Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Interface > Specialized

NXP Semiconductors PX1012AI-EL1/G,551

Name: PX1012AI-EL1/G,551
Brand: NXP Semiconductors
SKU: PX1012AI-EL1/G,551
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: PX1012AI-EL1/G,551

Manufacturer:: NXP Semiconductors

Category:: Specialized

Package:: 81-LFBGA

Datasheet:: PX1012AI-EL1/G,551.pdf

Description:: IC INTFACE SPECIALIZED 81LFBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,959

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

PX1012AI-EL1/G,551 from NXP Semiconductors (formerly Philips Semiconductors) is a single-lane PCI Express 1.1-compliant stand-alone physical layer (PHY) IC for x1 links, operating at 2.5 Gbit/s with 8-bit PXPIPE interface at 250 MHz, SSTL_2 signaling, and industrial temperature range (−40 °C to +85 °C). It performs clock and data recovery, 8b/10b encoding/decoding, elastic buffering, receiver detection, and loopback - enabling reliable PCIe interconnect between FPGA-based MACs and high-speed serial links in embedded control and industrial computing systems.

For engineers reviewing the PX1012AI-EL1/G,551 datasheet, PX1012AI-EL1/G,551 pinout, PX1012AI-EL1/G,551 application, or PX1012AI-EL1/G,551 equivalent, key selection considerations include its LFBGA81 package, 250 MHz source-synchronous PXPIPE timing, 100 MHz ±300 ppm reference clock support, industrial-grade power management (L0/L0s/L1), and differential PCIe I/O with on-chip 50 Ω termination.

Technical Context

The PX1012AI-EL1/G,551 implements a full SerDes architecture with integrated CDR PLL, 8b/10b encoder/decoder, and elastic buffer supporting SKP symbol insertion/removal for clock tolerance compensation up to ±600 ppm. Its PXPIPE interface extends Intel's PIPE v1.0 with dedicated TXCLK and RXCLK source-synchronous clocks for deterministic timing closure with FPGA MACs.

It supports JTAG IEEE 1149.1 boundary scan with BIST for SerDes and I/O blocks, operates across three independent supply domains (VDDA1/VDDA2 for analog SerDes, VDDD2 for SSTL_2 I/O, VDDD3 for core), and delivers <300 mW typical power dissipation in L0 mode while maintaining compliance with PCIe Base Spec Rev. 1.1.

Key Specifications

Parameter	Value and Actual Design Meaning
Data rate	2.5 Gbit/s serial line rate - enables PCIe Gen1 x1 link operation with full protocol compliance.
Interface	8-bit PXPIPE at 250 MHz - superset of PIPE v1.0 with source-synchronous TXCLK/RXCLK for FPGA timing margin.
Reference clock	100 MHz ±300 ppm - supports spread-spectrum modulation (30–33 kHz) to reduce EMI in dense PCB layouts.
Operating temp	−40 °C to +85 °C - qualified for industrial environments including factory automation and ruggedized computing.
Power dissipation	<300 mW in L0 - enables thermal design without forced cooling in space-constrained embedded modules.
ESD rating	2000 V HBM - provides robust handling during board assembly and field service in industrial settings.
Package	LFBGA81 (9 × 9 × 1.05 mm) - fine-pitch ball grid array compatible with standard SMT reflow profiles and high-density routing.

Pinout & Package

LFBGA81 package: plastic low-profile fine-pitch ball grid array, 81 balls, body size 9 mm × 9 mm × 1.05 mm, lead-free (SnAgCu solder ball compound), compliant with JEDEC MO-220.

