Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies PTFA071701FV4R250XTMA1

Part No.:
PTFA071701FV4R250XTMA1
Manufacturer:
Infineon Technologies
Category:
Single FETs, MOSFETs
Package:
2-Flatpack, Fin Leads, Flanged
Datasheet:
AetrixPTFA071701FV4R250XTMA1.pdf
Description:
RF MOSFET LDMOS 30V H-37248-2
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,508

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

PTFA071701FV4R250XTMA1 from Infineon is a 170 W, 725–770 MHz LDMOS RF power transistor in an H-37248-2 earless flange package, designed for cellular base station power amplifiers. It delivers 165 W CW output at P–1dB, 62% drain efficiency at 770 MHz, and –50 dBc ACPR under CDMA2000 conditions with 35 W average output.

For engineers reviewing the PTFA071701FV4R250XTMA1 datasheet, PTFA071701FV4R250XTMA1 pinout, PTFA071701FV4R250XTMA1 application, or PTFA071701FV4R250XTMA1 equivalent, key selection criteria include broadband internal matching (725–770 MHz), 10:1 VSWR ruggedness at 30 V/170 W CW, thermal resistance of 0.38 °C/W, and integrated Class 2 HBM ESD protection.

Technical Context

This LDMOS FET operates as a high-efficiency final-stage amplifier in macrocell and microcell base station transmitters. Its thermally-enhanced ceramic open-cavity package enables stable operation at junction temperatures up to 200 °C, while internal input/output matching simplifies PCB layout in 725–770 MHz band applications.

The device supports both CW and modulated signals including WCDMA and CDMA2000, delivering 32% drain efficiency at 40 W average output (3GPP signal, 8.1 dB PAR) and –36 dBc ACPR. Gate threshold voltage is 2.48 V typical at IDQ = 1.0 A, with RDS(on) of 0.07 Ω enabling low conduction loss.

Key Specifications

Parameter Value and Actual Design Meaning
Frequency Range 725–770 MHz: Full-band operation without external tuning for cellular infrastructure bands.
Output Power (CW, P–1dB) 165 W at 770 MHz: Enables high-linearity final-stage amplification in macrocell PA designs.
Drain Efficiency (CW) 62% at 770 MHz: Reduces thermal load and power supply requirements in high-power RF stages.
VSWR Tolerance 10:1 at 30 V / 170 W CW: Ensures robust operation under antenna mismatch conditions in deployed systems.
Thermal Resistance (RθJC) 0.38 °C/W: Supports high-power dissipation with minimal junction-to-case temperature rise.
ESD Rating HBM Class 2 (≥2 kV): Integrated protection reduces need for external ESD circuitry on gate line.
Gain (Two-tone, 765 MHz) 18.7 dB typical: Delivers sufficient small-signal gain to minimize driver stage complexity.

Pinout & Package

PTFA071701FV4R250XTMA1 uses the H-37248-2 earless flange, single-ended ceramic open-cavity package. The metal flange serves as the source terminal and thermal path; drain and gate are accessed via solderable leads.

Pin/Terminal Circuit Role Design Meaning
D (Drain) RF Power Output Terminal Soldered to output matching network; carries full RF output current and DC bias (30 V).
G (Gate) RF Input Control Terminal High-impedance control node requiring stable DC bias (2.48 V typ) and ESD protection.
S (Source) Common Reference & Thermal Path Flange-mounted to heatsink; serves as RF ground return and primary thermal conduction path.

Key Features

Feature Design Value
Broadband internal matching Eliminates discrete input/output matching components across 725–770 MHz, reducing BOM count and layout area.
Thermally-enhanced ceramic package H-37248-2 package achieves 0.38 °C/W RθJC, enabling reliable 170 W CW operation with standard heatsinking.
10:1 VSWR ruggedness Withstands severe antenna mismatches at full rated power without degradation or latch-up.
Integrated HBM Class 2 ESD protection Reduces risk of gate oxide damage during handling and assembly; no external gate protection required.
Pb-free and RoHS-compliant construction Meets global environmental compliance requirements for telecom infrastructure equipment manufacturing.

