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Home > Products > Integrated Circuits (ICs) > Interface > Specialized

NXP Semiconductors PX1011B-EL1/N,551

Name: PX1011B-EL1/N,551
Brand: NXP Semiconductors
SKU: PX1011B-EL1/N,551
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: PX1011B-EL1/N,551

Manufacturer:: NXP Semiconductors

Category:: Specialized

Package:: 81-LFBGA

Datasheet:: PX1011B-EL1/N,551.pdf

Description:: IC INTFACE SPECIALIZED 81LFBGA

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Product details

Overview

PX1011B-EL1/N,551 from NXP Semiconductors is a single-lane, 2.5 Gbit/s PCI Express stand-alone PHY IC compliant with PCIe Base Specification Rev. 1.1. It implements full SerDes, 8b/10b encoding/decoding, Clock and Data Recovery (CDR), elastic buffering, and receiver detection. Its 8-bit PXPIPE interface operates at 250 MHz with SSTL_2 signaling and interfaces directly with FPGA-based MAC layers in embedded computing and industrial control systems.

For engineers reviewing the PX1011B-EL1/N,551 datasheet, PX1011B-EL1/N,551 pinout, PX1011B-EL1/N,551 application, or PX1011B-EL1/N,551 equivalent, this page delivers verified electrical specifications, LFBGA81 package mapping, power management state behavior (P0/P0s/P1), JTAG BIST capability, and real-world timing-critical design meanings for RXCLK/TXCLK synchronization, spread-spectrum clock tolerance, and SKP symbol handling.

Technical Context

The PX1011B-EL1/N,551 implements a complete PCIe 1.x physical layer using a dedicated SerDes block with on-chip 50 Ω differential termination for RX_P/RX_N and TX_P/TX_N, plus CDR circuitry locked to a 100 MHz ±300 ppm reference clock. Its PCS layer performs 8b/10b encode/decode, comma detection (K28.5), and disparity control - all synchronized to source-synchronous 250 MHz TXCLK and RXCLK signals.

Power management is implemented via dual PWRDWN[1:0] inputs controlling discrete states: P0 (full operation), P0s (transmit idle), and P1 (both lanes idle with RX CDR disabled). Receiver detection and loopback are triggered by RXDET_LOOPB, while error conditions (8b/10b decode failure, elastic buffer overflow/underflow, disparity error) are reported synchronously on RXSTATUS[2:0] with one-cycle assertion timing aligned to the COM symbol of affected SKP ordered sets.

Key Specifications

Parameter	Value and Actual Design Meaning
Data Rate	2.5 Gbit/s serial line rate - enables PCIe x1 Gen1 link operation with full compliance to electrical and protocol timing requirements.
Interface	8-bit PXPIPE at 250 MHz - superset of PIPE v1.0 adapted for off-chip use with source-synchronous TXCLK/RXCLK; eliminates external clock skew compensation.
Signaling	SSTL_2 Class I (2.5 V) for parallel I/O - compatible with standard FPGA I/O banks without level-shifting; requires external 1.25 V VREFS reference.
Reference Clock	100 MHz ±300 ppm with spread spectrum (30–33 kHz) - meets PCIe EMI reduction mandates and supports on-chip PLL generation of internal 250 MHz and bit-rate clocks.
Power Dissipation	<300 mW in L0 mode - enables thermal feasibility in dense FPGA carrier boards; supports L0s/L1 power states for dynamic link power gating.
Operating Temperature	0 °C to +70 °C (commercial) - validated for stable operation across ambient temperature range without derating; matches standard industrial board environments.
ESD Protection	2000 V HBM - ensures robustness during PCB handling and system integration without additional protection circuitry.

Pinout & Package

LFBGA81 package (9 × 9 × 1.05 mm, SOT643-1); leaded SnPb solder ball compound; 81-ball fine-pitch array with defined index corner (ball A1).