Pin/Terminal	Circuit Role	Design Meaning
RX_P / RX_N	Differential receive input	PCIe 2.5 Gbit/s input pair with 50 Ω on-chip termination - eliminates external resistors and simplifies layout.
TX_P / TX_N	Differential transmit output	PCIe 2.5 Gbit/s output pair with 50 Ω on-chip termination and built-in de-emphasis - improves signal integrity at receiver.
TXDATA[7:0] / TXDATAK	Parallel transmit input	8-bit + control bit interface from MAC at 250 MHz SSTL_2 - synchronous to TXCLK for setup/hold timing control.
RXDATA[7:0] / RXDATAK	Parallel receive output	8-bit + control bit output to MAC, aligned to RXCLK rising edge - ensures deterministic data capture in FPGA logic.
REFCLK_P / REFCLK_N	Differential reference clock input	100 MHz PCIe reference clock with 50 Ω on-chip termination - reduces jitter sensitivity and eliminates external AC coupling.
TXCLK / RXCLK	Source-synchronous clocks	250 MHz clocks provided by MAC (TXCLK) and generated by PHY (RXCLK) - enables timing closure without global clock distribution.
RXDET_LOOPB	Receiver detect / loopback control	Active-low command to initiate receiver presence check or internal SerDes loopback - used for link training and diagnostics.
PWRDWN[1:0]	Power state select	2-bit input controlling L0/L0s/L1 states per PCIe spec - allows dynamic power scaling without MAC firmware changes.

Key Features

Feature	Design Value
PCIe 1.1 compliance	Fully compliant with PCI Express Base Specification Rev. 1.1 - ensures interoperability with standard root complexes and endpoints.
On-chip CDR PLL	Recovers 2.5 Gbit/s clock from serial stream with low jitter - eliminates need for external clock recovery IC and reduces BOM count.
Elastic buffer with SKP handling	Manages ±600 ppm clock tolerance via automatic SKP symbol insertion/removal - maintains link stability across temperature and voltage variations.
JTAG + BIST	IEEE 1149.1 boundary scan with built-in self-test for SerDes and I/O at speed - enables production test and field diagnostics without external equipment.
Industrial temperature grade	Qualified from −40 °C to +85 °C - supports deployment in uncontrolled ambient environments such as motor drives and outdoor gateways.

Applications

Industrial PLC Backplane Interconnect	FPGA-Based PCIe Bridge Module
Use Scenario: Connecting modular I/O cards to a central controller over a compact backplane using PCIe x1 links. IC Role / Device Role / Timing Role: Stand-alone PHY providing electrical layer translation between FPGA MAC and differential PCIe traces, with source-synchronous PXPIPE timing for deterministic latency. Use Value: Enables hot-plug-capable, low-latency communication with <300 mW power draw and industrial temperature resilience - eliminating need for custom SerDes IP or discrete clock recovery.	Use Scenario: Adding PCIe host capability to an FPGA-based embedded system via a mezzanine card or carrier board. IC Role / Device Role / Timing Role: Off-chip PHY bridging FPGA's parallel MAC interface to PCIe slot or M.2 connector, using TXCLK/RXCLK for timing closure. Use Value: Reduces FPGA resource usage (no embedded SerDes required), supports 250 MHz SSTL_2 I/O compatible with Xilinx/Intel FPGA banks, and simplifies PCIe compliance testing.
Medical Imaging Data Acquisition	Ruggedized Edge Computing Gateway
Use Scenario: High-fidelity sensor data streaming from FPGA-accelerated acquisition modules to host CPU via PCIe. IC Role / Device Role / Timing Role: Reliable physical layer translator ensuring bit-accurate transmission of time-critical imaging frames with elastic buffer compensation for clock drift. Use Value: Maintains BER <10⁻¹² under thermal stress (−40 °C to +85 °C), supports loopback for in-system validation, and integrates 8b/10b encoding to guarantee DC balance and transition density.	Use Scenario: Deploying fanless edge gateways in transportation or energy infrastructure with long-life component requirements. IC Role / Device Role / Timing Role: Industrial-grade PCIe PHY enabling secure, low-power expansion of compute capabilities via M.2 or mini-PCIe slots. Use Value: Delivers L0s/L1 power management for extended battery life or passive cooling, includes JTAG BIST for field-upgrade verification, and features 2000 V HBM ESD protection for harsh EMI environments.

Industrial PLC Backplane Interconnect

FPGA-Based PCIe Bridge Module

Use Scenario: Connecting modular I/O cards to a central controller over a compact backplane using PCIe x1 links.

IC Role / Device Role / Timing Role: Stand-alone PHY providing electrical layer translation between FPGA MAC and differential PCIe traces, with source-synchronous PXPIPE timing for deterministic latency.

Use Value: Enables hot-plug-capable, low-latency communication with <300 mW power draw and industrial temperature resilience - eliminating need for custom SerDes IP or discrete clock recovery.

