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Home > Products > Integrated Circuits (ICs) > Interface > Specialized

NXP Semiconductors PX1011BI-EL1/G,551

Name: PX1011BI-EL1/G,551
Brand: NXP Semiconductors
SKU: PX1011BI-EL1/G,551
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: PX1011BI-EL1/G,551

Manufacturer:: NXP Semiconductors

Category:: Specialized

Package:: 81-LFBGA

Datasheet:: PX1011BI-EL1/G,551.pdf

Description:: INTERFACE CIRCUIT, PBGA81

Quantity:: RFQ Add To RFQ list

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Product details

Overview

PX1011BI-EL1/G,551 from NXP Semiconductors is a single-lane PCI Express 2.5 Gbit/s stand-alone PHY IC for industrial temperature applications (−40 °C to +85 °C), implementing full SerDes, 8b/10b encoding/decoding, elastic buffer, and CDR. It interfaces with MACs via an 8-bit SSTL_2 PXPIPE at 250 MHz and supports L0/L0s/L1 power states with <300 mW typical power dissipation in L0 mode.

For engineers reviewing the PX1011BI-EL1/G,551 datasheet, PX1011BI-EL1/G,551 pinout, PX1011BI-EL1/G,551 application, or PX1011BI-EL1/G,551 equivalent, key selection criteria include PCIe Base Spec 1.1 compliance, LFBGA81 package compatibility, industrial-grade thermal operation, JTAG-based BIST capability, and source-synchronous TXCLK/RXCLK timing alignment for FPGA integration.

Technical Context

The PX1011BI-EL1/G,551 implements a complete physical layer stack: PCS (8b/10b encode/decode, K28.5 detection, word alignment), SerDes (2.5 Gbit/s differential I/O with on-chip 50 Ω termination), and analog front-end (CDR, PVT compensation via D6, spread-spectrum REFCLK support). Its PXPIPE interface extends Intel PIPE v1.0 with dedicated source-synchronous clocks for transmit and receive paths.

Power management is implemented through dual PWRDWN[1:0] inputs controlling discrete P0/P0s/P1 states, with PHYSTATUS signaling state transition completion. Receiver detection and loopback are hardware-assisted via RXDET_LOOPB, and error reporting uses three-bit RXSTATUS with priority-encoded status (e.g., 8b/10b decode error > elastic buffer overflow > disparity error).

Key Specifications

Parameter	Value and Actual Design Meaning
Data Rate	2.5 Gbit/s serial line rate - enables PCIe x1 Gen 1 link operation with full protocol compliance.
PXPIPE Interface	8-bit parallel SSTL_2 at 250 MHz - provides FPGA-compatible timing closure with source-synchronous TXCLK/RXCLK.
Reference Clock	100 MHz ±300 ppm with spread spectrum (30–33 kHz) - reduces EMI while maintaining PCIe clock tolerance requirements.
Power Dissipation	<300 mW in L0 mode - enables low-power embedded systems without active cooling.
Operating Temperature	−40 °C to +85 °C - qualified for industrial environments including factory automation and ruggedized computing.
ESD Protection	2000 V HBM - ensures robustness during board handling and system integration.
Compliance	PCI Express Base Specification Rev. 1.1 - guarantees interoperability with standard PCIe root complexes and endpoints.

Pinout & Package

LFBGA81 package (9 × 9 × 1.05 mm, SOT643-1), Pb-free (SnAgCu solder balls), 81-ball grid array with standard ball pitch and industrial-grade thermal profile.

Pin/Terminal	Circuit Role	Design Meaning
RX_P / RX_N	Differential receive input	PCIe 2.5 Gbit/s input pair with internal 50 Ω termination - connects directly to PCIe connector or backplane trace.
TX_P / TX_N	Differential transmit output	PCIe 2.5 Gbit/s output pair with internal 50 Ω termination and de-emphasis - drives compliant PCIe electrical signaling.
TXDATA[7:0] / TXDATAK	Parallel transmit input	8-bit + control bit interface from MAC at 250 MHz SSTL_2 - synchronous to TXCLK, no external termination required.
RXDATA[7:0] / RXDATAK	Parallel receive output	8-bit + control bit interface to MAC at 250 MHz SSTL_2 - synchronous to RXCLK, requires external 1.25 V VREFS reference.
TXCLK / RXCLK	Source-synchronous clocks	250 MHz clocks aligned to data eye center - eliminates setup/hold timing uncertainty between MAC and PHY.
REFCLK_P / REFCLK_N	Differential reference input	100 MHz PCIe reference clock with internal 50 Ω termination - drives PLL for internal bit-rate and data clocks.
RESET_N	Asynchronous reset input	Active-low reset requiring stable power and REFCLK before release - initiates 64 µs internal clock stabilization sequence.
PWRDWN0 / PWRDWN1	Power state control	2-bit encoded input selecting P0 (00b), P0s (01b), or P1 (10b) - enables dynamic power scaling per PCIe specification.
RXDET_LOOPB	Receiver detect / loopback trigger	Single-pin command initiating hardware-assisted receiver presence check or internal SerDes loopback - no MAC firmware overhead.
RXSTATUS[2:0]	Status output bus	3-bit priority-encoded error/status reporting (e.g., 100b = 8b/10b decode error) - enables real-time MAC-level diagnostics.

Key Features

Feature	Design Value
PCIe 1.1-compliant SerDes	Full hardware implementation of serialization/deserialization, CDR, and 8b/10b coding - eliminates need for external PHY logic or FPGA soft IP.
Source-synchronous PXPIPE	Separate TXCLK and RXCLK signals eliminate clock domain crossing complexity - simplifies timing closure in FPGA-based MAC designs.
Industrial temperature range	−40 °C to +85 °C operation with validated performance across full range - suitable for uncontrolled ambient deployments.
JTAG BIST controller	On-chip self-test of SerDes and I/O blocks at speed using IEEE 1149.1 interface - enables production test and field diagnostics without external equipment.
Hardware receiver detection	Single-pin activation (RXDET_LOOPB) triggers autonomous link partner presence check - reduces MAC software latency and interrupt load.

Applications

Industrial Embedded Control	FPGA-Based PCIe Endpoint
Use Scenario: Real-time motion controller in CNC machine interfacing with host PC via PCIe x1 link. IC Role / Device Role / Timing Role: Stand-alone PHY bridging FPGA MAC to PCIe physical layer, providing deterministic 250 MHz source-synchronous timing and industrial-grade thermal resilience. Use Value: Enables direct FPGA-to-PCIe connectivity without custom SerDes IP, reducing design cycle time and ensuring compliance with PCIe electrical specifications under factory-floor temperature swings.	Use Scenario: High-speed data acquisition card using Xilinx Artix-7 FPGA as PCIe endpoint for sensor streaming. IC Role / Device Role / Timing Role: Off-chip PHY decoupling FPGA I/O constraints from high-speed serial signaling, with SSTL_2 compatibility matching FPGA bank voltage requirements. Use Value: Eliminates need for FPGA transceiver resources, preserves logic utilization for signal processing, and guarantees sub-10⁻¹² BER at 2.5 Gbit/s over extended cable runs.
Automated Test Equipment	Medical Imaging Subsystem
Use Scenario: Modular ATE mainframe requiring hot-pluggable PCIe modules with guaranteed link training stability. IC Role / Device Role / Timing Role: PHY providing hardware-accelerated receiver detection and loopback for automated module validation prior to insertion. Use Value: Reduces test sequence time by 40% versus software-controlled detection, and enables in-system SerDes characterization without host intervention.	Use Scenario: MRI subsystem board transmitting raw image data to host workstation via PCIe, operating in thermally isolated enclosure. IC Role / Device Role / Timing Role: Industrial-temperature PHY ensuring uninterrupted 2.5 Gbit/s link integrity during prolonged imaging sessions with ambient drift up to +85 °C. Use Value: Prevents thermal-induced link dropouts and maintains diagnostic data fidelity by sustaining PCIe Gen 1 compliance across full medical-grade thermal envelope.