Pin/Terminal	Circuit Role	Design Meaning
RX_P / RX_N	Differential receive input	PCIe-compliant 50 Ω on-chip terminated pair; accepts 2.5 Gbit/s AC-coupled serial stream; no external termination required.
TX_P / TX_N	Differential transmit output	2.5 Gbit/s output with integrated de-emphasis; drives standard PCIe AC-coupled channel; 50 Ω on-chip termination enabled.
TXDATA[7:0] / TXDATAK	Parallel transmit input	8-bit data + K-character control signal sampled on rising TXCLK edge; synchronous to MAC-side clock domain.
RXDATA[7:0] / RXDATAK	Parallel receive output	8-bit recovered data + K-character output aligned to RXCLK rising edge; includes elastic buffer latency compensation.
TXCLK / RXCLK	Source-synchronous clocks	250 MHz clocks provided by MAC (TXCLK) and generated by PHY (RXCLK); edge-aligned to center of data eye for timing closure.
REFCLK_P / REFCLK_N	Differential reference input	100 MHz spread-spectrum clock pair with 50 Ω on-chip termination; primary timing source for internal PLL and CDR lock.
RXDET_LOOPB	Mode control input	Active-low command enabling receiver detection or internal loopback; triggers state transitions without MAC reconfiguration.
PHYSTATUS	Status output	Single-cycle pulse indicating completion of power state transitions, receiver detection, or loopback entry/exit; used for MAC handshaking.

Key Features

Feature	Design Value
PCIe 1.1 Compliance	Fully implements Base Spec Rev. 1.1 electrical and protocol layer requirements including LTSSM timing, SKP ordered-set handling, and electrical idle sequencing.
Source-Synchronous PXPIPE	Eliminates setup/hold timing violations between MAC and PHY by aligning TXCLK/RXCLK edges to data center; simplifies FPGA interface timing closure.
Elastic Buffer with SKP Management	Compensates for ±600 ppm clock frequency mismatch between link partners by inserting/removing SKP symbols; reports actions via RXSTATUS for MAC coordination.
JTAG BIST	Built-in self-test controller validates SerDes and I/O blocks at-speed using IEEE 1149.1 boundary scan; enables production test without external pattern generators.
Low-Power State Control	Hardware-driven P0/P0s/P1 state transitions via PWRDWN[1:0]; maintains RXCLK during P0s/P1 for fast wake-up; reduces active power to <300 mW.
Receiver Detection & Loopback	On-demand link partner presence verification and internal data loopback without external hardware; supports debug, validation, and compliance testing.

Applications

Embedded Computing Host	FPGA-Based Accelerator Card
Use Scenario: PCIe x1 host interface on an ARM-based industrial controller connecting to peripheral modules. IC Role / Device Role / Timing Role: Stand-alone PHY bridging FPGA MAC to PCIe slot; handles serialization, CDR, and 8b/10b encoding independently of soft-core logic. Use Value: Offloads timing-critical SerDes functions from FPGA fabric, freeing LUTs and reducing routing congestion while guaranteeing PCIe 1.1 electrical compliance.	Use Scenario: High-speed data acquisition card using Xilinx Artix-7 FPGA with PCIe uplink to host PC. IC Role / Device Role / Timing Role: Physical layer translator between FPGA's PIPE-compatible MAC and PCIe edge connector; manages RXCLK/TXCLK synchronization and SKP correction. Use Value: Enables deterministic 250 MHz parallel interface timing without custom I/O constraints; supports hot-plug detection and link training via PHYSTATUS and RXSTATUS handshake.
Industrial PLC Backplane	Test & Measurement Equipment
Use Scenario: Modular PLC chassis with hot-swappable I/O modules communicating over PCIe backplane. IC Role / Device Role / Timing Role: Link-layer PHY providing receiver detection, electrical idle management, and P1 power gating during module standby. Use Value: Ensures reliable link initialization after hot-insertion via RXDET_LOOPB-triggered detection; maintains low quiescent current (<300 mW) during idle states.	Use Scenario: PCIe-based oscilloscope digitizer capturing high-resolution waveforms to host memory. IC Role / Device Role / Timing Role: Low-jitter SerDes PHY ensuring bit-error-free 2.5 Gbit/s streaming; elastic buffer absorbs clock domain mismatches between ADC sampling and host bus. Use Value: Delivers sub-10⁻¹² BER under EMI stress via on-chip CDR and spread-spectrum clock support; eliminates packet loss during sustained high-throughput transfers.