Applications

Macrocell Base Station PA Microcell Remote Radio Head

Use Scenario: Final-stage RF power amplification in outdoor macrocell base stations operating in Band 12/13/14 (725–770 MHz) for LTE and 5G NR.

IC Role / Device Role / Timing Role: High-efficiency, high-power LDMOS transistor delivering 165 W CW output with 62% efficiency.

Use Value: Enables compact, air-cooled PA modules meeting spectral mask and ACLR requirements for multi-carrier LTE deployments.

Use Scenario: Compact, thermally constrained remote radio heads (RRHs) deployed on cell towers with limited heatsink volume.

IC Role / Device Role / Timing Role: Single-ended RF power amplifier delivering 35 W average output under CDMA2000 with –50 dBc ACPR.

Use Value: Achieves required linearity and efficiency within tight thermal budgets using only 0.38 °C/W RθJC and earless flange mounting.

WCDMA Infrastructure Transmitter Multi-standard Cellular BTS

Use Scenario: 3GPP-compliant WCDMA transmitter in indoor distributed antenna systems (DAS) supporting 760/770 MHz dual-carrier signals.

IC Role / Device Role / Timing Role: Linear RF power amplifier delivering 40 W average output with –36 dBc ACPR at 8.1 dB PAR.

Use Value: Meets stringent adjacent channel leakage specifications without digital pre-distortion (DPD) overhead.

Use Scenario: Reconfigurable base station transceivers supporting LTE, WCDMA, and CDMA2000 in same hardware platform.

IC Role / Device Role / Timing Role: Broadband-matched LDMOS FET operating across 725–770 MHz with consistent gain (18.5 dB) and efficiency.

Use Value: Simplifies multi-standard PA design by eliminating band-specific matching networks and calibration steps.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power transistor applications.

Alternative Part Technical Difference Application Difference Selection Advice
PTFA071701EV4R250XTMA1 H-36248-2 slotted flange package; identical RF specs but higher RθJC (0.42 °C/W) and different mechanical mounting interface. Preferred where existing heatsink design accommodates slotted flange and higher thermal resistance is acceptable. Select when mechanical compatibility with legacy H-36248-2 fixtures is required; otherwise prefer PTFA071701F for lower RθJC.
PD85015-E 150 W, 700–800 MHz LDMOS; 0.45 °C/W RθJC; no internal matching; requires external broadband matching network. Suitable for cost-sensitive designs where PCB area allows discrete matching and thermal margin permits higher RθJC. Choose only if system-level redesign permits added matching components and thermal derating is acceptable.

Compared with PTFA071701FV4R250XTMA1, the PTFA071701E offers identical RF performance but less efficient thermal transfer, while PD85015-E trades integration for flexibility and lower peak power-making PTFA071701F optimal for space- and thermal-constrained macrocell PA modules.

Availability

PTFA071701FV4R250XTMA1 is available at Aetrix Electronics and suitable for macrocell base station power amplifiers, remote radio heads, WCDMA infrastructure transmitters, and multi-standard cellular BTS requiring stable component supply and long-term lifecycle support.

Supply support for PTFA071701FV4R250XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, RF, and automotive ICs, with leadership in high-reliability RF power transistors for telecom infrastructure.

This part belongs to Infineon's PTFA series of thermally enhanced LDMOS FETs, engineered specifically for high-efficiency, broadband cellular base station power amplifiers operating in sub-1 GHz frequency bands.

FAQ

What is the maximum continuous drain current rating for PTFA071701FV4R250XTMA1?

The device does not specify a maximum continuous drain current (ID) rating; instead, it defines safe operating limits via maximum drain-source voltage (65 V), junction temperature (200 °C), and thermal resistance (0.38 °C/W). At 30 V VDD and 170 W CW output, average drain current is approximately 5.7 A, but actual current depends on modulation and duty cycle. Designers must ensure junction temperature remains ≤200 °C under worst-case thermal conditions.

Does PTFA071701FV4R250XTMA1 require external gate bias circuitry?

Yes-while the device has a typical gate threshold voltage of 2.48 V at IDQ = 1.0 A, it requires a stable, low-noise, current-limited DC bias supply capable of delivering ~1 mA gate current. The reference design uses resistor-divider biasing with decoupling capacitors (C2, C3); active bias controllers are recommended for temperature-stable quiescent current in production systems.