Use Scenario: Adding PCIe host capability to an FPGA-based embedded system via a mezzanine card or carrier board.

IC Role / Device Role / Timing Role: Off-chip PHY bridging FPGA's parallel MAC interface to PCIe slot or M.2 connector, using TXCLK/RXCLK for timing closure.

Use Value: Reduces FPGA resource usage (no embedded SerDes required), supports 250 MHz SSTL_2 I/O compatible with Xilinx/Intel FPGA banks, and simplifies PCIe compliance testing.

Medical Imaging Data Acquisition

Ruggedized Edge Computing Gateway

Use Scenario: High-fidelity sensor data streaming from FPGA-accelerated acquisition modules to host CPU via PCIe.

IC Role / Device Role / Timing Role: Reliable physical layer translator ensuring bit-accurate transmission of time-critical imaging frames with elastic buffer compensation for clock drift.

Use Value: Maintains BER <10⁻¹² under thermal stress (−40 °C to +85 °C), supports loopback for in-system validation, and integrates 8b/10b encoding to guarantee DC balance and transition density.

Use Scenario: Deploying fanless edge gateways in transportation or energy infrastructure with long-life component requirements.

IC Role / Device Role / Timing Role: Industrial-grade PCIe PHY enabling secure, low-power expansion of compute capabilities via M.2 or mini-PCIe slots.

Use Value: Delivers L0s/L1 power management for extended battery life or passive cooling, includes JTAG BIST for field-upgrade verification, and features 2000 V HBM ESD protection for harsh EMI environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe Gen1 x1 PHY applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IDT8N34S272BGI	Integrated PCIe clock generator + PHY; requires external reference clock; no PXPIPE interface - uses standard PIPE v1.0.	Targeted at clock-synchronized multi-lane systems; lacks source-synchronous TXCLK/RXCLK for FPGA timing margin.	Choose when combining clock generation and PHY functions reduces board area, but avoid if FPGA MAC timing closure depends on PXPIPE-style source sync.
TI TSB580IRGZT	PCIe Gen2 x1 PHY; supports 5 Gbit/s; higher power (~450 mW); different package (VQFN64); no industrial temp grade.	Designed for bandwidth upgrades in commercial systems; not rated for −40 °C operation or 2000 V HBM.	Choose only if Gen2 speed is mandatory and industrial qualification is unnecessary; otherwise PX1012AI-EL1/G,551 offers better thermal/power fit.

Compared with IDT8N34S272BGI and TSB580IRGZT, PX1012AI-EL1/G,551 uniquely delivers industrial temperature operation, source-synchronous PXPIPE timing for FPGA integration, and sub-300 mW L0 power - making it optimal for space- and thermally constrained embedded PCIe endpoints where reliability outweighs raw speed.

Availability

PX1012AI-EL1/G,551 is available at Aetrix Electronics and suitable for industrial PLC backplanes, FPGA-based PCIe bridge modules, medical imaging acquisition systems, and ruggedized edge computing gateways requiring stable component supply across extended product lifecycles.

Supply support for PX1012AI-EL1/G,551 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in high-performance interface IP from its Philips Semiconductors acquisition.

The PX1012AI-EL1/G,551 belongs to NXP's legacy PCI Express PHY product line, designed specifically to enable cost-effective, FPGA-friendly PCIe Gen1 interconnect in industrial and embedded systems where thermal resilience and timing predictability are critical.

FAQ

What is the operating temperature range of the PX1012AI-EL1/G,551?

The PX1012AI-EL1/G,551 is rated for industrial temperature operation from −40 °C to +85 °C. This specification is confirmed in the official Philips/NXP product data sheet (Rev. 02, May 2006), Table 1 and Section 2.6. The "I" suffix in PX1012AI explicitly denotes industrial grade, distinguishing it from commercial variants like PX1012A (0 °C to +70 °C). This makes PX1012AI-EL1/G,551 suitable for deployment in factory automation, outdoor gateways, and other thermally demanding environments where commercial-grade components would fail.

Does the PX1012AI-EL1/G,551 support PCIe Gen2 (5 Gbit/s) operation?

