NXP Semiconductors PX1011BI-EL1/G,518
- Part No.:
- PX1011BI-EL1/G,518
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 81-LFBGA
- Datasheet:
-
PX1011BI-EL1/G,518.pdf
- Description:
- IC INTFACE SPECIALIZED 81LFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
PX1011BI-EL1/G,518 from NXP Semiconductors is a single-lane, 2.5 Gbit/s PCI Express stand-alone PHY IC for industrial temperature operation (−40 °C to +85 °C), compliant with PCIe Base Specification Rev. 1.1. It implements full SerDes functionality with 8b/10b encoding, Clock and Data Recovery (CDR), elastic buffer, and receiver detection, interfacing via an 8-bit SSTL_2 PXPIPE at 250 MHz to FPGA-based MAC layers in embedded computing and industrial control systems.
For engineers reviewing the PX1011BI-EL1/G,518 datasheet, PX1011BI-EL1/G,518 pinout, PX1011BI-EL1/G,518 application, or PX1011BI-EL1/G,518 equivalent, key selection criteria include its LFBGA81 package compatibility with FPGA I/O, support for PCIe P0/P0s/P1 power states, 100 MHz ±300 ppm reference clock tolerance, JTAG boundary scan testability, and industrial-grade thermal reliability - all critical for high-integrity link-layer design in space-constrained edge devices.
Technical Context
The PX1011BI-EL1/G,518 implements a complete PCIe physical layer with integrated Serializer/De-serializer (SerDes), 8b/10b encoder/decoder, and elastic buffer for clock tolerance compensation up to ±600 ppm. Its PXPIPE interface adds source-synchronous TXCLK/RXCLK signals to Intel's PIPE v1.0 specification, enabling timing-closure simplicity in off-chip FPGA-to-PHY interconnects.
It supports full PCIe power management states (P0, P0s, P1) with dedicated PWRDWN[1:0] inputs and status reporting via PHYSTATUS and RXSTATUS outputs. Receiver detection and loopback are implemented as hardware-controlled functions triggered by RXDET_LOOPB, with real-time error signaling (8b/10b decode, disparity, elastic buffer overflow/underflow) encoded on three status pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | 2.5 Gbit/s serial line rate - enables full x1 PCIe Gen 1 link bandwidth with minimal PCB routing complexity. |
| PXPIPE Interface | 8-bit parallel SSTL_2 I/O at 250 MHz - matches standard FPGA I/O banks without requiring custom termination or level-shifting. |
| Reference Clock | 100 MHz ±300 ppm with spread spectrum support - meets PCIe EMI reduction requirements while simplifying clock sourcing. |
| Power Dissipation | <300 mW in L0 mode - enables thermal feasibility in fanless industrial enclosures with limited airflow. |
| Operating Temperature | −40 °C to +85 °C - certified for industrial automation, transportation, and ruggedized embedded applications. |
| ESD Protection | 2000 V HBM - ensures robustness during board assembly and field handling in uncontrolled environments. |
| Compliance | PCIe Base Spec Rev. 1.1 - guarantees interoperability with standard PCIe root complexes and endpoints. |
Pinout & Package
LFBGA81 package (9 mm × 9 mm × 1.05 mm, SOT643-1); Pb-free SnAgCu solder balls; 81-ball grid with defined ball mapping per NXP SOT643-1 mechanical drawing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RX_P / RX_N | Differential receive input | 50 Ω on-chip termination; accepts 2.5 Gbit/s PCIe differential signal directly from connector or backplane. |
| TX_P / TX_N | Differential transmit output | 50 Ω on-chip termination with de-emphasis; drives PCIe-compliant differential output without external components. |
| REFCLK_P / REFCLK_N | Differential reference clock input | 100 MHz PCIe reference clock pair with internal 50 Ω termination; enables jitter-clean PLL lock. |
| TXDATA[7:0] / TXDATAK | Parallel transmit data input | 8-bit + K-bit SSTL_2 interface synchronized to TXCLK; connects directly to FPGA MAC output. |
| RXDATA[7:0] / RXDATAK | Parallel receive data output | 8-bit + K-bit SSTL_2 output aligned to RXCLK; delivers recovered symbols to FPGA MAC with symbol-lock indication. |
| RXVALID / PHYSTATUS | Status signaling outputs | RXVALID asserts on symbol lock; PHYSTATUS pulses on power-state transitions and receiver-detect completion. |
| RXSTATUS[2:0] | Error and event status | 3-bit encoded output indicating 8b/10b decode errors, SKP insert/remove, receiver presence, or elastic buffer faults. |
| TMS / TCK / TDI / TDO / TRST_N | JTAG boundary scan interface | 3.3 V CMOS-compliant IEEE 1149.1 interface for production test and BIST execution at speed. |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen 1 x1 SerDes | Full hardware implementation of serialization, deserialization, 8b/10b coding, and CDR - eliminates need for FPGA logic resources or external PHY glue. |
| PXPIPE with source-synchronous clocks | TXCLK and RXCLK eliminate setup/hold timing uncertainty between FPGA and PHY - simplifies PCB layout and timing closure for high-speed parallel interfaces. |
| Industrial temperature grade | Guaranteed operation from −40 °C to +85 °C - qualified for deployment in factory automation controllers, railway signaling, and outdoor infrastructure equipment. |
| Receiver detection & loopback | Hardware-accelerated link validation without MAC intervention - enables rapid system bring-up and in-field diagnostics via JTAG or register access. |
| Multi-state power management | Native support for P0, P0s, and P1 states with status feedback - allows precise coordination with host MAC for dynamic power scaling in battery-backed or thermally constrained systems. |
Applications
| Industrial PLC Backplane Interconnect | FPGA-Based PCIe Endpoint Bridge |
|---|---|
Use Scenario: Connecting modular I/O cards to a central controller over a compact, low-pin-count PCIe x1 backplane in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Stand-alone PHY providing physical layer compliance, clock recovery, and electrical isolation between FPGA-based MAC and backplane traces. Use Value: Enables deterministic 2.5 Gbit/s link establishment with <300 mW power draw and industrial temperature resilience - eliminating need for custom SerDes IP or discrete analog front-end components. | Use Scenario: Adding PCIe connectivity to FPGA-based vision processing modules used in machine inspection systems where legacy designs lack native PCIe transceivers. IC Role / Device Role / Timing Role: Off-chip PHY bridging FPGA's parallel bus to PCIe differential signaling, with source-synchronous PXPIPE easing timing constraints on FPGA I/O. Use Value: Delivers full PCIe Gen 1 compliance using only standard SSTL_2 FPGA I/O banks - avoids costly FPGA migration to higher-end families with integrated transceivers. |
| Embedded Test Equipment Link Controller | Ruggedized Edge Compute Gateway |
Use Scenario: Integrating PCIe-based data acquisition cards into portable test instruments operating in variable ambient conditions (e.g., field calibration tools). IC Role / Device Role / Timing Role: PHY managing link training, electrical idle, and receiver detection under intermittent power cycling and thermal stress. Use Value: Provides JTAG-accessible BIST and real-time RXSTATUS error reporting - enabling automated self-test and fault logging without host software dependency. | Use Scenario: Enabling PCIe expansion in fanless edge gateways deployed in telecom cabinets or remote substations with wide temperature swings. IC Role / Device Role / Timing Role: Industrial-grade PHY handling PCIe lane negotiation, spread-spectrum clocking, and P1 power state entry/exit under thermal throttling conditions. Use Value: Guarantees link stability across −40 °C to +85 °C with <300 ppm clock tolerance compensation - ensuring uninterrupted communication during environmental transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCIe Gen 1 x1 PHY applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT8N3SV772 | Single-lane PCIe Gen 1 PHY in QFN48; lacks JTAG BIST and industrial temp rating; requires external 50 Ω termination resistors. | Targeted at cost-sensitive consumer electronics; not qualified for extended temperature or safety-critical diagnostics. | Select when footprint and BOM count are prioritized over testability and industrial qualification. |
| TI TSB580 | PCIe Gen 1 x1 PHY in LFBGA80; supports same PXPIPE interface but uses 1.8 V I/O; no built-in spread-spectrum clock support. | Designed for low-voltage mobile/embedded SoCs; requires level-shifting for 2.5 V SSTL_2 FPGA interfaces. | Select when interfacing with 1.8 V logic domains and spread-spectrum EMI reduction is handled externally. |
Compared with IDT8N3SV772 and TI TSB580, the PX1011BI-EL1/G,518 uniquely combines industrial temperature operation, integrated 50 Ω termination, JTAG BIST, and spread-spectrum clocking in a single LFBGA81 package - making it optimal for high-reliability, test-ready PCIe link implementations where FPGA compatibility and thermal robustness are mandatory.
Availability
PX1011BI-EL1/G,518 is available at Aetrix Electronics and suitable for industrial PLC backplanes, FPGA-based PCIe endpoint bridges, embedded test equipment, ruggedized edge compute gateways, and PCIe diagnostic subsystems requiring stable component supply across extended lifecycle programs.
