Infineon Technologies PTFA212001EV4XWSA1
- Part No.:
- PTFA212001EV4XWSA1
- Manufacturer:
- Infineon Technologies
- Category:
- Single FETs, MOSFETs
- Package:
- H-36260-2
- Datasheet:
-
PTFA212001EV4XWSA1.pdf
- Description:
- RF MOSFET LDMOS 30V H-36260-2
- Quantity:
- Payment:

- Shipping:

Inventory:5,183
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PTFA212001EV4XWSA1 from Infineon Technologies is a 30 V, 180 W RF power LDMOS transistor in H-36260-2 package, optimized for 2.1–2.2 GHz cellular base station amplifiers with 15 dB gain and 65% drain efficiency at 2.14 GHz. It serves as the final-stage RF power amplifier in macrocell BTS transmitters.
For engineers reviewing the PTFA212001EV4XWSA1 datasheet, PTFA212001EV4XWSA1 pinout, PTFA212001EV4XWSA1 application, or PTFA212001EV4XWSA1 equivalent, key selection criteria include P1dB (180 W), frequency range (2.1–2.2 GHz), thermal resistance (0.22 °C/W), gate bias stability, and ruggedness under VSWR ≥10:1 load mismatch.
Technical Context
This LDMOS device employs a single-ended, common-source configuration with integrated ESD protection on gate terminals. Its silicon-on-ceramic substrate enables high thermal conductivity and stable operation under continuous-wave and modulated LTE/5G NR signal conditions.
The transistor supports Class AB biasing with VGS = −1.7 V typical and VDS = 30 V supply. It delivers linearized output up to 80 MHz instantaneous bandwidth when paired with digital predistortion (DPD) in multi-carrier systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| P1dB Output Power | 180 W at 2.14 GHz - usable saturated RF output for 4×20 MHz LTE carriers in macrocell PA stage |
| Gain | 15 dB at 2.14 GHz - sufficient single-stage gain to minimize cascade stages in remote radio head designs |
| Drain Efficiency | 65% at P1dB - reduces heat sink size and system-level power conversion losses |
| Thermal Resistance RthJC | 0.22 °C/W - enables direct mounting to copper baseplate without thermal interface material degradation |
| Frequency Range | 2.1–2.2 GHz - aligned with Band 1 (2100 MHz) and n1/n41 5G FR1 allocations |
| VSWR Tolerance | Rugged to 10:1 - maintains reliability during antenna detuning or cable fault events in outdoor deployments |
Pinout & Package
H-36260-2 is a ceramic/metal flanged package with solderable baseplate, designed for high-power RF applications requiring low-inductance source grounding and repeatable thermal path control. Dimensions: 36.0 mm × 26.0 mm × 4.0 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Flange) | High-current RF output node | Electrically and thermally connected to heatsink; requires low-impedance RF ground plane beneath |
| Source (Pin 1) | RF return path and DC reference | Internally bonded to flange; must be shorted to ground plane via multiple vias within 2 mm |
| Gate (Pin 2) | RF input control terminal | ESD-protected; requires 50 Ω matched input network and DC blocking before driver stage |
Key Features
| Feature | Design Value |
|---|---|
| Integrated ESD protection | Robust gate withstands >2 kV HBM without external TVS, reducing BOM count in front-end matching networks |
| Enhanced ruggedness | Survives 10:1 VSWR at full power across 2.1–2.2 GHz, eliminating need for circulators in cost-sensitive BTS designs |
| Low thermal resistance | 0.22 °C/W junction-to-case enables 100% derating at 85°C ambient without forced air cooling |
| Optimized for DPD | AM-PM distortion <10° at 9 dB OBO supports 5G NR 100-MHz channel bandwidth with <−45 dBc ACLR |
Applications
| Macrocell Base Station PA | 5G Massive MIMO Active Antenna Unit |
|---|---|
Use Scenario: High-power final-stage amplifier in 3-sector macrocell BTS operating in Band 1 (2110–2170 MHz). IC Role / Device Role / Timing Role: RF power transistor delivering 180 W P1dB with 15 dB small-signal gain and 65% efficiency. Use Value: Enables single-transistor PA architecture per sector, reducing component count and thermal management complexity versus multi-device combiners. | Use Scenario: Transmit chain amplifier in 64T64R active antenna unit supporting 5G NR FR1 with 100 MHz channel bandwidth. IC Role / Device Role / Timing Role: Linearized RF power stage biased in Class AB and corrected by DPD for EVM <3.5% at 256-QAM. Use Value: Meets ACLR <−45 dBc and spectral mask compliance without external harmonic filtering due to inherent linearity and harmonic suppression. |
| Remote Radio Head (RRH) | Private LTE/5G Network Infrastructure |
Use Scenario: Compact, air-cooled RRH deployed on utility poles or building rooftops with ambient temperature up to 65°C. IC Role / Device Role / Timing Role: Final-stage LDMOS transistor operating at 30 V supply with 0.22 °C/W RthJC. Use Value: Eliminates need for heatsink fans or liquid cooling, enabling IP65-rated passive enclosure design and lower maintenance cost. | Use Scenario: Indoor/outdoor private network base station for industrial automation, mining, or port logistics using licensed 2.1 GHz spectrum. IC Role / Device Role / Timing Role: Ruggedized RF power amplifier tolerant to 10:1 VSWR and transient overvoltage events in harsh EMI environments. Use Value: Ensures link uptime during antenna corrosion or connector moisture ingress without PA shutdown or burnout. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP MRFE6VP61K25HR5 | Higher P1dB (250 W), wider bandwidth (1.8–2.3 GHz), but higher RthJC (0.28 °C/W) | Better suited for wideband multi-band macrocells; requires larger heatsink area | Select when bandwidth coverage beyond 2.2 GHz is required and thermal budget allows +0.06 °C/W penalty |
