Infineon Technologies PTF080101M V1
- Part No.:
- PTF080101M V1
- Manufacturer:
- Infineon Technologies
- Category:
- Single FETs, MOSFETs
- Package:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
PTF080101M V1.pdf
- Description:
- RF MOSFET LDMOS 28V RFP-10
- Quantity:
- Payment:

- Shipping:

Inventory:8,777
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PTF080101M from Infineon Technologies is an unmatched 10 W LDMOS RF power transistor designed for Class AB base station amplifiers in the 450–960 MHz band. It delivers 16 dB small-signal gain, 35% drain efficiency at 10 W PEP output, –28 dBc intermodulation distortion at 960 MHz, and operates with 28 V drain supply and 180 mA quiescent current. Used in cellular infrastructure transmitters requiring high linearity and thermal stability.
For engineers reviewing the PTF080101M datasheet, PTF080101M pinout, PTF080101M application, or PTF080101M equivalent, this page provides verified RF performance data, gate-source bias behavior across temperature, broadband impedance matching networks, ESD protection rating (HBM Class 1), and VSWR ruggedness (10:1 @ 28 V, 10 W CW).
Technical Context
This LDMOS FET employs a gold-metallized gate structure optimized for high-frequency RF power amplification. Its DC characteristics include 65 V drain-source breakdown voltage, 0.83 Ω on-state resistance, and 2.5–4.0 V operating gate voltage range at 180 mA IDQ. Thermal resistance is 6.5 °C/W (junction-to-case) under 10 W DC operation at TCASE = 70 °C.
The device supports EDGE modulation with 5.0 W average output, 19 dB gain, 37% efficiency, and 2.0% RMS EVM at 959.8 MHz. CW performance yields 12.5 W output at P–1dB, 18 dB gain, and 50% efficiency - confirming its suitability for both modulated and continuous-wave base station stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 450–960 MHz - covers UHF cellular bands including GSM850, GSM900, and DCS1800 uplink segments. |
| Output Power (PEP) | 10 W - rated for peak envelope power in multi-tone and modulated signal applications. |
| Small-Signal Gain | 16 dB - enables single-stage amplification in macrocell front-end designs without intermediate gain blocks. |
| Drain Efficiency | 35% at 10 W PEP - reduces thermal load and power supply demand in air-cooled outdoor base stations. |
| VSWR Tolerance | 10:1 @ 28 V, 10 W CW - ensures survivability during antenna mismatch events without external circulator protection. |
| ESD Rating | HBM Class 1 (≥2 kV) - integrated protection simplifies handling and eliminates need for external ESD diodes in PCB layout. |
| Junction Temp Limit | 150 °C - defines maximum allowable die temperature for reliability-limited lifetime in sealed enclosures. |
Pinout & Package
Package: PG-RFP-10 (molded plastic SMD, TSSOP-10 outline), dimensions 4.9 mm × 3.0 mm × 0.85 mm, with underside source connection and 10-terminal layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–5 (top side) | Gate | Parallel-connected gate fingers for low input capacitance and stable biasing; requires external gate resistor network for stability. |
| Underside | Source | Thermally and electrically common source plane - must be soldered to large copper pour for thermal dissipation and RF grounding. |
| 6–10 (top side) | Drain | Multiple drain terminals reduce parasitic inductance and improve RF power delivery to output matching network. |
Key Features
| Feature | Design Value |
|---|---|
| EDGE Modulation Support | 5.0 W avg. output, 19 dB gain, 37% efficiency, 2.0% EVM - meets 3GPP TS 45.005 spectral mask for GSM/EDGE base stations. |
| Thermal Stability | Normalized gate voltage drift < ±4% from –20 °C to +100 °C - maintains consistent bias point across environmental extremes. |
| HCI Resistance | Low hot-carrier injection drift - ensures long-term gain and efficiency retention in continuous high-power operation. |
| Pb-Free & RoHS | Compliant per EU Directive 2011/65/EU - suitable for global telecom equipment manufacturing without exemption requests. |
Applications
| GSM Base Station Transmitter | DCS1800 Uplink Amplifier |
|---|---|
|
Use Scenario: Final-stage RF power amplification in macrocell BTS cabinets operating in 880–915 MHz band. IC Role / Device Role / Timing Role: Unmatched LDMOS transistor delivering 10 W PEP into 50 Ω load with broadband matching network. Use Value: Eliminates need for external harmonic filtering due to inherent linearity (–28 dBc IMD), reducing BOM count and board area. |
Use Scenario: High-efficiency uplink PA in dual-band DCS1800/GSM900 base stations. IC Role / Device Role / Timing Role: Single-device solution covering 1710–1785 MHz DCS uplink with 16 dB gain and 35% efficiency. Use Value: Enables compact 2-layer PCB design using microstrip matching (l1–l17 reference circuit), lowering assembly cost. |
| EDGE-Compatible Remote Radio Head | Public Safety Land Mobile Radio |
|
Use Scenario: Outdoor RRH units requiring high linearity and thermal resilience in uncontrolled ambient conditions. IC Role / Device Role / Timing Role: Class AB RF power stage supporting 8-PSK EDGE modulation at 959.8 MHz with 2.0% RMS EVM. Use Value: Maintains EVM compliance over –40 °C to +85 °C case temperature via stable gate bias tracking (±4% normalized voltage). |
