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Infineon Technologies PTFA080551F V1

Part No.:
PTFA080551F V1
Manufacturer:
Infineon Technologies
Category:
Single FETs, MOSFETs
Package:
2-Flatpack, Fin Leads, Flanged
Datasheet:
AetrixPTFA080551F V1.pdf
Description:
RF MOSFET LDMOS 28V H-37265-2
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,014

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Product details

Overview

PTFA080551F from Infineon is a 55 W thermally-enhanced LDMOS RF power transistor for base station amplifiers in 869–960 MHz CDMA and EDGE systems, operating at 28 V with 450 mA quiescent drain current, delivering 26 W average output power, 18 dB gain, and 44% drain efficiency under EDGE modulation.

For engineers reviewing the PTFA080551F datasheet, PTFA080551F pinout, PTFA080551F application, or PTFA080551F equivalent, this device requires attention to thermal interface design, broadband impedance matching (Zsource ≈ 6 Ω –j5.6 Ω / Zload ≈ 4.9 Ω +j0.9 Ω at 960 MHz), VSWR tolerance (10:1 @ 55 W CW), and gate bias stability across temperature.

Technical Context

This LDMOS FET employs a single-ended, slotted-flange-compatible package (Outline 31265) with full gold metallization and integrated ESD protection (HBM Class 2). Its internal matching enables broadband operation without external input matching networks across 869–960 MHz.

Designed for high-linearity, multi-carrier CDMA2000 and EDGE base station final-stage amplification, it delivers –31 dBc third-order IMD at 55 W PEP and maintains <2.5% RMS EVM at 26 W average output under 959.8 MHz EDGE modulation with 400 kHz/600 kHz ACPR of –60 dBc/–75 dBc.

Key Specifications

ParameterValue and Actual Design Meaning
Output Power (EDGE Avg.)26 W - Sustained linear output for three-carrier CDMA2000 and EDGE with <2.5% EVM
Gain18 dB - Enables single-stage PA design with minimal driver stage complexity
Drain Efficiency44% - Reduces thermal load and DC power consumption in 28 V macrocell systems
P–1dB (CW)75 W - Supports peak power headroom for burst-mode and transient signal envelopes
VBRDSS65 V - Withstands 10:1 VSWR at 28 V supply without failure
RθJC0.8 °C/W - Enables high-power operation with case temperature ≤70°C using standard heatsink interfaces
IMD (3rd order)–31 dBc - Meets spectral mask requirements for adjacent channel leakage in multi-tone CDMA

Pinout & Package

PTFA080551F uses thermally-enhanced earless flange package (Outline 31265), with metalized flange serving as drain terminal and thermal path. The package features three leads: Gate (G), Source (S), Drain (D).

Pin/TerminalCircuit RoleDesign Meaning
Drain (Flange)High-current RF output node and primary thermal conduction pathMust be soldered to copper heatsink area ≥250 mm² with thermal interface material; electrically tied to RF output matching network ground
GateRF input control terminalBias-sensitive node requiring stable 2.3 V ±0.5 V DC gate voltage and low-inductance RF coupling; protected by integrated HBM Class 2 ESD structure
SourceRF return and DC reference nodeConnected directly to ground plane; serves as common reference for gate bias and RF feedback paths in broadband amplifier layouts

Key Features

FeatureDesign Value
Broadband internal matchingEliminates discrete input matching components across 869–960 MHz, reducing PCB area and tuning complexity
10:1 VSWR ruggednessOperates safely at 55 W CW into extreme mismatch without degradation-critical for antenna system fault tolerance
Thermal resistance (RθJC)0.8 °C/W enables 219 W total dissipation at TCASE = 70°C, supporting high-reliability macrocell deployment
Full gold metallizationEnsures >1 million hour MTTF under continuous 28 V, 450 mA bias at 70°C case temperature
Pb-free & RoHS complianceMeets JEDEC J-STD-020 reflow profile and industrial environmental compliance requirements

Applications

CDMA2000 Base Station PAEDGE Macrocell Transmitter

Use Scenario: Three-carrier CDMA2000 final-stage power amplifier in outdoor macrocell BTS cabinets operating at 960 MHz with 55 W PEP requirement.

IC Role / Device Role / Timing Role: High-efficiency RF power transistor delivering linearized output with –31 dBc IMD and <0.5 dB gain flatness over bandwidth.

Use Value: Enables carrier aggregation without external predistortion, reducing system BOM cost and calibration overhead.

Use Scenario: EDGE-compliant 8-PSK transmitter for GSM/EDGE dual-mode base stations handling 26 W average output at 959.8 MHz.

IC Role / Device Role / Timing Role: Final-stage LDMOS amplifier maintaining <2.5% RMS EVM and –60 dBc ACPR at 400 kHz offset.

Use Value: Eliminates need for external digital pre-distortion (DPD) in mid-tier BTS deployments.

Multi-Band Cellular InfrastructureHigh-VSWR Antenna System PA

Use Scenario: Shared RF front-end amplifier covering 869–960 MHz band in multi-standard (CDMA/EDGE/GSM) macro base stations.