Can PTFA071701FV4R250XTMA1 be used outside the 725–770 MHz band?

No-its internal matching network is optimized exclusively for 725–770 MHz. Operation outside this band results in degraded gain, efficiency, and return loss; datasheet measurements confirm usable performance only within this range. For wider bandwidth or alternate bands, Infineon's PTFA09200x or PDxx series should be evaluated.

What is the recommended PCB material and thickness for the reference circuit?

The reference design specifies Rogers RO4350B laminate, 0.76 mm (0.030") thick, with εr = 3.48 and 1 oz. copper. This material ensures controlled impedance for microstrip matching networks (e.g., l1–l12) and minimizes dielectric loss at 770 MHz. Substituting FR-4 is not recommended due to higher loss tangent and εr variation, which degrades gain flatness and efficiency.

PTFA071701FV4R250XTMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
2-Flatpack, Fin Leads, Flanged
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Technology:
LDMOS
Configuration:
-
Frequency:
765MHz
Gain:
18.7dB
Voltage - Test:
30 V
Current Rating (Amps):
-
Noise Figure:
-
Current - Test:
900 mA
Power - Output:
150W
Voltage - Rated:
65 V
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
H-37248-2

PTFA071701FV4R250XTMA1 FAQ

1.How can I place an order for PTFA071701FV4R250XTMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for PTFA071701FV4R250XTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PTFA071701FV4R250XTMA1 reliable?

The price and inventory of PTFA071701FV4R250XTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PTFA071701FV4R250XTMA1 is usually 5 days.

3.What payment methods are accepted for PTFA071701FV4R250XTMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PTFA071701FV4R250XTMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PTFA071701FV4R250XTMA1?

PTFA071701FV4R250XTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PTFA071701FV4R250XTMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PTFA071701FV4R250XTMA1?

For technical support, including PTFA071701FV4R250XTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PTFA071701FV4R250XTMA1 requirements.

6.How does Aetrix verify that PTFA071701FV4R250XTMA1 is sourced from the original manufacturer or authorized distributors?

All PTFA071701FV4R250XTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PTFA071701FV4R250XTMA1 meets industry standards.

7.What is the process for return or replacement of PTFA071701FV4R250XTMA1?

All PTFA071701FV4R250XTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with PTFA071701FV4R250XTMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PTFA071701FV4R250XTMA1 part is unused and in its original packaging.

Return procedure for PTFA071701FV4R250XTMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

PTFA071701FV4R250XTMA1 Tags

  • PTFA071701FV4R250XTMA1
  • PTFA071701FV4R250XTMA1 PDF
  • PTFA071701FV4R250XTMA1 Datasheet
  • PTFA071701FV4R250XTMA1 Specifications
  • PTFA071701FV4R250XTMA1 Images
  • Infineon Technologies
  • Infineon Technologies PTFA071701FV4R250XTMA1
  • Buy PTFA071701FV4R250XTMA1
  • PTFA071701FV4R250XTMA1 Price
  • PTFA071701FV4R250XTMA1 Distributor
  • PTFA071701FV4R250XTMA1 Supplier
  • PTFA071701FV4R250XTMA1 Wholesale
Related Products
3SK294(TE85L,F)
3SK294(TE85L,F)

Toshiba Semiconductor and Storage

SAV-551+
SAV-551+

Mini-Circuits

TAV2-501+
TAV2-501+

Mini-Circuits

CE3514M4-C2
CE3514M4-C2

CEL

AFT05MS004NT1
AFT05MS004NT1

NXP USA Inc.

SAV-541+
SAV-541+

Mini-Circuits

CE3512K2-C1
CE3512K2-C1

CEL

AFM907NT1
AFM907NT1

NXP USA Inc.

SKY65050-372LF
SKY65050-372LF

Skyworks Solutions Inc.

CE3520K3-C1
CE3520K3-C1

CEL

AFT09MS007NT1
AFT09MS007NT1

NXP USA Inc.

AFT09MS015NT1
AFT09MS015NT1

NXP USA Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER