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Home > Products > Integrated Circuits (ICs) > Interface > Specialized

NXP Semiconductors PX1011A-EL1:557

Name: PX1011A-EL1:557
Brand: NXP Semiconductors
SKU: PX1011A-EL1:557
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: PX1011A-EL1:557

Manufacturer:: NXP Semiconductors

Category:: Specialized

Package:: 81-LFBGA

Datasheet:: PX1011A-EL1:557.pdf

Description:: IC INTFACE SPECIALIZED 81LFBGA

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Product details

Overview

PX1011A-EL1:557 from NXP Semiconductors (formerly Philips Semiconductors) is a single-lane, 2.5 Gbit/s PCI Express stand-alone PHY IC implementing the physical layer for PCIe 1.0a/1.1 compliance. It performs clock and data recovery (CDR), 8b/10b encoding/decoding, serialization/deserialization, and elastic buffering, interfacing with MACs via an 8-bit SSTL_2 PXPIPE at 250 MHz. It supports industrial temperature operation (−40 °C to +85 °C) and is used in embedded PCIe interconnects between FPGAs and host controllers.

For engineers reviewing the PX1011A-EL1:557 datasheet, PX1011A-EL1:557 pinout, PX1011A-EL1:557 application, or PX1011A-EL1:557 equivalent, key selection considerations include its LFBGA81 package, dual 250 MHz source-synchronous clocks (TXCLK/RXCLK), 100 MHz ±300 ppm REFCLK tolerance, support for P0/P0s/P1 power states, and differential PCIe I/O with on-chip 50 Ω termination.

Technical Context

The PX1011A-EL1:557 implements a full SerDes-based PCIe PHY stack including CDR, 8b/10b PCS, elastic buffer, and receiver detection logic. Its PXPIPE interface extends Intel's PIPE v1.0 with dedicated TXCLK and RXCLK signals for timing closure in off-chip FPGA-to-PHY links.

It operates across three voltage domains: 1.2 V for high-speed serial I/O and PVT, 1.25 V for core and analog serializer supplies, and 2.5 V for SSTL_2 I/O - all requiring separate decoupling. Power management is controlled via PWRDWN[1:0] inputs, enabling transitions between P0 (full operation), P0s (transmit idle), and P1 (both lanes idle) states with PHYSTATUS signaling completion.

Key Specifications

Parameter	Value and Actual Design Meaning
Data rate	2.5 Gbit/s serial line rate - enables PCIe x1 Gen 1 link operation with full compliance to Base Spec 1.1
PXPIPE interface	8-bit parallel, 250 MHz, SSTL_2 Class I - synchronous to TXCLK/RXCLK for FPGA-compatible timing closure
Reference clock	100 MHz ±300 ppm - supports spread spectrum (30–33 kHz) for EMI reduction; drives internal PLL
Power dissipation	<300 mW in L0 mode - enables low-power embedded PCIe interconnect without active cooling
Operating temperature	−40 °C to +85 °C - qualified for industrial environments; matches PX1011AI variant spec
ESD protection	2000 V HBM - meets standard robustness requirements for board-level handling and system integration
Package	LFBGA81, 9 × 9 × 1.05 mm - fine-pitch ball grid array with SnPb solder balls per SOT643-1

Pinout & Package

LFBGA81 package (SOT643-1), 9 mm × 9 mm body, 1.05 mm height, SnPb solder ball compound. Ball pitch: 0.8 mm.

