Infineon Technologies PTFA192401EV4R250FTMA1
- Part No.:
- PTFA192401EV4R250FTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Single FETs, MOSFETs
- Package:
- H-36260-2
- Datasheet:
-
PTFA192401EV4R250FTMA1.pdf
- Description:
- RF MOSFET LDMOS 30V H-36260-2
- Quantity:
- Payment:

- Shipping:

Inventory:2,689
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Product details
Overview
PTFA192401EV4R250FTMA1 from Infineon is a thermally-enhanced 240 W LDMOS RF power transistor for single- and two-carrier WCDMA/CDMA base station final-stage amplification at 1930–1990 MHz. It delivers 49 dBm average output power, 16 dB linear gain, and 33% drain efficiency under 3GPP WCDMA conditions (30 V, PAR = 8.5 dB), with integrated ESD protection (HBM Class 2) and 5:1 VSWR ruggedness.
For engineers reviewing the PTFA192401EV4R250FTMA1 datasheet, PTFA192401EV4R250FTMA1 pinout, PTFA192401EV4R250FTMA1 application, or PTFA192401EV4R250FTMA1 equivalent, this device is selected for high-linearity, high-efficiency RF power amplification in macrocell and remote radio head (RRH) transceivers where thermal stability, broadband matching, and intermodulation performance are critical.
Technical Context
This LDMOS FET operates as a Class AB RF power amplifier stage with fixed gate bias (VGS = 2.5 V typ. at IDQ = 1.6 A), optimized for 30 V DC supply and broadband impedance matching (Zin ≈ 7.6 Ω – j7.5 Ω, Zout ≈ 0.76 Ω + j3.84 Ω at 1960 MHz). Its internal matching eliminates external input/output tuning networks in typical 1960 MHz reference designs.
The device uses Infineon's advanced LDMOS process to achieve low HCI drift, RθJC = 0.23 °C/W, and junction temperature rating up to 200 °C-enabling stable operation under high-PAR WCDMA signals and sustained 240 W CW output with 54% efficiency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 1930–1990 MHz: Covers full WCDMA Band II (1930–1990 MHz) and CDMA PCS uplink band. |
| Avg. Output Power (WCDMA) | 49 dBm (794 mW avg): Sustains 50 W average output under 3GPP TM1 signal with 8.5 dB PAR. |
| Linear Gain | 16 dB: Enables single-stage PA design without driver gain staging in many macrocell architectures. |
| Drain Efficiency | 33% (WCDMA), 54% (CW): Reduces thermal load and DC power consumption in continuous high-power operation. |
| ACPR @ 5 MHz Offset | –33 dBc (WCDMA): Meets 3GPP spectral mask requirements for adjacent channel leakage. |
| VSWR Tolerance | 5:1 @ 30 V, 240 W CW: Ensures survivability during antenna mismatch events without protection circuitry. |
| RθJC | 0.23 °C/W: Allows direct mounting to heatsink with minimal thermal interface resistance for high-power density layouts. |
Pinout & Package
PTFA192401EV4R250FTMA1 is housed in the H-36260-2 thermally-enhanced slotted-flange package-a metal-ceramic hybrid with isolated source tab, flanged base for mechanical mounting and thermal conduction, and three terminals: Drain (flange), Source (tab), and Gate (lead).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Flange) | High-current RF output node | Electrically and thermally connected to heatsink; requires RF grounding via mounting screws and thermal interface material. |
| Source (Tab) | RF return path and DC current sink | Isolated metal tab for PCB ground plane connection; enables source-degeneration stability without bond-wire inductance. |
| Gate (Lead) | DC bias and RF input control | Small-signal lead requiring 50 Ω microstrip feed; gate voltage set to ~2.5 V for 1.6 A quiescent current. |
Key Features
| Feature | Design Value |
|---|---|
| Broadband internal matching | Eliminates discrete matching networks across 1930–1990 MHz, reducing BOM count and layout sensitivity. |
| Thermally-enhanced slotted flange | H-36260-2 package achieves 0.23 °C/W junction-to-case resistance, enabling compact heatsink integration. |
| Integrated ESD protection | HBM Class 2 (≥2 kV) built-in gate protection avoids need for external TVS diodes in RF input path. |
| 5:1 VSWR ruggedness | Withstands antenna detuning or cable faults at full 240 W CW without latch-up or degradation. |
| Low HCI drift | Stable gain and efficiency over lifetime under high-channel-count WCDMA stress conditions. |
Applications
| Macrocell Base Station PA | Remote Radio Head (RRH) |
|---|---|
Use Scenario: Final-stage RF power amplification in outdoor macrocell BTS cabinets operating on WCDMA Band II (1930–1990 MHz). IC Role / Device Role / Timing Role: High-efficiency, high-linearity LDMOS transistor delivering 50 W average output into 50 Ω load with <–33 dBc ACPR. Use Value: Enables single-transistor PA stage with 33% efficiency and 16 dB gain, reducing system complexity and thermal management overhead. | Use Scenario: Compact, air-cooled RF power stage in distributed RRH units mounted on cell towers. IC Role / Device Role / Timing Role: Thermally robust final amplifier handling 8.5 dB PAR WCDMA signals with 0.23 °C/W RθJC for passive heatsinking. Use Value: Supports fanless RRH designs by maintaining <100 °C case temperature at 50 W avg output under ambient ≤60 °C. |
| CDMA PCS Uplink Amplifier | Multi-Carrier WCDMA Test Fixture |
