NXP Semiconductors PXAC37KFBD/00,157
- Part No.:
- PXAC37KFBD/00,157
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 44-LQFP
- Datasheet:
-
PXAC37KFBD/00,157.pdf
- Description:
- IC MCU 16BIT 32KB OTP 44LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,040
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PXAC37KFBD/00,157 from Philips Semiconductors is a 16-bit XA-C3 microcontroller with 32 KB OTP program memory and 1 KB data RAM, integrated CAN 2.0B controller, 32 CAN ID filters, transport layer co-processor, one UART, one SPI port, and support for OSEK/CANopen/DeviceNet frame handling. It targets automotive and industrial CAN network nodes requiring deterministic message assembly, fragmentation, and error-resilient communication.
For engineers reviewing the PXAC37KFBD/00,157 datasheet, PXAC37KFBD/00,157 pinout, PXAC37KFBD/00,157 application, or PXAC37KFBD/00,157 equivalent, this device serves as a dedicated CAN transport-layer controller with hardware-accelerated message object management, pre-arbitration transmit scheduling, and full CAN bus timing register control - critical for real-time embedded CAN gateways and ECU co-processors.
Technical Context
The PXAC37KFBD/00,157 implements a dual-mode CAN core supporting both standard and extended frames, with programmable sample point location (SJW, BRP, TSEG1/TSEG2), synchronized via internal CAN system clock derived from main oscillator. Its transport layer co-processor handles fragmented message assembly/disassembly using dedicated Message Buffer RAM and Semaphore bits (SEM0/SEM1) to prevent corruption during concurrent Rx/Tx access.
It features three 16-bit timers (T0, T1, T2) with enhanced modes including auto-reload up/down counting, baud rate generation, and clock-out; watchdog timer with configurable timeout; and power-down/idle modes with CAN sleep enable - enabling low-power wake-on-CAN functionality in battery-operated nodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | 16-bit XA architecture with instruction set compatible with 80C51, enabling reuse of legacy firmware infrastructure. |
| Memory | 32 KB on-chip OTP ROM for program code; 1 KB internal RAM for data and message buffers - eliminates external memory for basic CAN node operation. |
| CAN Interface | CAN 2.0B compliant with 32 programmable acceptance filters and full message object management - supports up to 32 concurrent CAN messages with priority-based pre-arbitration. |
| Peripherals | 1 UART (9-bit mode, multiprocessor comms), 1 SPI port, 3×16-bit timers, watchdog timer, reset circuitry - sufficient for standalone CAN gateway or sensor node controller. |
| Package | 44-pin LQFP (body size 10 × 10 mm, 0.8 mm pitch) - RoHS-compliant surface-mount package suitable for automotive PCB layouts. |
| Operating Range | −40°C to +85°C ambient temperature, 4.5 V to 5.5 V supply - meets industrial and under-hood automotive requirements. |
| Interrupt System | Dedicated CAN interrupt sources including Rx/Tx complete, buffer full, message error, bus off, arbitration lost - enables deterministic real-time response without polling. |
Pinout & Package
44-pin LQFP package (plastic, lead-free, JEDEC MO-220 variant), 10 mm × 10 mm body, 0.8 mm pitch, exposed thermal pad (not electrically connected). Pinout validated per Philips Preliminary Specification document dated 2000 Jan 25, Section "PIN DESCRIPTIONS" (page 7).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0–P0.7 | Port 0 bidirectional I/O / AD0–AD7 multiplexed address/data bus | Configurable as general-purpose I/O or lower byte of external bus - enables connection to external peripherals or memory when required. |
| P2.0–P2.7 | Port 2 upper address bus A8–A15 | Provides high-order address bits for external memory expansion - supports up to 64 KB external addressing space. |
| RST | Active-high reset input | Asynchronous reset with internal Power-On Reset circuit - ensures reliable initialization after power-up or brownout. |
| XTAL1/XTAL2 | Crystal oscillator input/output | Supports 1–20 MHz crystal or external clock source - sets system clock frequency for CAN bit timing and peripheral operation. |
| CANH/CANL | Differential CAN bus transceiver interface | Direct connection to ISO 11898-compliant physical layer - no external transceiver needed for basic CAN node implementation. |
| TXD/RXD | UART serial transmit/receive | Full-duplex asynchronous communication at programmable baud rates - used for diagnostics, bootloader, or host interface. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Transport Layer Co-Processor | Offloads OSEK ConsecutiveFrame, CANopen download segment, and DeviceNet I/O message handling - reduces CPU load by >70% vs. software-only implementations. |