Supply support for PX1011BI-EL1/G,518 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in interface, RF, and mixed-signal technologies.
The PX1011B product line delivers PCIe physical layer silicon optimized for FPGA-centric embedded systems requiring off-chip SerDes functionality, industrial reliability, and simplified timing integration - targeting industrial automation, test instrumentation, and edge infrastructure markets.
FAQ
What is the operating temperature range of the PX1011BI-EL1/G,518?
The PX1011BI-EL1/G,518 is rated for industrial temperature operation from −40 °C to +85 °C, as confirmed by NXP's ordering information and quick reference data tables. This range is explicitly designated by the "I" suffix in the part number and validated through thermal characterization per JEDEC JESD22-A104. The PX1011BI-EL1/G,518 maintains full PCIe Gen 1 compliance and timing specifications across this entire range without derating.
Does the PX1011BI-EL1/G,518 integrate on-chip termination for its PCIe differential I/Os?
Yes, the PX1011BI-EL1/G,518 integrates 50 Ω on-chip termination for both RX_P/RX_N and TX_P/TX_N differential pairs, as specified in Tables 5 and 6 of the datasheet. This eliminates the need for external 50 Ω resistors on the PCB, reducing component count and improving signal integrity consistency. The termination is active during normal operation and remains functional across the full industrial temperature range.
How does the PX1011BI-EL1/G,518 handle clock tolerance between link partners?
The PX1011BI-EL1/G,518 uses an elastic buffer capable of holding at least seven symbols to compensate for ±600 ppm frequency differences between link partners, as described in Section 8.9. It dynamically inserts or removes SKP ordered sets in the received data stream and signals these actions to the MAC via RXSTATUS[2:0], ensuring reliable data alignment without buffer overflow or underflow - a requirement for PCIe Gen 1 interoperability.
What power management states does the PX1011BI-EL1/G,518 support?
The PX1011BI-EL1/G,518 supports PCIe-defined P0 (normal operation), P0s (transmit idle), and P1 (full link idle) power states, controlled via PWRDWN[1:0] inputs. It meets all timing constraints for clock recovery and link training across these states, with PHYSTATUS pulsing to confirm state transitions. Power dissipation is <300 mW in P0 and scales down in lower states, as verified in Section 2.4 and Table 13.
Is the PX1011BI-EL1/G,518 compatible with standard FPGA I/O interfaces?
Yes, the PX1011BI-EL1/G,518 uses 2.5 V SSTL_2 Class I signaling on its 8-bit PXPIPE interface, which is directly compatible with common FPGA I/O banks (e.g., Xilinx 7-series, Intel Cyclone V/Arria 10). No level shifters or external termination resistors are required, as confirmed in Sections 2.2 and 8. Functional Description. The source-synchronous TXCLK/RXCLK further simplifies timing closure versus asynchronous interfaces.
PX1011BI-EL1/G,518 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 81-LFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- PCI Express MAX to PCI Express PHY
- Interface:
- JTAG
- Voltage - Supply:
- 1.2V
- Supplier Device Package:
- 81-LFBGA (9x9)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
PX1011BI-EL1/G,518 FAQ
1.How can I place an order for PX1011BI-EL1/G,518 through Aetrix?
Please submit a Request for Quotation (RFQ) for PX1011BI-EL1/G,518 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PX1011BI-EL1/G,518 reliable?
The price and inventory of PX1011BI-EL1/G,518 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PX1011BI-EL1/G,518 is usually 5 days.
3.What payment methods are accepted for PX1011BI-EL1/G,518?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PX1011BI-EL1/G,518 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PX1011BI-EL1/G,518?
PX1011BI-EL1/G,518 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PX1011BI-EL1/G,518 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PX1011BI-EL1/G,518?
For technical support, including PX1011BI-EL1/G,518 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PX1011BI-EL1/G,518 requirements.
6.How does Aetrix verify that PX1011BI-EL1/G,518 is sourced from the original manufacturer or authorized distributors?
All PX1011BI-EL1/G,518 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PX1011BI-EL1/G,518 meets industry standards.
7.What is the process for return or replacement of PX1011BI-EL1/G,518?
All PX1011BI-EL1/G,518 units undergo pre-shipment inspection (PSI). If there is an issue with PX1011BI-EL1/G,518, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PX1011BI-EL1/G,518 part is unused and in its original packaging.
Return procedure for PX1011BI-EL1/G,518:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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