Embedded Computing Host

FPGA-Based Accelerator Card

Use Scenario: PCIe x1 host interface on an ARM-based industrial controller connecting to peripheral modules.

IC Role / Device Role / Timing Role: Stand-alone PHY bridging FPGA MAC to PCIe slot; handles serialization, CDR, and 8b/10b encoding independently of soft-core logic.

Use Value: Offloads timing-critical SerDes functions from FPGA fabric, freeing LUTs and reducing routing congestion while guaranteeing PCIe 1.1 electrical compliance.

Use Scenario: High-speed data acquisition card using Xilinx Artix-7 FPGA with PCIe uplink to host PC.

IC Role / Device Role / Timing Role: Physical layer translator between FPGA's PIPE-compatible MAC and PCIe edge connector; manages RXCLK/TXCLK synchronization and SKP correction.

Use Value: Enables deterministic 250 MHz parallel interface timing without custom I/O constraints; supports hot-plug detection and link training via PHYSTATUS and RXSTATUS handshake.

Industrial PLC Backplane

Test & Measurement Equipment

Use Scenario: Modular PLC chassis with hot-swappable I/O modules communicating over PCIe backplane.

IC Role / Device Role / Timing Role: Link-layer PHY providing receiver detection, electrical idle management, and P1 power gating during module standby.

Use Value: Ensures reliable link initialization after hot-insertion via RXDET_LOOPB-triggered detection; maintains low quiescent current (<300 mW) during idle states.

Use Scenario: PCIe-based oscilloscope digitizer capturing high-resolution waveforms to host memory.

IC Role / Device Role / Timing Role: Low-jitter SerDes PHY ensuring bit-error-free 2.5 Gbit/s streaming; elastic buffer absorbs clock domain mismatches between ADC sampling and host bus.

Use Value: Delivers sub-10⁻¹² BER under EMI stress via on-chip CDR and spread-spectrum clock support; eliminates packet loss during sustained high-throughput transfers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe Gen1 PHY applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IDT8N3SV772	PCIe Gen2 (5 Gbit/s) dual-lane PHY; higher power (450 mW); requires 1.8 V core and 3.3 V I/O supplies.	Supports backward-compatible Gen1 mode but targets future Gen2 upgrades; not pin-compatible with PX1011B-EL1/N,551.	Select only if Gen2 readiness and multi-lane scalability are required; redesign needed for voltage rails and layout.
TI TSB582	PCIe Gen1 x1 PHY with integrated MAC interface logic; supports only 100 MHz REFCLK (no spread-spectrum); lacks JTAG BIST.	Designed for ASIC integration; minimal external components but no RXCLK/TXCLK source-synchronous flexibility.	Prefer when MAC logic is embedded in ASIC and spread-spectrum EMI reduction is not mandated; not suitable for FPGA-centric designs.

Compared with IDT8N3SV772 and TI TSB582, PX1011B-EL1/N,551 provides optimal balance of PCIe 1.1 compliance, FPGA-friendly source-synchronous timing, low-power L0s/L1 support, and production-ready JTAG BIST - making it the most direct fit for cost-sensitive, FPGA-based PCIe endpoint designs requiring commercial-temperature stability.

Availability

PX1011B-EL1/N,551 is available at Aetrix Electronics and suitable for embedded computing hosts, FPGA accelerator cards, and industrial PLC backplanes requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for PX1011B-EL1/N,551 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in high-speed interface IP and mixed-signal design.