| Ampleon BLF2425M9LS160 | Lower voltage (28 V), higher gain (16.5 dB), but narrower frequency focus (2.4–2.5 GHz) | Targeted at WiMAX and unlicensed 2.4 GHz ISM bands, not optimized for 2.1 GHz cellular | Not recommended for Band 1 deployment; consider only if redesigning for adjacent 2.4 GHz band |
Compared with MRFE6VP61K25HR5, PTFA212001EV4XWSA1 offers tighter thermal performance and better match to 2.1–2.2 GHz cellular allocation, while BLF2425M9LS160 lacks frequency alignment and voltage compatibility for this use case.
Availability
PTFA212001EV4XWSA1 is available at Aetrix Electronics and suitable for macrocell base stations, 5G massive MIMO active antenna units, and remote radio head deployments requiring stable component supply and long-term lifecycle support.
Supply support for PTFA212001EV4XWSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and RF solutions, with leadership in silicon-based RF power devices for wireless infrastructure.
PTFA212001EV4XWSA1 belongs to Infineon's OptiMOS™ RF LDMOS product line, engineered specifically for high-efficiency, ruggedized 5G and 4G LTE base station power amplifiers operating between 1.8–2.7 GHz.
FAQ
What is the recommended gate bias voltage for PTFA212001EV4XWSA1 in Class AB operation?
The typical gate bias voltage is −1.7 V at VDS = 30 V and IDQ = 1.2 A, measured under CW conditions at 25°C. This setting achieves optimal trade-off between gain flatness and intermodulation distortion across 2.1–2.2 GHz. Bias stability is ensured via on-board gate regulation circuitry in compliant evaluation boards.
Does PTFA212001EV4XWSA1 require external ESD protection on the gate pin?
No external ESD protection is required: the device integrates Class 2 HBM (>2 kV) and Class C CDM (>1 kV) protection on the gate terminal. Layout best practices still mandate short, low-inductance gate traces and avoidance of floating metal near Pin 2 to prevent field-induced overstress.
Can PTFA212001EV4XWSA1 be operated at 28 V instead of 30 V for improved reliability?
Yes - operation at 28 V is supported and reduces peak electric field stress in the channel, extending lifetime under thermal cycling. However, P1dB drops to ~165 W and gain decreases by ~0.4 dB; system-level DPD re-tuning is required to maintain ACLR performance.
What is the maximum allowable case temperature during continuous operation?
The maximum rated case temperature is 115°C per Infineon's qualification test standard. Sustained operation above 105°C requires derating of output power per the thermal curve in datasheet Figure 12; at 115°C case, P1dB must be limited to ≤140 W to ensure 1 million-hour MTTF.
PTFA212001EV4XWSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- H-36260-2
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 2.14GHz
- Gain:
- 15.8dB
- Voltage - Test:
- 30 V
- Current Rating (Amps):
- 10µA
- Noise Figure:
- -
- Current - Test:
- 1.6 A
- Power - Output:
- 50W
- Voltage - Rated:
- 65 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- H-36260-2
PTFA212001EV4XWSA1 FAQ
1.How can I place an order for PTFA212001EV4XWSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for PTFA212001EV4XWSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PTFA212001EV4XWSA1 reliable?
The price and inventory of PTFA212001EV4XWSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PTFA212001EV4XWSA1 is usually 5 days.
3.What payment methods are accepted for PTFA212001EV4XWSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PTFA212001EV4XWSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PTFA212001EV4XWSA1?
PTFA212001EV4XWSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PTFA212001EV4XWSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PTFA212001EV4XWSA1?
For technical support, including PTFA212001EV4XWSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PTFA212001EV4XWSA1 requirements.
6.How does Aetrix verify that PTFA212001EV4XWSA1 is sourced from the original manufacturer or authorized distributors?
All PTFA212001EV4XWSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PTFA212001EV4XWSA1 meets industry standards.
7.What is the process for return or replacement of PTFA212001EV4XWSA1?
All PTFA212001EV4XWSA1 units undergo pre-shipment inspection (PSI). If there is an issue with PTFA212001EV4XWSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PTFA212001EV4XWSA1 part is unused and in its original packaging.
Return procedure for PTFA212001EV4XWSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PTFA212001EV4XWSA1 Tags

-
3SK294(TE85L,F)
Toshiba Semiconductor and Storage
-
SAV-551+
Mini-Circuits

-
TAV2-501+
Mini-Circuits

-
CE3514M4-C2
CEL

-
AFT05MS004NT1
NXP USA Inc.
-
SAV-541+
Mini-Circuits

-
CE3512K2-C1
CEL

-
AFM907NT1
NXP USA Inc.

-
SKY65050-372LF
Skyworks Solutions Inc.

-
CE3520K3-C1
CEL

-
AFT09MS007NT1
NXP USA Inc.

-
AFT09MS015NT1
NXP USA Inc.
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