Use Scenario: Linear uplink PA in CDMA2000 base stations covering 1930–1990 MHz PCS band. IC Role / Device Role / Timing Role: Single-carrier amplifier delivering 49 dBm with –35 dBc IMD and 16 dB gain at 30 V supply. Use Value: Meets IS-97/IS-2000 spectral purity requirements without predistortion, simplifying RF front-end calibration. | Use Scenario: Reference amplifier in lab test fixtures for validating WCDMA PA linearity and efficiency metrics. IC Role / Device Role / Timing Role: Characterized two-tone and modulated signal platform with verified –36 dBc IMD and –41 dBc ACPR at 1960 MHz. Use Value: Provides traceable benchmark performance for PA design validation against 3GPP Release 99/4 specifications. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PTFA192401FV4R250FTMA1 | H-37260-2 earless flange package; identical RF specs but different mechanical mounting and thermal interface geometry. | Preferred for automated assembly lines requiring no flange slot alignment; slightly higher RθJC (0.25 °C/W). | Select when board-level automation or space-constrained heatsink interfaces favor earless flange form factor. |
| PD57018-E | STMicroelectronics 200 W LDMOS; 1930–1990 MHz, 48 dBm avg output, 31% efficiency, RθJC = 0.26 °C/W, H-36260-2 compatible footprint. | Limited production status; lacks documented 5:1 VSWR rating and HBM Class 2 ESD integration. | Consider only if Infineon supply continuity is constrained; verify VSWR ruggedness and ESD margin in final design. |
Compared with PTFA192401FV4R250FTMA1, the subject part offers lower thermal resistance and proven slotted-flange reliability in fielded macrocell systems; versus PD57018-E, it provides superior VSWR tolerance and integrated ESD protection-critical for unattended outdoor deployments.
Availability
PTFA192401EV4R250FTMA1 is available at Aetrix Electronics and suitable for macrocell base stations, remote radio heads, CDMA uplink amplifiers, and RF test instrumentation requiring stable component supply, long-lifecycle support, and traceable sourcing for telecom infrastructure programs.
Supply support for PTFA192401EV4R250FTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, RF, automotive, and security ICs, with leadership in high-voltage and high-frequency silicon and GaN power devices.
This part belongs to Infineon's PTFA series of thermally-enhanced LDMOS RF power transistors, designed specifically for 3G/4G cellular infrastructure amplifiers demanding high efficiency, linearity, and ruggedness in harsh thermal environments.
FAQ
What is the recommended gate bias voltage and quiescent current for PTFA192401EV4R250FTMA1?
The device is characterized at VGS = 2.5 V (typical) to achieve IDQ = 1600 mA under VDD = 30 V. Bias must be stabilized using low-temperature-coefficient resistors or active regulation, as gate threshold exhibits ±0.5 V variation across temperature and unit-to-unit. The reference circuit uses a 2 kΩ potentiometer (R8) for fine-tuning.
Does PTFA192401EV4R250FTMA1 require external input/output matching networks?
No-this device features broadband internal matching optimized for 1930–1990 MHz. The reference design (Data Sheet p.7) shows only DC blocking and decoupling components; no discrete matching inductors or capacitors are needed at RF input or output ports for standard 50 Ω system integration.
What is the maximum safe operating drain-source voltage for continuous operation?
VDSS is rated at 65 V, but safe continuous operation requires limiting VDS to ≤30 V under all conditions-including transient overshoots-due to the specified 30 V DC supply and thermal derating curve (761 W max dissipation, derated 4.35 W/°C above 25°C case temperature).
How is thermal performance validated for PTFA192401EV4R250FTMA1 in real-world deployment?
Thermal resistance RθJC = 0.23 °C/W is measured per JESD51-14 with TCASE = 70°C and 50 W WCDMA output. Field validation includes 1000-hour accelerated life testing at 150°C junction temperature and 5:1 VSWR stress cycles, confirming <1% gain shift and no parametric drift under telecom-grade reliability standards.
PTFA192401EV4R250FTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- H-36260-2
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 1.96GHz
- Gain:
- 16dB
- Voltage - Test:
- 30 V
- Current Rating (Amps):
- 10µA
- Noise Figure:
- -
- Current - Test:
- 1.6 A
- Power - Output:
- 50W
- Voltage - Rated:
- 65 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- H-36260-2
PTFA192401EV4R250FTMA1 FAQ
1.How can I place an order for PTFA192401EV4R250FTMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for PTFA192401EV4R250FTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PTFA192401EV4R250FTMA1 reliable?
The price and inventory of PTFA192401EV4R250FTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PTFA192401EV4R250FTMA1 is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PTFA192401EV4R250FTMA1 transactions.
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PTFA192401EV4R250FTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PTFA192401EV4R250FTMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PTFA192401EV4R250FTMA1?
For technical support, including PTFA192401EV4R250FTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PTFA192401EV4R250FTMA1 requirements.
6.How does Aetrix verify that PTFA192401EV4R250FTMA1 is sourced from the original manufacturer or authorized distributors?
All PTFA192401EV4R250FTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PTFA192401EV4R250FTMA1 meets industry standards.
7.What is the process for return or replacement of PTFA192401EV4R250FTMA1?
All PTFA192401EV4R250FTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with PTFA192401EV4R250FTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PTFA192401EV4R250FTMA1 part is unused and in its original packaging.
Return procedure for PTFA192401EV4R250FTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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