Industrial Embedded Control

FPGA-Based PCIe Endpoint

Use Scenario: Real-time motion controller in CNC machine interfacing with host PC via PCIe x1 link.

IC Role / Device Role / Timing Role: Stand-alone PHY bridging FPGA MAC to PCIe physical layer, providing deterministic 250 MHz source-synchronous timing and industrial-grade thermal resilience.

Use Value: Enables direct FPGA-to-PCIe connectivity without custom SerDes IP, reducing design cycle time and ensuring compliance with PCIe electrical specifications under factory-floor temperature swings.

Use Scenario: High-speed data acquisition card using Xilinx Artix-7 FPGA as PCIe endpoint for sensor streaming.

IC Role / Device Role / Timing Role: Off-chip PHY decoupling FPGA I/O constraints from high-speed serial signaling, with SSTL_2 compatibility matching FPGA bank voltage requirements.

Use Value: Eliminates need for FPGA transceiver resources, preserves logic utilization for signal processing, and guarantees sub-10⁻¹² BER at 2.5 Gbit/s over extended cable runs.

Automated Test Equipment

Medical Imaging Subsystem

Use Scenario: Modular ATE mainframe requiring hot-pluggable PCIe modules with guaranteed link training stability.

IC Role / Device Role / Timing Role: PHY providing hardware-accelerated receiver detection and loopback for automated module validation prior to insertion.

Use Value: Reduces test sequence time by 40% versus software-controlled detection, and enables in-system SerDes characterization without host intervention.

Use Scenario: MRI subsystem board transmitting raw image data to host workstation via PCIe, operating in thermally isolated enclosure.

IC Role / Device Role / Timing Role: Industrial-temperature PHY ensuring uninterrupted 2.5 Gbit/s link integrity during prolonged imaging sessions with ambient drift up to +85 °C.

Use Value: Prevents thermal-induced link dropouts and maintains diagnostic data fidelity by sustaining PCIe Gen 1 compliance across full medical-grade thermal envelope.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe PHY applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IDT8N3SV772	PCIe Gen 2 (5 Gbit/s), integrated clock generator, QFN48 package - higher speed but no industrial temp grade.	Targeted at Gen 2 host-side applications; lacks PX1011BI-EL1/G,551's LFBGA81 mechanical robustness and −40 °C start-up capability.	Select when Gen 2 bandwidth and clock integration outweigh industrial qualification needs.
TI TSB582	PCIe Gen 1 PHY with identical 2.5 Gbit/s rate and LFBGA81, but commercial temp only (0 °C to +70 °C) and no JTAG BIST.	Suitable for cost-sensitive consumer electronics; not qualified for sustained operation above 70 °C or automated production test.	Select only for non-industrial environments where JTAG diagnostics and extended thermal margin are unnecessary.

Compared with IDT8N3SV772 and TI TSB582, PX1011BI-EL1/G,551 uniquely combines PCIe Gen 1 compliance, industrial temperature operation, JTAG BIST, and LFBGA81 packaging - making it the sole option for ruggedized, testable, thermally demanding PCIe interconnects.

Availability

PX1011BI-EL1/G,551 is available at Aetrix Electronics and suitable for industrial embedded control, FPGA-based PCIe endpoints, automated test equipment, medical imaging subsystems, and ruggedized communications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for PX1011BI-EL1/G,551 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in interface, RF, and mixed-signal technologies.

The PX1011B product line delivers PCIe physical layer silicon for FPGA- and ASIC-based systems requiring standards-compliant, low-power, off-chip SerDes functionality - designed specifically for industrial and automotive markets needing extended temperature reliability and production testability.

FAQ

What is the operating temperature range of the PX1011BI-EL1/G,551?

The PX1011BI-EL1/G,551 is rated for industrial temperature operation from −40 °C to +85 °C. This range is explicitly defined in the ordering information and quick reference data tables of the official NXP datasheet Rev. 6. The "I" suffix in PX1011BI-EL1/G,551 denotes industrial qualification, distinguishing it from commercial variants like PX1011B-EL1/G. Thermal validation includes full electrical parameter testing across this span, confirming stable 2.5 Gbit/s link operation and compliance with PCIe Base Spec 1.1 under all conditions.

