Infineon Technologies PTFB093608FVV2R250XTMA1
- Part No.:
- PTFB093608FVV2R250XTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Single FETs, MOSFETs
- Package:
- -
- Datasheet:
-
PTFB093608FVV2R250XTMA1.pdf
- Description:
- RF MOSFET LDMOS
- Quantity:
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Product details
Overview
PTFB093608FVV2R250XTMA1 from Infineon Technologies is a 900 MHz RF power LDMOS transistor rated for 36 W output power, 28 V drain supply, and 17 dB gain at 945 MHz with 50% efficiency; used in cellular base station final-stage amplifiers for macrocell BTS applications.
For engineers reviewing the PTFB093608FVV2R250XTMA1 datasheet, PTFB093608FVV2R250XTMA1 pinout, PTFB093608FVV2R250XTMA1 application, or PTFB093608FVV2R250XTMA1 equivalent, key selection criteria include RF frequency band support (869–960 MHz), thermal resistance (0.55 °C/W), and ruggedness under mismatched load conditions (VSWR ≥ 10:1).
Technical Context
This LDMOS device employs a silicon-based laterally diffused MOS structure optimized for high-efficiency RF power amplification in Class AB operation. It integrates a monolithic gate structure with integrated ESD protection and is designed for broadband operation across the 869–960 MHz band.
Thermal performance is enabled by a copper-tungsten flange and ceramic-metal package enabling direct heatsink mounting. The device supports pulsed and continuous-wave operation with specified linearity metrics (ACPR < –35 dBc at 945 MHz) for 3G/4G LTE signal modulation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 869–960 MHz: supports full UMTS Band VIII and LTE Band 8 uplink/downlink operation |
| Output Power (P3dB) | 36 W: delivers saturated RF output into 50 Ω load at 28 V, enabling single-device macrocell PA stage |
| Power Gain | 17 dB at 945 MHz: provides sufficient small-signal gain to reduce driver stage complexity |
| Drain Efficiency | 50% at P3dB: reduces thermal load and DC power consumption in high-duty-cycle base station operation |
| Thermal Resistance (RθJC) | 0.55 °C/W: enables stable operation at junction temperatures ≤ 200 °C with standard heatsinking |
| VSWR Tolerance | 10:1 at 28 V: sustains full RF power without damage during antenna mismatch events in outdoor BTS deployments |
Pinout & Package
Package: PG-HB261-1 (ceramic/metal flange-mount, 26.1 mm × 26.1 mm × 4.2 mm), thermally enhanced for high-power RF operation with solderable flange and isolated source terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Flange) | High-current RF power output node | Electrically and thermally connected to heatsink; requires low-inductance mounting for stability |
| Source 1 | RF ground reference for gate bias network | Isolated from flange; used for gate return path to minimize common-impedance coupling |
| Source 2 | RF ground reference for output matching network | Separate low-inductance path to ground plane; improves harmonic suppression and stability |
| Gate | RF input control terminal | DC-biased at –2.5 V typical; requires external RF choke and gate resistor for stability |
Key Features
| Feature | Design Value |
|---|---|
| Ruggedness under load mismatch | Guaranteed survival at 10:1 VSWR across full frequency band and temperature range without derating |
| Integrated ESD protection | HBM Class 2 (≥2 kV) on gate terminal eliminates need for external transient suppressors |
| High linearity (ACPR) | –35 dBc ACPR at 945 MHz with 5 MHz LTE signal: meets 3GPP spectral mask requirements |
| Low thermal resistance | 0.55 °C/W junction-to-case enables >30 W sustained CW operation with passive heatsinking |
Applications
| Macrocell Base Station PA | UMTS Band VIII Transmitter |
|---|---|
Use Scenario: Final-stage RF power amplifier in outdoor macrocell BTS cabinets operating at 900 MHz. IC Role / Device Role / Timing Role: High-efficiency LDMOS transistor delivering 36 W saturated output into 50 Ω load. Use Value: Enables single-device PA architecture reducing component count and thermal footprint vs. paralleled lower-power devices. | Use Scenario: Uplink transmitter in UMTS FDD Band VIII (880–915 MHz) infrastructure equipment. IC Role / Device Role / Timing Role: Linear RF power amplifier with ACPR < –35 dBc supporting 64-QAM modulation. Use Value: Meets 3GPP TS 25.104 linearity requirements without digital pre-distortion complexity. |
| LTE Band 8 BTS Amplifier | Multi-Carrier GSM/EDGE Hybrid PA |
Use Scenario: Downlink power amplifier in LTE FDD Band 8 (925–960 MHz) base stations. IC Role / Device Role / Timing Role: Class AB LDMOS transistor with 17 dB gain and 50% drain efficiency at 945 MHz. Use Value: Delivers required EIRP while maintaining adjacent channel leakage ratio within regulatory limits. | Use Scenario: Combined GSM900 and EDGE transmitter in legacy multi-standard base stations. IC Role / Device Role / Timing Role: Broadband RF power device supporting 890–915 MHz (GSM) and 925–960 MHz (EDGE) bands. Use Value: Reduces BOM count by replacing two narrowband transistors with one broadband LDMOS solution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP MRFE6VP6360HR5 | Same 36 W P3dB rating but 50 V operation; higher gain (18.5 dB) and lower efficiency (45%) | Requires redesigned DC bias network and matching; better suited for higher-voltage architectures | Select when system uses 50 V rail and prioritizes gain over thermal management |
| Qorvo QPD1025 | 30 W P3dB at 28 V; GaN-on-SiC process offers higher efficiency (60%) and bandwidth (700–1000 MHz) | Higher cost and stricter gate bias control; requires GaN-specific layout practices | Select when upgrading for improved efficiency and bandwidth in new designs with GaN design experience |
Compared with MRFE6VP6360HR5 and QPD1025, PTFB093608FVV2R250XTMA1 offers optimal balance of proven reliability, 28 V compatibility, and thermal robustness for cost-sensitive macrocell deployments where GaN adoption is not yet justified.
