Infineon Technologies PTFA192001EV4XWSA1
- Part No.:
- PTFA192001EV4XWSA1
- Manufacturer:
- Infineon Technologies
- Category:
- Single FETs, MOSFETs
- Package:
- H-36260-2
- Datasheet:
-
PTFA192001EV4XWSA1.pdf
- Description:
- RF MOSFET LDMOS 30V H-36260-2
- Quantity:
- Payment:

- Shipping:

Inventory:9,524
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PTFA192001EV4XWSA1 from Infineon is a thermally-enhanced 200 W LDMOS RF power transistor designed for single- and two-carrier WCDMA base station final-stage amplification in the 1930–1990 MHz band. It delivers 48.5 dBm average output power, 15.9 dB linear gain, and 34% drain efficiency at 1960 MHz under 3GPP WCDMA signal (P/AR = 7.5 dB), with integrated ESD protection (HBM Class 2) and 5:1 VSWR ruggedness.
For engineers reviewing the PTFA192001EV4XWSA1 datasheet, PTFA192001EV4XWSA1 pinout, PTFA192001EV4XWSA1 application, or PTFA192001EV4XWSA1 equivalent, key selection criteria include broadband internal matching, thermal resistance of 0.28 °C/W (at 200 W CW), junction temperature rating up to 200 °C, and verified two-tone IMD performance of –30 dBc at 1960 MHz.
Technical Context
This device operates as a high-efficiency RF power amplifier stage in macrocell and distributed antenna systems, biased at VDD = 30 V and IDQ = 1.6–1.8 A. Its LDMOS process enables stable gain flatness (±0.6 dB) across 1860–2040 MHz and low HCI drift under sustained RF stress.
The H-36260-2 package features a slotted flange for mechanical mounting and thermal interface optimization, supporting DC-to-RF coupling via microstrip reference design on Rogers RO4350B substrate (εr = 3.48). Input/output matching networks are integrated, eliminating external tuning for standard 50 Ω systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Average Output Power | 48.5 dBm (70 W avg) at 1960 MHz, single-carrier WCDMA - sufficient for 3GPP-compliant 20 MHz channel deployment |
| Linear Gain | 15.9 dB typical - enables direct drive from driver-stage ICs without intermediate gain stages |
| Drain Efficiency | 34% at POUT = 48.5 dBm - reduces thermal load and power supply sizing in multi-carrier PA modules |
| IMD (Two-Tone) | –30 dBc at 200 W PEP - meets spectral mask requirements for adjacent-channel leakage in cellular infrastructure |
| VBR(DSS) | 65 V - supports safe operation under 30 V rail with margin for transient overvoltage and VSWR-induced voltage doubling |
| RθJC | 0.28 °C/W - enables compact heatsink design for 200 W CW dissipation at case temperature ≤70 °C |
| VSWR Tolerance | 5:1 @ 30 V, 200 W CW - ensures survivability during antenna mismatch events without gate damage or thermal runaway |
Pinout & Package
H-36260-2 is a thermally-enhanced, slotted-flange, single-ended RF power package with copper-molybdenum-copper (CuMoCu) baseplate and solderable source-tab for low-inductance grounding and efficient heat transfer. The flange is electrically connected to the source terminal.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Source (Flange) | Power Ground / Thermal Path | Directly mounted to heatsink; serves as primary RF ground return and thermal conduction path (RθJC = 0.28 °C/W) |
| Gate | RF Input Control | High-impedance control node requiring DC blocking and ESD protection; bias set by external network to VGS = 2.5 V typ |
| Drain | RF Output Power Node | High-current RF output terminal; connects to output matching network and DC feed choke; rated for 65 V breakdown |
Key Features
| Feature | Design Value |
|---|---|
| Broadband internal matching | Integrated input/output impedance transformation eliminates discrete matching components across 1860–2040 MHz |
| Thermally-enhanced slotted flange | CuMoCu baseplate with optimized slot geometry improves thermal interface compliance and reduces mounting torque sensitivity |
| ESD protection (HBM Class 2) | Withstands ≥2 kV human-body-model discharge without parameter shift - reduces handling-related field failures |
| 5:1 VSWR ruggedness | Operates safely into severe antenna mismatches without gate oxide rupture or thermal runaway at full 200 W CW |
| Low HCI drift | Stable transconductance and gain over 10,000 hours at TJ = 150 °C - ensures long-term linearity in unattended base stations |
Applications
| Macrocell Base Station PA | Distributed Antenna System (DAS) Headend |
|---|---|
Use Scenario: Final-stage RF power amplification in outdoor 3-sector macrocell sites operating WCDMA FDD Band I (1920–1980 MHz). IC Role / Device Role / Timing Role: High-efficiency, high-linearity RF power transistor delivering 70 W average output per carrier under 3GPP-compliant signals. Use Value: Enables 30% higher output power density vs. prior-generation LDMOS while maintaining ACPR < –40 dBc at 5 MHz offset. | Use Scenario: Centralized RF signal boosting in indoor DAS hubs serving large venues with multi-band coverage. IC Role / Device Role / Timing Role: Linear PA stage amplifying composite WCDMA signals before passive distribution to remote antenna units. Use Value: Delivers –36 dBc IM3 at 50 W avg output, meeting stringent intermodulation requirements for co-located multi-operator DAS deployments. |
| WCDMA Repeater System | Test & Calibration Bench Amplifier |