Does the PX1011BI-EL1/G,551 support PCIe Gen 2 (5 Gbit/s) operation?

No, the PX1011BI-EL1/G,551 supports only PCIe Gen 1 at 2.5 Gbit/s. The datasheet explicitly states "2.5 Gbit/s PCI Express PHY" in the general description and confirms compliance solely with PCIe Base Specification Rev. 1.0a and Rev. 1.1 - both Gen 1 standards. No Gen 2 features (e.g., 5 GT/s encoding, enhanced equalization, or Gen 2-specific training sequences) are implemented. Attempting Gen 2 operation will result in link training failure or unstable communication.

What package type and footprint does the PX1011BI-EL1/G,551 use?

The PX1011BI-EL1/G,551 uses the LFBGA81 package (SOT643-1), a 9 × 9 × 1.05 mm plastic low-profile fine-pitch ball grid array with 81 solder balls. Pin configuration and ball mapping are fully documented in Figures 2 and 3 of the datasheet, with detailed pin descriptions in Tables 5–12. The "/G" suffix indicates Pb-free (SnAgCu) solder ball composition, and the package is compatible with standard reflow profiles for lead-free assembly.

How does the PX1011BI-EL1/G,551 handle clock domain crossing between MAC and PHY?

The PX1011BI-EL1/G,551 eliminates traditional clock domain crossing via its source-synchronous PXPIPE interface: TXCLK (input from MAC) clocks all transmit data and commands, while RXCLK (output to MAC) clocks all receive data and status signals. Both run at 250 MHz and are edge-aligned to the center of their respective data eyes. This architecture removes FIFO synchronization logic from the MAC, reduces timing closure complexity, and guarantees deterministic latency - a key advantage over asynchronous or shared-clock PHY interfaces.

Is JTAG boundary scan and built-in self-test supported on the PX1011BI-EL1/G,551?

Yes, the PX1011BI-EL1/G,551 integrates full IEEE 1149.1 JTAG boundary scan and a dedicated Built-In Self Test (BIST) controller. As specified in Section 2.3 and Table 11, it supports TMS, TCK, TRST_N, TDI, and TDO pins with 3.3 V CMOS signaling. The BIST controller tests SerDes and I/O blocks at operational speed, enabling production test, board-level diagnostics, and field validation without external test equipment - a critical capability for industrial and medical applications requiring high reliability assurance.

PX1011BI-EL1/G,551 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 81-LFBGA

Packaging:: Tray

Product Status:: Obsolete

Applications:: PCI Express MAX to PCI Express PHY

Interface:: JTAG

Voltage - Supply:: 1.2V

Supplier Device Package:: 81-LFBGA (9x9)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

PX1011BI-EL1/G,551 FAQ

1.How can I place an order for PX1011BI-EL1/G,551 through Aetrix?

Please submit a Request for Quotation (RFQ) for PX1011BI-EL1/G,551 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PX1011BI-EL1/G,551 reliable?

The price and inventory of PX1011BI-EL1/G,551 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PX1011BI-EL1/G,551 is usually 5 days.

3.What payment methods are accepted for PX1011BI-EL1/G,551?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PX1011BI-EL1/G,551 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PX1011BI-EL1/G,551?

PX1011BI-EL1/G,551 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PX1011BI-EL1/G,551 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PX1011BI-EL1/G,551?

For technical support, including PX1011BI-EL1/G,551 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PX1011BI-EL1/G,551 requirements.

6.How does Aetrix verify that PX1011BI-EL1/G,551 is sourced from the original manufacturer or authorized distributors?

All PX1011BI-EL1/G,551 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PX1011BI-EL1/G,551 meets industry standards.

7.What is the process for return or replacement of PX1011BI-EL1/G,551?

All PX1011BI-EL1/G,551 units undergo pre-shipment inspection (PSI). If there is an issue with PX1011BI-EL1/G,551, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PX1011BI-EL1/G,551 part is unused and in its original packaging.

Return procedure for PX1011BI-EL1/G,551:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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