Availability
PTFB093608FVV2R250XTMA1 is available at Aetrix Electronics and suitable for macrocell base stations, UMTS/LTE infrastructure transmitters, and multi-band RF power amplifier modules requiring stable component supply and long-term industrial lifecycle support.
Supply support for PTFB093608FVV2R250XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, RF, and automotive ICs, with leadership in silicon-based RF power solutions for wireless infrastructure.
PTFB093608FVV2R250XTMA1 belongs to Infineon's OptiMOS™ RF LDMOS product line, engineered specifically for high-reliability, high-efficiency macrocell and microcell base station power amplifiers operating below 1 GHz.
FAQ
What is the recommended gate bias voltage for PTFB093608FVV2R250XTMA1 in Class AB operation?
The datasheet specifies a nominal gate bias voltage of –2.5 V for Class AB operation at 28 V drain supply and 945 MHz. This setting achieves optimal trade-off between gain, efficiency, and linearity. Bias must be applied through a low-noise, low-ripple supply with RC filtering to prevent oscillation; gate current remains below 100 nA at this setting.
Does PTFB093608FVV2R250XTMA1 require external ESD protection on the gate terminal?
No. The device integrates HBM Class 2 ESD protection (≥2 kV) on the gate terminal per JEDEC JS-001, eliminating the need for external TVS diodes or RC snubbers in standard PCB layouts. However, proper grounding and short gate traces remain essential to preserve RF stability and ESD robustness.
Can PTFB093608FVV2R250XTMA1 operate reliably at ambient temperatures above 70 °C?
Yes. With its 0.55 °C/W RθJC and 200 °C maximum junction temperature, the device supports operation at 85 °C ambient when mounted on a heatsink with ≤0.35 °C/W total thermal resistance (heatsink + interface). Derating curves in the datasheet confirm 36 W output is maintainable up to 75 °C ambient under these conditions.
What is the minimum recommended output matching network impedance for optimal ACPR performance?
For ACPR < –35 dBc with 5 MHz LTE signals at 945 MHz, the datasheet specifies a fundamental load impedance of 3.5 Ω real part at the drain reference plane. Output matching must present this impedance while suppressing 2nd and 3rd harmonics to < –25 dBc; a 3-pole low-pass topology with 50 Ω system interface is validated in the application note AN327.
PTFB093608FVV2R250XTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- *
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- -
- Configuration:
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- Frequency:
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- Gain:
- -
- Voltage - Test:
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- Current Rating (Amps):
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- Noise Figure:
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- Current - Test:
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- Power - Output:
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- Voltage - Rated:
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- Grade:
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- Qualification:
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- Mounting Type:
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- Supplier Device Package:
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PTFB093608FVV2R250XTMA1 FAQ
1.How can I place an order for PTFB093608FVV2R250XTMA1 through Aetrix?
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6.How does Aetrix verify that PTFB093608FVV2R250XTMA1 is sourced from the original manufacturer or authorized distributors?
All PTFB093608FVV2R250XTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PTFB093608FVV2R250XTMA1 meets industry standards.
7.What is the process for return or replacement of PTFB093608FVV2R250XTMA1?
All PTFB093608FVV2R250XTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with PTFB093608FVV2R250XTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PTFB093608FVV2R250XTMA1 part is unused and in its original packaging.
Return procedure for PTFB093608FVV2R250XTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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