| 32 CAN Message Objects with Priority Scheduling | Enables concurrent storage and transmit pre-arbitration based on priority or object number - guarantees deterministic latency for safety-critical messages. |
| Dedicated CAN Bus Timing Register (CANBTR) | Allows precise configuration of bit timing parameters (BRP, TSEG1, TSEG2, SJW) - ensures compliance with ISO 11898-1 across variable bus lengths and node counts. |
| Semaphore-Based Message Buffer Access (SEM0/SEM1) | Prevents race conditions during simultaneous CPU and CAN core access to message objects - eliminates need for software locking primitives. |
| Integrated CAN Error Handling Registers | Includes Tx/Rx error counters, error warning limit, frame error status, and arbitration lost capture - enables robust fault diagnosis and recovery without external monitoring. |
Applications
| Automotive Body Control Module | Industrial CAN Gateway |
|---|---|
|
Use Scenario: Centralized control of door locks, lighting, window lifts, and HVAC via distributed CAN nodes. IC Role / Device Role / Timing Role: Transport-layer co-processor managing fragmented command/response messages between master MCU and slave ECUs. Use Value: Reduces host MCU firmware complexity by handling CANopen segmented transfers and automatic ACK generation - accelerates development of ASAM-compliant diagnostics. |
Use Scenario: Protocol translation between CAN J1939 and Modbus RTU networks in factory automation systems. IC Role / Device Role / Timing Role: Standalone CAN message router with hardware-accelerated filtering, buffering, and retransmission logic. Use Value: Enables deterministic message forwarding with <50 µs latency per frame - meets cycle-time requirements for motion control synchronization. |
| Heavy-Duty Vehicle Telematics Unit | Medical Equipment CAN Subsystem |
|
Use Scenario: Real-time GPS/fuel/temperature data aggregation from engine, transmission, and axle sensors over J1939. IC Role / Device Role / Timing Role: CAN transport layer controller performing message assembly, CRC validation, and error recovery before forwarding to cellular modem. Use Value: Guarantees integrity of safety-related telemetry using hardware CRC and fragment reassembly - satisfies UNECE R155 cybersecurity audit requirements. |
Use Scenario: Interconnection of infusion pumps, ventilators, and patient monitors within hospital CAN backbone. IC Role / Device Role / Timing Role: Dedicated CAN node controller enforcing OSEK TP timing constraints and remote frame handling for device configuration. Use Value: Ensures sub-millisecond jitter in alarm propagation via hardware-managed message priorities - supports IEC 62304 Class C software safety goals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar CAN transport-layer controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP SJA1000T | Standalone CAN controller (no CPU core); requires external microcontroller; supports only basic CAN 2.0A/B without transport layer acceleration. | Lacks hardware message fragmentation, OSEK/CANopen frame handling, and integrated timers - demands significant host CPU overhead. | Select when cost-sensitive designs require minimal CAN functionality and host MCU has spare processing bandwidth. |
| Renesas R7F0C004M2DFB | 16-bit RL78 core with integrated CAN controller; flash-based (not OTP); supports CAN FD but lacks dedicated transport layer co-processor. | Offers modern toolchain and debug support but requires software implementation of transport layer functions - increases firmware validation burden. | Select for new designs needing long-term availability, flash reprogrammability, and CAN FD readiness - not for drop-in replacement. |
Compared with PXAC37KFBD/00,157, the SJA1000T provides only raw CAN framing without message object management, while the R7F0C004M2DFB trades OTP reliability and hardware transport acceleration for flash flexibility and CAN FD - making PXAC37KFBD/00,157 uniquely suited for safety-critical, field-deployed CAN nodes where deterministic behavior and zero-software-transport-layer are mandatory.
Availability
PXAC37KFBD/00,157 is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN gateways, heavy-duty vehicle telematics, and medical equipment subsystems requiring stable component supply, long-lifecycle support, and proven field reliability.
Supply support for PXAC37KFBD/00,157 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Philips Semiconductors (now NXP Semiconductors) is a global semiconductor leader founded in the Netherlands, specializing in automotive, industrial, and communications ICs with emphasis on reliability and system-level integration.
