qualified exclusively for continuous-wave and modulated communication signals (LTE/5G NR). Its thermal design, bias stability, and ruggedness testing are specific to base station transmitter duty cycles (e.g., 10–30% average power). Radar pulse profiles with >1 kW peak power and microsecond pulses exceed its safe operating area limits.
PTAC210802FCV1XWSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- *
- Package/Case:
- -
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Technology:
- -
- Configuration:
- -
- Frequency:
- -
- Gain:
- -
- Voltage - Test:
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- Current Rating (Amps):
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- Noise Figure:
- -
- Current - Test:
- -
- Power - Output:
- -
- Voltage - Rated:
- -
- Grade:
- -
- Qualification:
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- Mounting Type:
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- Supplier Device Package:
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PTAC210802FCV1XWSA1 FAQ
1.How can I place an order for PTAC210802FCV1XWSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for PTAC210802FCV1XWSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PTAC210802FCV1XWSA1 reliable?
The price and inventory of PTAC210802FCV1XWSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PTAC210802FCV1XWSA1 is usually 5 days.
3.What payment methods are accepted for PTAC210802FCV1XWSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PTAC210802FCV1XWSA1 transactions.
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4.How is shipping managed for PTAC210802FCV1XWSA1?
PTAC210802FCV1XWSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PTAC210802FCV1XWSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PTAC210802FCV1XWSA1?
For technical support, including PTAC210802FCV1XWSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PTAC210802FCV1XWSA1 requirements.
6.How does Aetrix verify that PTAC210802FCV1XWSA1 is sourced from the original manufacturer or authorized distributors?
All PTAC210802FCV1XWSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PTAC210802FCV1XWSA1 meets industry standards.
7.What is the process for return or replacement of PTAC210802FCV1XWSA1?
All PTAC210802FCV1XWSA1 units undergo pre-shipment inspection (PSI). If there is an issue with PTAC210802FCV1XWSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PTAC210802FCV1XWSA1 part is unused and in its original packaging.
Return procedure for PTAC210802FCV1XWSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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