Pin/Terminal	Circuit Role	Design Meaning
RX_P / RX_N	Differential receive input	PCIe 2.5 Gbit/s input pair with 50 Ω on-chip termination - eliminates external resistors for simplified layout
TX_P / TX_N	Differential transmit output	PCIe 2.5 Gbit/s output pair with 50 Ω on-chip termination and built-in de-emphasis - improves signal integrity at receiver
TXDATA[7:0] / TXDATAK	Parallel transmit input	8-bit + control bit from MAC at 250 MHz; SSTL_2 signaling compatible with FPGA I/O banks
RXDATA[7:0] / RXDATAK	Parallel receive output	8-bit + control bit to MAC; includes symbol lock indication via RXVALID and error status via RXSTATUS[2:0]
TXCLK / RXCLK	Source-synchronous clocks	250 MHz clocks provided by MAC (TXCLK) and generated by PHY (RXCLK); edge-aligned to data for setup/hold margin
REFCLK_P / REFCLK_N	Differential reference input	100 MHz PCIe reference clock pair with 50 Ω on-chip termination - supports common-clock and spread-spectrum modes
RESET_N	Active-low reset	Asynchronous reset; must be held until REFCLK and supplies stabilize (max 64 µs internal lock time)
PWRDWN0 / PWRDWN1	Power state control	2-bit encoded input selecting P0 (00b), P0s (01b), or P1 (10b); no PCB changes needed for dynamic power scaling

Key Features

Feature	Design Value
PCIe 1.1 compliance	Fully compliant PHY layer implementation - passes link training, LTSSM, and electrical validation per Rev. 1.1
On-chip CDR and elastic buffer	Enables jitter tolerance up to 600 ppm frequency offset - handles clock drift without MAC intervention
Loopback and polarity inversion	Hardware-supported internal loopback and RXPOL-controlled lane inversion - simplifies system-level debug and cable reversal
JTAG boundary scan	IEEE 1149.1 interface with BIST - enables at-speed SerDes and I/O testing during production and field diagnostics
Low-power state support	Hardware-managed P0/P0s/P1 transitions with single-cycle PHYSTATUS assertion - ensures deterministic timing for MAC coordination

Applications

PCIe Bridge Interface	FPGA-to-Host Interconnect
Use Scenario: Connecting an FPGA-based peripheral (e.g., custom NIC or storage accelerator) to a PCIe root complex in industrial control systems. IC Role / Device Role / Timing Role: Stand-alone PHY providing full physical layer functions - replaces integrated PHY in FPGA or SoC, enabling use of non-PCIe-native FPGAs. Use Value: Offloads SERDES, CDR, and 8b/10b logic from FPGA fabric, reducing resource usage and ensuring spec-compliant signaling at 2.5 Gbit/s.	Use Scenario: High-reliability communication between an FPGA and x86 host processor in medical imaging equipment requiring deterministic latency. IC Role / Device Role / Timing Role: Electrical interface translator between FPGA's parallel I/O and PCIe serial bus - manages clock domain crossing via source-synchronous TXCLK/RXCLK. Use Value: Eliminates need for FPGA transceivers; SSTL_2 compatibility allows direct connection to Xilinx Spartan-6 or Intel Cyclone IV I/O banks.
Embedded Control Backplane	Test & Measurement Instrumentation
Use Scenario: Modular instrumentation chassis where CPU modules communicate with I/O modules over a compact PCIe backplane. IC Role / Device Role / Timing Role: Lane-level PHY enabling point-to-point x1 links - supports hot-plug detection and receiver presence verification via RXDET_LOOPB. Use Value: Industrial temp rating (−40 °C to +85 °C) and 2000 V HBM ESD ensure robust operation in fanless, sealed enclosures.	Use Scenario: Signal acquisition card with real-time PCIe streaming to host memory in oscilloscopes or protocol analyzers. IC Role / Device Role / Timing Role: Low-jitter, low-BER physical layer for sustained 2.5 Gbit/s data transfer - elastic buffer absorbs clock skew between ADC sampling clock and PCIe reference. Use Value: <300 mW power draw allows dense multi-lane card designs without thermal throttling or airflow dependency.

PCIe Bridge Interface

FPGA-to-Host Interconnect

Use Scenario: Connecting an FPGA-based peripheral (e.g., custom NIC or storage accelerator) to a PCIe root complex in industrial control systems.

