NXP Semiconductors PX1011B-EL1/G,557

Overview

PX1011B-EL1/G,557 from NXP Semiconductors is a single-lane, 2.5 Gbit/s PCI Express Base Specification Rev. 1.1-compliant physical layer (PHY) IC. It implements full SerDes functionality with 8b/10b encoding/decoding, on-chip CDR, elastic buffer, and receiver detection. Its 8-bit PXPIPE interface operates at 250 MHz using 2.5 V SSTL_2 signaling and interfaces directly with FPGA-based MAC layers in embedded computing and industrial control systems.

For engineers reviewing the PX1011B-EL1/G,557 datasheet, PX1011B-EL1/G,557 pinout, PX1011B-EL1/G,557 application, or PX1011B-EL1/G,557 equivalent, key selection considerations include its LFBGA81 package, industrial temperature range (−40 °C to +85 °C), compliance with PIPE v1.0 enhanced for off-chip use, JTAG-enabled BIST, and support for P0/P0s/P1 power states with <300 mW L0 dissipation.

Technical Context

The PX1011B-EL1/G,557 implements a complete PCIe 1.x PHY stack comprising Physical Coding Sub-layer (PCS), Serializer/Deserializer (SerDes), and analog I/O pads. Its CDR recovers clock from 2.5 Gbit/s differential serial data, while the elastic buffer compensates for ±600 ppm frequency mismatch between link endpoints using SKP ordered-set insertion/removal.

It uses a source-synchronous PXPIPE interface: TXCLK (250 MHz input from MAC) clocks transmit data, RXCLK (250 MHz output) clocks receive data and status signals, and both are aligned to data centering. The PHY supports loopback, polarity inversion, disparity control, and electrical idle management per PCIe Base Spec Rev. 1.1.

Key Specifications

Pinout & Package

LFBGA81 package (9 mm × 9 mm × 1.05 mm, SOT643-1), Pb-free (SnAgCu solder balls), 81-ball grid array with standard ball pitch and index area marked at A1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe PHY applications.

Compared with IDT8N3SV772 and TI TSB530, PX1011B-EL1/G,557 uniquely combines industrial temperature operation, integrated elastic buffer for clock tolerance, and direct SSTL_2 FPGA compatibility - making it optimal for ruggedized embedded PCIe interconnects where thermal stability and timing simplicity are critical.

Availability

PX1011B-EL1/G,557 is available at Aetrix Electronics and suitable for industrial control backplanes, FPGA-based accelerator links, and PCIe bridge interfaces requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for PX1011B-EL1/G,557 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in interface, RF, and mixed-signal technologies.

The PX1011B-EL1/G,557 belongs to NXP's PCI Express PHY product line, designed specifically to provide robust, low-power, off-chip physical layer connectivity for FPGA- and ASIC-based systems operating in harsh industrial environments.

FAQ

What PCIe specification versions does the PX1011B-EL1/G,557 support?

The PX1011B-EL1/G,557 is compliant with PCI Express Base Specification Rev. 1.0a and Rev. 1.1. It implements full Gen 1 x1 functionality including LTSSM state transitions, electrical idle management, and SKP ordered-set handling. It does not support Gen 2 or later revisions, and its 2.5 Gbit/s line rate is fixed per PCIe 1.x requirements.

Does the PX1011B-EL1/G,557 integrate SSTL_2 termination resistors?

No, the PX1011B-EL1/G,557 does not integrate SSTL_2 termination resistors. External 25 Ω series resistors are required on TXDATA[7:0], TXDATAK, RXDATA[7:0], RXDATAK, TXCLK, and RXCLK lines to meet SSTL_2 Class I drive strength and impedance matching requirements per JEDEC JESD8-15A.

How is clock tolerance managed in the PX1011B-EL1/G,557?

The PX1011B-EL1/G,557 uses an on-chip elastic buffer capable of holding ≥7 symbols to absorb ±600 ppm frequency differences between link endpoints. It automatically inserts or removes SKP ordered-sets in the received data stream and signals corrections via RXSTATUS[2:0] to inform the MAC layer of buffer adjustments.

What power states does the PX1011B-EL1/G,557 support and how are they controlled?

The PX1011B-EL1/G,557 supports P0 (active), P0s (transmit idle), and P1 (full low-power) states, controlled by the 2-bit PWRDWN[1:0] input. P0s and P1 reduce dynamic power while retaining clock operation and link readiness. State transitions are confirmed by single-cycle assertion of PHYSTATUS, which the MAC must sample before proceeding.

Is the PX1011B-EL1/G,557 compatible with Xilinx and Intel FPGAs?

Yes, the PX1011B-EL1/G,557 is directly compatible with Xilinx 7-series and Intel Cyclone IV/V FPGAs due to its 2.5 V SSTL_2 Class I signaling, 250 MHz source-synchronous PXPIPE interface, and absence of integrated termination - matching the I/O standards and timing models of those FPGA families without level shifters or external buffers.