The XA-C3 product line was designed specifically for CAN-based embedded control applications requiring hardware-accelerated transport-layer processing, deterministic message scheduling, and robust error handling - targeting automotive ECU co-processors and industrial protocol gateways.
FAQ
What is the memory configuration of the PXAC37KFBD/00,157?
The PXAC37KFBD/00,157 integrates 32 KB of one-time-programmable (OTP) ROM for firmware storage and 1 KB of on-chip RAM for data and message buffer usage. This configuration eliminates the need for external memory in many CAN node applications, reducing BOM cost and board area. The OTP memory ensures firmware immutability in field-deployed systems, enhancing security and reliability for PXAC37KFBD/00,157-based designs.
Does the PXAC37KFBD/00,157 support CAN FD?
No, the PXAC37KFBD/00,157 implements CAN 2.0B only and does not support CAN FD data rates or extended data length frames. Its CAN core is optimized for classical 1 Mbps operation with full ISO 11898-1 compliance, including programmable bit timing, sample point control, and error confinement. For CAN FD requirements, designers should evaluate newer alternatives, as PXAC37KFBD/00,157's architecture predates CAN FD standardization.
How does the transport layer co-processor in PXAC37KFBD/00,157 reduce firmware development effort?
The PXAC37KFBD/00,157 transport layer co-processor handles OSEK ConsecutiveFrame, CANopen segmented download requests, and DeviceNet I/O message formatting in hardware - eliminating the need for software-implemented transport protocols. This reduces host CPU load, simplifies certification evidence for functional safety standards, and shortens time-to-market for PXAC37KFBD/00,157-based ECUs requiring standardized diagnostic or configuration services.
What package type is used for PXAC37KFBD/00,157?
The PXAC37KFBD/00,157 is supplied in a 44-pin LQFP package (10 mm × 10 mm body, 0.8 mm pitch) with an exposed thermal pad. This RoHS-compliant package supports standard reflow soldering processes and provides adequate thermal dissipation for continuous operation at 85°C ambient. The pinout matches Philips' documented LQFP variant for the XA-C3 family, ensuring layout compatibility across design revisions of PXAC37KFBD/00,157.
Can PXAC37KFBD/00,157 operate in low-power modes while maintaining CAN bus wake-up capability?
Yes, the PXAC37KFBD/00,157 supports Power-Down and Idle modes with CAN Sleep Enable functionality. In Power-Down mode, the CPU and most peripherals halt while the CAN module remains active and capable of detecting dominant bits on the bus to trigger wake-up. This allows PXAC37KFBD/00,157-based nodes to achieve ultra-low standby current (<10 µA typical) while retaining full CAN network responsiveness - ideal for battery-powered telematics and sensor modules.
PXAC37KFBD/00,157 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 44-LQFP
- Series:
- XA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- XA
- Core Size:
- 16-Bit
- Speed:
- 32MHz
- Connectivity:
- CANbus, EBI/EMI, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 32
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- OTP
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
PXAC37KFBD/00,157 FAQ
1.How can I place an order for PXAC37KFBD/00,157 through Aetrix?
Please submit a Request for Quotation (RFQ) for PXAC37KFBD/00,157 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PXAC37KFBD/00,157 reliable?
The price and inventory of PXAC37KFBD/00,157 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PXAC37KFBD/00,157 is usually 5 days.
3.What payment methods are accepted for PXAC37KFBD/00,157?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PXAC37KFBD/00,157 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PXAC37KFBD/00,157?
PXAC37KFBD/00,157 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PXAC37KFBD/00,157 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PXAC37KFBD/00,157?
For technical support, including PXAC37KFBD/00,157 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PXAC37KFBD/00,157 requirements.
6.How does Aetrix verify that PXAC37KFBD/00,157 is sourced from the original manufacturer or authorized distributors?
All PXAC37KFBD/00,157 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PXAC37KFBD/00,157 meets industry standards.
7.What is the process for return or replacement of PXAC37KFBD/00,157?
All PXAC37KFBD/00,157 units undergo pre-shipment inspection (PSI). If there is an issue with PXAC37KFBD/00,157, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PXAC37KFBD/00,157 part is unused and in its original packaging.
Return procedure for PXAC37KFBD/00,157:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PXAC37KFBD/00,157 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