IC Role / Device Role / Timing Role: Stand-alone PHY providing full physical layer functions - replaces integrated PHY in FPGA or SoC, enabling use of non-PCIe-native FPGAs.

Use Value: Offloads SERDES, CDR, and 8b/10b logic from FPGA fabric, reducing resource usage and ensuring spec-compliant signaling at 2.5 Gbit/s.

Use Scenario: High-reliability communication between an FPGA and x86 host processor in medical imaging equipment requiring deterministic latency.

IC Role / Device Role / Timing Role: Electrical interface translator between FPGA's parallel I/O and PCIe serial bus - manages clock domain crossing via source-synchronous TXCLK/RXCLK.

Use Value: Eliminates need for FPGA transceivers; SSTL_2 compatibility allows direct connection to Xilinx Spartan-6 or Intel Cyclone IV I/O banks.

Embedded Control Backplane

Test & Measurement Instrumentation

Use Scenario: Modular instrumentation chassis where CPU modules communicate with I/O modules over a compact PCIe backplane.

IC Role / Device Role / Timing Role: Lane-level PHY enabling point-to-point x1 links - supports hot-plug detection and receiver presence verification via RXDET_LOOPB.

Use Value: Industrial temp rating (−40 °C to +85 °C) and 2000 V HBM ESD ensure robust operation in fanless, sealed enclosures.

Use Scenario: Signal acquisition card with real-time PCIe streaming to host memory in oscilloscopes or protocol analyzers.

IC Role / Device Role / Timing Role: Low-jitter, low-BER physical layer for sustained 2.5 Gbit/s data transfer - elastic buffer absorbs clock skew between ADC sampling clock and PCIe reference.

Use Value: <300 mW power draw allows dense multi-lane card designs without thermal throttling or airflow dependency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe PHY applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IDT8N3SV772	PCIe 2.0-compliant (5 Gbit/s), integrated clock generator, QFN48 package - no PXPIPE interface; uses standard PIPE v2.0	Targets higher-speed Gen 2 links and clock-synthesis consolidation; requires different MAC interface logic	Select when upgrading to PCIe 2.0 or consolidating reference clock generation; not drop-in for PX1011A-EL1:557 due to interface and speed mismatch
TI TSB582	PCIe 1.1-compliant, same 2.5 Gbit/s rate, but uses standard PIPE v1.0 (no source-synchronous clocks); 64-pin QFN	Designed for ASIC-to-PHY integration with tighter timing budgets; lacks TXCLK/RXCLK simplification for FPGA use	Prefer for ASIC-based designs where MAC provides strict timing control; PX1011A-EL1:557 remains superior for FPGA-centric layouts needing relaxed timing closure

Compared with IDT8N3SV772 and TSB582, PX1011A-EL1:557 uniquely delivers source-synchronous PXPIPE timing for FPGA interoperability, industrial temperature support in LFBGA81, and hardware-assisted receiver detection - making it optimal for cost-sensitive, thermally constrained embedded PCIe bridges.

Availability

PX1011A-EL1:557 is available at Aetrix Electronics and suitable for industrial control backplanes, FPGA-based PCIe accelerators, medical imaging interfaces, and test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for PX1011A-EL1:557 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips Semiconductors in 2006, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The PX1011A-EL1:557 belongs to NXP's legacy PCI Express PHY product line, designed specifically for cost-optimized, FPGA-friendly PCIe x1 interconnects in industrial and embedded systems where Gen 1 performance and thermal robustness are prioritized over higher bandwidth.

FAQ

What is the operating temperature range supported by the PX1011A-EL1:557?

The PX1011A-EL1:557 is rated for industrial temperature operation from −40 °C to +85 °C. This specification aligns with the PX1011AI variant designation and is validated across all electrical parameters in the datasheet, including supply voltage tolerances, clock stability, and I/O timing margins. The LFBGA81 package and SnPb solder construction further support reliability under thermal cycling in uncontrolled environments. PX1011A-EL1:557 maintains full PCIe 1.1 compliance throughout this range.