Use Scenario: 450–470 MHz trunked radio repeater amplifier for emergency response networks. IC Role / Device Role / Timing Role: Ruggedized final PA capable of surviving 10:1 VSWR faults without degradation. Use Value: Reduces need for directional couplers and circulators - cuts system cost and insertion loss in critical comms links. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MRF6VP2150HR5 | Higher P1dB (15 W), wider bandwidth (1.2–1.4 GHz), but lower gain (14.5 dB) and no integrated ESD protection. | Better suited for higher-frequency LTE bands; requires external HBM protection circuitry. | Select when operating above 960 MHz or needing >12 W CW output; verify thermal interface compatibility with larger RθJC (7.2 °C/W). |
| PD57018-E | Lower frequency range (10–1000 MHz), higher efficiency (42% @ 10 W), but only 12.5 dB gain and no 10:1 VSWR rating. | Optimized for wideband industrial RF heating; lacks EDGE-specific characterization data. | Prefer for fixed-frequency narrowband systems where efficiency > linearity; avoid in cellular base stations requiring spectral purity. |
Compared with MRF6VP2150HR5 and PD57018-E, the PTF080101M uniquely balances 960 MHz gain-efficiency-linearity trade-offs while offering factory-integrated ESD protection and proven VSWR ruggedness - making it optimal for cost-sensitive, thermally constrained GSM/EDGE macrocell deployments.
Availability
PTF080101M is available at Aetrix Electronics and suitable for GSM base station transmitters, DCS1800 uplink amplifiers, EDGE-compatible remote radio heads, and public safety land mobile radio repeaters requiring stable component supply and full traceability.
Supply support for PTF080101M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and RF solutions, with headquarters in Munich and global R&D centers.
The GOLDMOS® product line targets high-reliability RF power amplification in wireless infrastructure, emphasizing thermal robustness, linearity, and manufacturability for macrocell and small-cell base stations.
FAQ
What is the recommended gate bias network for PTF080101M in Class AB operation?
The datasheet specifies 2.5–4.0 V gate-source voltage at 180 mA IDQ. A stable bias uses two 5.1 kΩ resistors (R6/R7) and a 2 kΩ potentiometer (R4) for adjustment, as shown in the reference schematic on Data Sheet 5. Gate decoupling requires 0.001 µF capacitors (C1/C2/C3) placed within 2 mm of pins 1–5 to suppress VHF oscillation.
Does PTF080101M require external ESD protection in PCB layout?
No - the device integrates Human Body Model Class 1 ESD protection (≥2 kV) on gate and drain terminals. External TVS diodes are unnecessary unless system-level IEC 61000-4-2 Level 4 immunity is required, in which case discrete protection should be placed at connector interfaces, not at the transistor pins.
Can PTF080101M operate reliably at junction temperatures above 125 °C?
Yes - the absolute maximum junction temperature is 150 °C. However, lifetime testing shows accelerated HCI degradation above 135 °C. For continuous 10 W PEP operation, maintain TCASE ≤ 70 °C (via heatsink design) to ensure >10-year MTBF per Telcordia SR-332.
What is the significance of the "0081" marking on the PTF080101M package?
"0081" is the Infineon internal lot code identifier printed on the top surface of the PG-RFP-10 package. It encodes wafer batch, assembly date, and test site information - used for traceability and failure analysis, not functional differentiation from other PTF080101M units.
PTF080101M V1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GOLDMOS®
- Package/Case:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 960MHz
- Gain:
- 16dB
- Voltage - Test:
- 28 V
- Current Rating (Amps):
- 1µA
- Noise Figure:
- -
- Current - Test:
- 180 mA
- Power - Output:
- 10W
- Voltage - Rated:
- 65 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-RFP-10
PTF080101M V1 FAQ
1.How can I place an order for PTF080101M V1 through Aetrix?
Please submit a Request for Quotation (RFQ) for PTF080101M V1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PTF080101M V1 reliable?
The price and inventory of PTF080101M V1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PTF080101M V1 is usually 5 days.
3.What payment methods are accepted for PTF080101M V1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PTF080101M V1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PTF080101M V1?
PTF080101M V1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PTF080101M V1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PTF080101M V1?
For technical support, including PTF080101M V1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PTF080101M V1 requirements.
6.How does Aetrix verify that PTF080101M V1 is sourced from the original manufacturer or authorized distributors?
All PTF080101M V1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PTF080101M V1 meets industry standards.
7.What is the process for return or replacement of PTF080101M V1?
All PTF080101M V1 units undergo pre-shipment inspection (PSI). If there is an issue with PTF080101M V1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PTF080101M V1 part is unused and in its original packaging.
Return procedure for PTF080101M V1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PTF080101M V1 Tags

-
3SK294(TE85L,F)
Toshiba Semiconductor and Storage
-
SAV-551+
Mini-Circuits

-
TAV2-501+
Mini-Circuits

-
CE3514M4-C2
CEL

-
AFT05MS004NT1
NXP USA Inc.
-
SAV-541+
Mini-Circuits

-
CE3512K2-C1
CEL

-
AFM907NT1
NXP USA Inc.

-
SKY65050-372LF
Skyworks Solutions Inc.

-
CE3520K3-C1
CEL

-
AFT09MS007NT1
NXP USA Inc.

-
AFT09MS015NT1
NXP USA Inc.
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

