NXP Semiconductors PTN3361CBSMP

Overview

PTN3361CBSMP from NXP Semiconductors is a high-speed HDMI/DVI level shifter IC that converts four lanes of low-swing AC-coupled differential inputs (DisplayPort/PCIe-compliant) to DVI v1.0 and HDMI v1.4b–compliant open-drain current-steering TMDS outputs at up to 1.65 Gbit/s per lane, supporting 1080p video. It integrates active DDC buffering with I²C slave ROM for HDMI dongle detection, HPD level shifting, and programmable equalization. Used in DisplayPort-to-HDMI/DVI adapters and graphics subsystems.

For engineers reviewing the PTN3361CBSMP datasheet, PTN3361CBSMP pinout, PTN3361CBSMP application, or PTN3361CBSMP equivalent, key selection criteria include TMDS lane speed (1.65 Gbit/s), integrated 50 Ω input termination, back-current-safe sink-side I/Os, DDC rise time acceleration (up to 18 m bus extension), and mandatory DDET pin configuration for HDMI dongle compliance.

Technical Context

The PTN3361CBSMP implements transparent, non-re-timing level translation across three signal domains: TMDS (4-lane differential), DDC (bidirectional I²C with 3.3 V ↔ 5 V level shift and rise time acceleration), and HPD (single-ended 5 V → 3.3 V translation with 200 kΩ internal pull-down). Its self-biasing differential inputs comply with DisplayPort v1.2 and PCIe v1.1 electrical specs, while outputs meet HDMI v1.4b TMDS voltage swing and current-drive requirements.

Functionally, it uses independent enable controls: OE_N disables TMDS paths only (high-impedance IN_Dx/OUT_Dx), DDC_EN isolates the DDC channel, and DDET activates onboard I²C slave ROM for HDMI dongle identification. The REXT pin sets output current reference via external 10 kΩ resistor, and EQ3 selects one of three equalizer gains (0 dB / 2 dB / 3.5 dB) for signal integrity optimization on lossy channels.

Key Specifications

Pinout & Package

PTN3361CBSMP is housed in a 32-terminal HVQFN32 package (5 mm × 5 mm × 0.85 mm) with exposed thermal pad requiring PCB soldering and thermal vias for optimal thermal performance. All GND pins and the center pad must be connected to system ground.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar HDMI/DVI level shifting applications.

Compared with TPD12S016, PTN3361CBSMP offers mandatory HDMI dongle detection and programmable equalization for signal integrity tuning, while PTN3363BS extends bandwidth to 2.25 Gbit/s with backward-compatible pinout-making PTN3361CBSMP optimal for cost-sensitive 1080p DisplayPort-to-HDMI/DVI adapters requiring strict compliance.

Availability

PTN3361CBSMP is available at Aetrix Electronics and suitable for PC motherboard graphics interfaces, docking station hubs, and DisplayPort-to-HDMI/DVI adapters requiring stable component supply, long-term lifecycle assurance, and automotive-qualified thermal performance.

Supply support for PTN3361CBSMP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer applications.

The PTN3361CBSMP belongs to NXP's display interface product line, designed specifically to enable multi-standard video connectivity (DisplayPort, HDMI, DVI) using shared PHY resources while ensuring electrical compliance, robust hot-plug operation, and system-level interoperability.

FAQ

What is the maximum data rate supported by PTN3361CBSMP per TMDS lane?

The PTN3361CBSMP supports a maximum data rate of 1.65 Gbit/s per TMDS lane, enabling full HD (1080p) video transmission at 60 Hz with deep color. This rate aligns with HDMI v1.4b and DVI v1.0 specifications and is validated under worst-case channel loss conditions with EQ3 configured appropriately. The PTN3361CBSMP does not perform re-timing, so signal integrity depends on source drive strength and interconnect quality.

How must the DDET pin be configured for PTN3361CBSMP to function correctly in an HDMI dongle?

For correct HDMI dongle operation, the DDET pin on PTN3361CBSMP must be tied HIGH (to VDD or via pull-up resistor). This enables the onboard I²C slave ROM, allowing the host system to detect the dongle by reading address 0x81 and receiving the fixed 16-byte ASCII response "DP-HDMI ADAPTOR". If DDET is left floating or pulled LOW, PTN3361CBSMP will not respond to the dongle detection sequence, causing OS-level HDMI enumeration failure.

Does PTN3361CBSMP require external termination resistors on its TMDS input or output paths?

The PTN3361CBSMP integrates 50 Ω termination resistors on all four differential input pairs (IN_D1± to IN_D4±), eliminating the need for external AC-coupling termination. However, external 50 Ω terminations to 3.3 V are required on the output side (OUT_Dx±) per HDMI/DVI specification, and external pull-ups (typically 2.2 kΩ to 3.3 V for SCL_SOURCE/SDA_SOURCE and 2.2 kΩ to 5 V for SCL_SINK/SDA_SINK) are mandatory for DDC functionality. No external termination is needed on HPD lines due to internal 200 kΩ pull-down on HPD_SINK.

Can PTN3361CBSMP be used in both HDMI and DVI applications without hardware changes?

Yes, PTN3361CBSMP supports both HDMI and DVI level shifting with identical electrical interface and pinout. The only hardware difference is the DDET pin configuration: tie DDET HIGH for HDMI dongles (to enable I²C slave ROM), and tie DDET LOW for DVI-only adapters (to disable dongle detection). All other connections-including TMDS, DDC, and HPD-are shared between standards, making PTN3361CBSMP ideal for dual-mode adapter designs.

What thermal management requirements apply to the PTN3361CBSMP HVQFN32 package?

The PTN3361CBSMP uses an HVQFN32 package with an exposed center thermal pad that must be soldered to a dedicated PCB thermal pad and connected via ≥4 thermal vias to internal ground planes. This is mandatory-not optional-for reliable operation at full data rates. Failure to implement proper thermal conduction results in junction temperature exceeding 125 °C under sustained 1.65 Gbit/s operation, potentially triggering thermal shutdown or accelerated parametric drift. The device operates from −40 °C to +85 °C ambient.