The PX1011B product line delivers PCIe Gen1 physical layer functionality for FPGA- and ASIC-based endpoints, designed specifically to simplify PCIe integration in resource-constrained embedded systems while maintaining full specification compliance.

FAQ

What is the operating temperature range for PX1011B-EL1/N,551?

PX1011B-EL1/N,551 is rated for commercial temperature operation from 0 °C to +70 °C. This range is validated per the official NXP datasheet Rev. 6 and applies specifically to the -EL1/N variant. Industrial-grade variants (e.g., PX1011BI-EL1/G) extend to −40 °C to +85 °C, but PX1011B-EL1/N,551 does not support that extended range.

Does PX1011B-EL1/N,551 support spread-spectrum clocking?

Yes, PX1011B-EL1/N,551 supports spread-spectrum clocking on its 100 MHz REFCLK_P/REFCLK_N inputs with modulation frequencies from 30 kHz to 33 kHz. This feature is explicitly documented in Section 2.5 and Figure 4 of the NXP datasheet and is essential for meeting PCIe EMI emission requirements.

How does PX1011B-EL1/N,551 handle clock domain crossing between MAC and PHY?

PX1011B-EL1/N,551 uses source-synchronous clocks: TXCLK (provided by MAC) clocks all transmit inputs, and RXCLK (generated by PX1011B-EL1/N,551) clocks all receive outputs. This eliminates asynchronous FIFOs and guarantees deterministic timing alignment - a key design value confirmed in Sections 2.2 and 8.3 of the datasheet.

What power management states does PX1011B-EL1/N,551 support?

PX1011B-EL1/N,551 supports P0 (active), P0s (transmit idle), and P1 (full link idle) states via PWRDWN[1:0] inputs. P2 is not implemented - the device enters P1 instead. Each transition is signaled by a single-cycle PHYSTATUS pulse, as defined in Table 13 and Section 8.5 of the NXP datasheet.

Is PX1011B-EL1/N,551 pin-compatible with other members of the PX1011 family?

Yes, PX1011B-EL1/N,551 shares identical LFBGA81 pinout and ball mapping with PX1011B-EL1/G, PX1011BI-EL1/G, and PX1011B-EL1/Q900 per Tables 2 and 7–12 of the NXP datasheet. Differences are limited to solder composition (SnPb vs. Pb-free), temperature grade, and automotive qualification - not pin function or placement.

PX1011B-EL1/N,551 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 81-LFBGA

Packaging:: Tray

Product Status:: Obsolete

Applications:: PCI Express MAX to PCI Express PHY

Interface:: JTAG

Voltage - Supply:: 1.2V

Supplier Device Package:: 81-LFBGA (9x9)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

PX1011B-EL1/N,551 FAQ

1.How can I place an order for PX1011B-EL1/N,551 through Aetrix?

Please submit a Request for Quotation (RFQ) for PX1011B-EL1/N,551 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PX1011B-EL1/N,551 reliable?

The price and inventory of PX1011B-EL1/N,551 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PX1011B-EL1/N,551 is usually 5 days.

3.What payment methods are accepted for PX1011B-EL1/N,551?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PX1011B-EL1/N,551 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PX1011B-EL1/N,551?

PX1011B-EL1/N,551 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PX1011B-EL1/N,551 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PX1011B-EL1/N,551?

For technical support, including PX1011B-EL1/N,551 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PX1011B-EL1/N,551 requirements.

6.How does Aetrix verify that PX1011B-EL1/N,551 is sourced from the original manufacturer or authorized distributors?

All PX1011B-EL1/N,551 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PX1011B-EL1/N,551 meets industry standards.

7.What is the process for return or replacement of PX1011B-EL1/N,551?

All PX1011B-EL1/N,551 units undergo pre-shipment inspection (PSI). If there is an issue with PX1011B-EL1/N,551, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PX1011B-EL1/N,551 part is unused and in its original packaging.

Return procedure for PX1011B-EL1/N,551:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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