No, the PX1012AI-EL1/G,551 supports only PCIe Gen1 at 2.5 Gbit/s. Its datasheet explicitly states compliance with PCI Express Base Specification Rev. 1.0a and Rev. 1.1 - both Gen1 standards. The SerDes architecture, CDR bandwidth, and timing parameters (e.g., 250 MHz PXPIPE interface) are optimized for 2.5 Gbit/s operation. Attempting to run the PX1012AI-EL1/G,551 at 5 Gbit/s will result in link failure due to insufficient bandwidth and non-compliant jitter performance. For Gen2, consider alternatives like TI TSB580IRGZT - though it lacks industrial temperature rating.

What package type and footprint does the PX1012AI-EL1/G,551 use?

The PX1012AI-EL1/G,551 uses an LFBGA81 package (SOT643-1), measuring 9 mm × 9 mm × 1.05 mm with 81 solder balls in a fine-pitch grid. It is lead-free (SnAgCu solder ball compound), as indicated by the "/G" suffix in the part number. Pin mapping and mechanical dimensions are fully documented in Figures 2–3 and Table 2 of the NXP datasheet. The package supports standard reflow profiles and is compatible with automated optical inspection (AOI) and X-ray inspection for solder joint quality in high-reliability manufacturing.

How does the PX1012AI-EL1/G,551 handle clock tolerance between link partners?

The PX1012AI-EL1/G,551 uses an elastic buffer with automatic SKP symbol insertion and removal to compensate for up to ±600 ppm frequency differences between transmitter and receiver clocks. As described in Section 8.9 and Figure 9–10 of the datasheet, the PHY monitors incoming SKP ordered sets and adjusts buffer depth by adding or dropping one SKP symbol per set - signaling each action via RXSTATUS for MAC awareness. This mechanism ensures continuous data flow without overflow/underflow, even under worst-case PVT drift, and is essential for stable PCIe link operation in thermally varying industrial systems.

Is the PX1012AI-EL1/G,551 pin-compatible with the PX1011AI-EL1/G,551?

Yes, the PX1012AI-EL1/G,551 is pin-compatible with the PX1011AI-EL1/G,551. Both share identical LFBGA81 packaging (SOT643-1), identical pinout (Fig. 3), and identical power supply, I/O, and control signal assignments per Tables 5–12. The primary functional difference lies in the supported PCIe lane configuration: PX1011A is a single-lane PHY with optional shared reference clock mode, while PX1012A supports standalone operation with dedicated REFCLK_P/REFCLK_N differential input. This makes PX1012AI-EL1/G,551 the preferred choice for new designs requiring robust differential reference clocking - but existing PX1011AI-EL1/G,551 layouts can be reused without PCB changes.

PX1012AI-EL1/G,551 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 81-LFBGA

Packaging:: Tray

Product Status:: Obsolete

Applications:: PCI Express MAX to PCI Express PHY

Interface:: IEEE 1149.1

Voltage - Supply:: 1.2V

Supplier Device Package:: 81-LFBGA (9x9)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

PX1012AI-EL1/G,551 FAQ

1.How can I place an order for PX1012AI-EL1/G,551 through Aetrix?

Please submit a Request for Quotation (RFQ) for PX1012AI-EL1/G,551 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PX1012AI-EL1/G,551 reliable?

The price and inventory of PX1012AI-EL1/G,551 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PX1012AI-EL1/G,551 is usually 5 days.

3.What payment methods are accepted for PX1012AI-EL1/G,551?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PX1012AI-EL1/G,551 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PX1012AI-EL1/G,551?

PX1012AI-EL1/G,551 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PX1012AI-EL1/G,551 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PX1012AI-EL1/G,551?

For technical support, including PX1012AI-EL1/G,551 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PX1012AI-EL1/G,551 requirements.

6.How does Aetrix verify that PX1012AI-EL1/G,551 is sourced from the original manufacturer or authorized distributors?

All PX1012AI-EL1/G,551 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PX1012AI-EL1/G,551 meets industry standards.

7.What is the process for return or replacement of PX1012AI-EL1/G,551?

All PX1012AI-EL1/G,551 units undergo pre-shipment inspection (PSI). If there is an issue with PX1012AI-EL1/G,551, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PX1012AI-EL1/G,551 part is unused and in its original packaging.

Return procedure for PX1012AI-EL1/G,551:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…