IC Role / Device Role / Timing Role: Broadband matched transistor supporting 100 MHz instantaneous bandwidth with <0.3 dB gain variation.

Use Value: Reduces need for band-switching filters and enables software-defined radio (SDR) architecture scalability.

Use Scenario: Remote radio head (RRH) PA exposed to antenna VSWR fluctuations up to 10:1 due to environmental icing or connector wear.

IC Role / Device Role / Timing Role: Ruggedized LDMOS transistor surviving sustained 10:1 VSWR at 55 W CW without parameter shift or latch-up.

Use Value: Extends field maintenance intervals and eliminates VSWR foldback circuitry in compact RRH designs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power transistor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MRF6P20140HR5Higher P1dB (140 W), wider bandwidth (1.8–2.2 GHz), but lower efficiency (38%) at 960 MHz and no integrated ESD protectionTargeted for LTE 2.1 GHz macrocells; requires external ESD diodes and more complex thermal managementSelect when higher output headroom is needed and system operates above 1.8 GHz
PD57018-ELower P1dB (18 W), optimized for 700–960 MHz Doherty architectures, includes integrated gate resistor (10 Ω) for stabilitySuitable for energy-efficient microcell Doherty PAs; not rated for 10:1 VSWR survivalSelect for space-constrained microcells where efficiency >55% at back-off is prioritized over ruggedness

Compared with MRF6P20140HR5 and PD57018-E, PTFA080551F uniquely balances 55 W broadband linearity, 10:1 VSWR ruggedness, and integrated ESD protection-making it optimal for cost-sensitive, high-reliability 900 MHz macrocell deployments where thermal and mismatch resilience are non-negotiable.

Availability

PTFA080551F is available at Aetrix Electronics and suitable for CDMA2000 base station power amplifiers, EDGE macrocell transmitters, and high-VSWR antenna system PAs requiring stable component supply across extended production lifecycles.

Supply support for PTFA080551F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, RF, and automotive ICs, with leadership in high-voltage and high-frequency silicon and GaN solutions.

The PTFA series belongs to Infineon's GOLDMOS® LDMOS product line, engineered specifically for cellular infrastructure power amplifiers demanding high reliability, broadband linearity, and thermal robustness in 700–2700 MHz base station applications.

FAQ

What is the recommended gate bias voltage for PTFA080551F in EDGE operation?

The datasheet specifies a typical gate-source voltage of 2.3 V at VDD = 28 V and IDQ = 450 mA. This value is temperature-stable within ±3% from –20°C to +100°C case temperature, and must be set using a low-noise, low-drift bias network to maintain EVM <2.5% under 8-PSK modulation.

Can PTFA080551F be used in Doherty amplifier configurations?

Yes-its broadband internal matching, symmetric gain compression, and 0.8 °C/W thermal resistance make it suitable as a main or peaking amplifier in Doherty topologies. Application Note AN331 from Infineon provides layout guidelines and load-pull data for 960 MHz Doherty implementation with this device.

What is the maximum safe operating junction temperature?

The absolute maximum junction temperature is 200°C, but the device is characterized and qualified for continuous operation up to TJ = 175°C. Derating begins above TCASE = 70°C at 1.25 W/°C, and thermal design must ensure TJ ≤ 175°C under worst-case RF and ambient conditions.

Does PTFA080551F require external input matching networks?

No-its internal broadband matching covers 869–960 MHz with <0.5 dB gain variation, eliminating discrete input matching components. However, output matching remains application-specific; the datasheet provides Zsource and Zload impedances at 960 MHz to guide external output network design.

PTFA080551F V1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
2-Flatpack, Fin Leads, Flanged
Packaging:
Tray
Product Status:
Discontinued at Digi-Key
Technology:
LDMOS
Configuration:
-
Frequency:
960MHz
Gain:
18.5dB
Voltage - Test:
28 V
Current Rating (Amps):
10µA
Noise Figure:
-
Current - Test:
600 mA
Power - Output:
55W
Voltage - Rated:
65 V
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
H-37265-2

PTFA080551F V1 FAQ

1.How can I place an order for PTFA080551F V1 through Aetrix?

Please submit a Request for Quotation (RFQ) for PTFA080551F V1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PTFA080551F V1 reliable?

The price and inventory of PTFA080551F V1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PTFA080551F V1 is usually 5 days.

3.What payment methods are accepted for PTFA080551F V1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PTFA080551F V1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PTFA080551F V1?

PTFA080551F V1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PTFA080551F V1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PTFA080551F V1?

For technical support, including PTFA080551F V1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PTFA080551F V1 requirements.

6.How does Aetrix verify that PTFA080551F V1 is sourced from the original manufacturer or authorized distributors?

All PTFA080551F V1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PTFA080551F V1 meets industry standards.

7.What is the process for return or replacement of PTFA080551F V1?

All PTFA080551F V1 units undergo pre-shipment inspection (PSI). If there is an issue with PTFA080551F V1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PTFA080551F V1 part is unused and in its original packaging.

Return procedure for PTFA080551F V1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

PTFA080551F V1 Tags

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