Does the PX1011A-EL1:557 require external termination resistors for its PCIe differential I/O?

No, the PX1011A-EL1:557 integrates 50 Ω on-chip termination for both RX_P/RX_N and TX_P/TX_N differential pairs. This eliminates the need for external AC-coupling capacitors and termination resistors on the PCB, simplifying layout and reducing BOM count. The internal termination is optimized for PCIe 1.1 signal integrity at 2.5 Gbit/s and remains effective across the full industrial temperature range. PX1011A-EL1:557 documentation confirms this in Tables 5 and 6 of the pin description section.

How does the PX1011A-EL1:557 handle clock domain crossing between the MAC and PHY?

The PX1011A-EL1:557 uses source-synchronous clocking: TXCLK (250 MHz input from MAC) clocks all transmit-side inputs, while RXCLK (250 MHz output from PHY) clocks all receive-side outputs. This eliminates asynchronous FIFOs and guarantees setup/hold timing closure without complex static timing analysis. The PHY internally aligns RXCLK's rising edge to the center of received data. PX1011A-EL1:557 implements this architecture as part of its PXPIPE interface extension to PIPE v1.0.

Can the PX1011A-EL1:557 operate with a spread spectrum reference clock?

Yes, the PX1011A-EL1:557 supports spread spectrum clocking on its REFCLK_P/REFCLK_N inputs with modulation frequencies from 30 kHz to 33 kHz. Its PLL bandwidth is specifically designed to track this variation while maintaining stable 250 MHz and 2.5 Gbit/s clocks. The datasheet specifies ±300 ppm total tolerance, which accommodates both center-spread and down-spread profiles. PX1011A-EL1:557 achieves EMI reduction without compromising PCIe link training or BER performance.

What power management states does the PX1011A-EL1:557 support, and how are they controlled?

The PX1011A-EL1:557 supports P0 (active), P0s (transmit idle), and P1 (full idle) states, controlled via the 2-bit PWRDWN[1:0] input (pins H6 and J6). State transitions are signaled by a single-cycle assertion of PHYSTATUS. In P0s and P1, TXIDLE must be asserted. The PHY maintains internal clock operation in P0/P0s but disables RX PLL/CDR in P1. PX1011A-EL1:557 fully complies with PCIe 1.1 power state timing requirements and reports status via RXSTATUS and PHYSTATUS pins.

PX1011A-EL1:557 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 81-LFBGA

Packaging:: Tray

Product Status:: Obsolete

Applications:: PCI Express MAX to PCI Express PHY

Interface:: IEEE 1149.1

Voltage - Supply:: 1.2V

Supplier Device Package:: 81-LFBGA (9x9)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

PX1011A-EL1:557 FAQ

1.How can I place an order for PX1011A-EL1:557 through Aetrix?

Please submit a Request for Quotation (RFQ) for PX1011A-EL1:557 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PX1011A-EL1:557 reliable?

The price and inventory of PX1011A-EL1:557 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PX1011A-EL1:557 is usually 5 days.

3.What payment methods are accepted for PX1011A-EL1:557?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PX1011A-EL1:557 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PX1011A-EL1:557?

PX1011A-EL1:557 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PX1011A-EL1:557 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PX1011A-EL1:557?

For technical support, including PX1011A-EL1:557 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PX1011A-EL1:557 requirements.

6.How does Aetrix verify that PX1011A-EL1:557 is sourced from the original manufacturer or authorized distributors?

All PX1011A-EL1:557 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PX1011A-EL1:557 meets industry standards.

7.What is the process for return or replacement of PX1011A-EL1:557?

All PX1011A-EL1:557 units undergo pre-shipment inspection (PSI). If there is an issue with PX1011A-EL1:557, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PX1011A-EL1:557 part is unused and in its original packaging.

Return procedure for PX1011A-EL1:557:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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