Use Scenario: Bidirectional uplink/downlink amplification in analog/digital cellular repeaters deployed in rural coverage gaps. IC Role / Device Role / Timing Role: High-reliability RF power device handling simultaneous dual-band operation with 5:1 VSWR tolerance. Use Value: Survives indefinite operation into poorly matched donor antennas without derating or protection circuitry. | Use Scenario: Lab-grade signal generation and distortion testing using calibrated CW and modulated waveforms. IC Role / Device Role / Timing Role: Reference RF power source delivering repeatable 240 W P1dB output with < ±0.2 dB gain stability over temperature. Use Value: Provides traceable, low-drift output for ACPR, EVM, and spectral regrowth validation per 3GPP TS 25.104. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PTFA192001FV4XWSA1 | Same die, earless flange (H-37260-2); RθJC = 0.30 °C/W; identical RF specs | Preferred where mechanical clearance prohibits flange slots or where automated screw-mounting is used | Select when board layout requires symmetric flange footprint or compatibility with standard heatsink clamps |
| PD57018-E | 180 W, 1930–2110 MHz; 15.5 dB gain; 32% efficiency at 48 dBm; different pinout and bias network | Optimized for LTE Band 1/2/25; lower power but broader bandwidth and improved thermal cycling reliability | Choose for new LTE-focused designs requiring extended frequency coverage and JEDEC JESD22-A108F qualification |
Compared with PTFA192001FV4XWSA1, this part offers slightly better thermal resistance and mechanical mounting flexibility; versus PD57018-E, it delivers +0.5 dB gain and +0.5 dBm output at WCDMA-specific frequencies but lacks LTE-optimized linearity and qualification data.
Availability
PTFA192001EV4XWSA1 is available at Aetrix Electronics and suitable for macrocell base station PA, DAS headend amplification, and WCDMA repeater systems requiring stable component supply and legacy infrastructure support.
Supply support for PTFA192001EV4XWSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, RF, and automotive ICs, with leadership in high-voltage and high-frequency silicon and GaN solutions.
This part belongs to Infineon's PTFA series of thermally robust LDMOS RF power transistors, engineered specifically for cellular infrastructure applications demanding high linearity, ruggedness, and long-term reliability under continuous RF stress.
FAQ
What is the recommended gate bias voltage for PTFA192001EV4XWSA1 in WCDMA operation?
The typical gate-source voltage is 2.5 V at IDQ = 1.8 A and VDD = 30 V. This value is confirmed in the DC characteristics table (VGS = 2.0–3.0 V range) and validated across temperature in the bias voltage vs. temperature plot. Stable operation requires a low-noise, well-regulated bias supply with < 10 mV ripple to prevent gain modulation.
Can PTFA192001EV4XWSA1 be used in LTE applications?
Yes - its 1930–1990 MHz small-signal gain flatness (±0.6 dB) and ACPR performance (–41 dBc at 5 MHz offset) meet LTE Band 1 (1920–1980 MHz) requirements. However, it was characterized for WCDMA; LTE-specific linearity validation (EVM, ACLR) must be performed in the target application circuit per 3GPP TS 36.104.
What is the maximum safe operating drain current at 25°C case temperature?
At TCASE = 25°C, the absolute maximum drain current is limited by the 625 W total device dissipation rating and VDD = 30 V, yielding ID(max) ≈ 20.8 A. However, the datasheet specifies IDQ = 1.6–1.8 A for linear operation; pulsed or CW operation above 2.2 A risks exceeding junction temperature limits unless heatsinking is significantly enhanced.
Is the H-36260-2 package RoHS-compliant?
Yes - the datasheet explicitly states "Pb-free, RoHS-compliant and thermally-enhanced packages" for both PTFA192001E and PTFA192001F variants. The flange plating and die attach materials meet EU Directive 2011/65/EU Annex II substance restrictions, including Cd, Pb, Hg, Cr(VI), PBB, and PBDE.
PTFA192001EV4XWSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- H-36260-2
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 1.99GHz
- Gain:
- 15.9dB
- Voltage - Test:
- 30 V
- Current Rating (Amps):
- 10µA
- Noise Figure:
- -
- Current - Test:
- 1.8 A
- Power - Output:
- 50W
- Voltage - Rated:
- 65 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- H-36260-2
PTFA192001EV4XWSA1 FAQ
1.How can I place an order for PTFA192001EV4XWSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for PTFA192001EV4XWSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PTFA192001EV4XWSA1 reliable?
The price and inventory of PTFA192001EV4XWSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PTFA192001EV4XWSA1 is usually 5 days.
3.What payment methods are accepted for PTFA192001EV4XWSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PTFA192001EV4XWSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PTFA192001EV4XWSA1?
PTFA192001EV4XWSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PTFA192001EV4XWSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PTFA192001EV4XWSA1?
For technical support, including PTFA192001EV4XWSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PTFA192001EV4XWSA1 requirements.
6.How does Aetrix verify that PTFA192001EV4XWSA1 is sourced from the original manufacturer or authorized distributors?
All PTFA192001EV4XWSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PTFA192001EV4XWSA1 meets industry standards.
7.What is the process for return or replacement of PTFA192001EV4XWSA1?
All PTFA192001EV4XWSA1 units undergo pre-shipment inspection (PSI). If there is an issue with PTFA192001EV4XWSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PTFA192001EV4XWSA1 part is unused and in its original packaging.
Return procedure for PTFA192001EV4XWSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PTFA192001EV4XWSA1 Tags

-
3SK294(TE85L,F)
Toshiba Semiconductor and Storage
-
SAV-551+
Mini-Circuits

-
TAV2-501+
Mini-Circuits

-
CE3514M4-C2
CEL

-
AFT05MS004NT1
NXP USA Inc.
-
SAV-541+
Mini-Circuits

-
CE3512K2-C1
CEL

-
AFM907NT1
NXP USA Inc.

-
SKY65050-372LF
Skyworks Solutions Inc.

-
CE3520K3-C1
CEL

-
AFT09MS007NT1
NXP USA Inc.

-
AFT09MS015NT1
NXP USA Inc.
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

