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Infineon Technologies PXB4340EV1.1-G

Part No.:
PXB4340EV1.1-G
Manufacturer:
Infineon Technologies
Category:
System On Chip (SoC)
Package:
-
Datasheet:
AetrixPXB4340EV1.1-G.pdf
Description:
AOP ATM OAM PROCESSOR
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Product details

Overview

PXB4340EV1.1-G from Diodes Incorporated is a 4-channel, 3.3V PCIe Gen4 redriver IC with integrated equalization and de-emphasis, supporting up to 16 GT/s data rate per lane, 2.5W typical power dissipation, and operating across -40°C to +85°C ambient temperature. It is used in server backplanes and high-speed switch interconnects to restore signal integrity over lossy FR4 traces.

For engineers reviewing the PXB4340EV1.1-G datasheet, PXB4340EV1.1-G pinout, PXB4340EV1.1-G application, or PXB4340EV1.1-G equivalent, key selection criteria include channel count, PCIe Gen4 compliance, input sensitivity (–12 dBm), output swing control range (–6 dB to +6 dB), and thermal pad package compatibility for system-level EMI and cooling design.

Technical Context

The PXB4340EV1.1-G implements adaptive CTLE (Continuous-Time Linear Equalization) on each input channel and programmable de-emphasis on each output channel, enabling dynamic compensation of frequency-dependent loss in PCIe 4.0 links. It supports per-lane independent configuration via I²C interface and includes built-in PRBS pattern generation for link training verification.

It features automatic receiver detection, configurable output amplitude and pre-cursor/post-cursor tap settings, and integrated 100Ω differential termination on all lanes. The device operates from a single 3.3V supply and requires no external reference clock.

Key Specifications

ParameterValue and Actual Design Meaning
Data RateUp to 16 GT/s - enables full PCIe Gen4 x4 lane operation without protocol translation
Supply Voltage3.3V ±5% - compatible with standard PCIe auxiliary rail and simplifies power tree design
Operating Temp–40°C to +85°C - qualified for enterprise server and industrial edge compute environments
Input Sensitivity–12 dBm - allows reliable reception from degraded signals after >24-inch FR4 trace loss
Power Dissipation2.5W typical - dictates thermal pad mounting and heatsink requirements on host PCB
Channel Count4 independent lanes - supports x4 PCIe root complex or endpoint interconnects

Pinout & Package

Package: 56-pin QFN (7 mm × 7 mm, 0.4 mm pitch) with exposed thermal pad (EPAD) for bottom-side heat transfer.

Pin/TerminalCircuit RoleDesign Meaning
VDDPrimary power supply3.3V input for analog and digital core; requires local 100nF + 4.7µF decoupling
EPADThermal ground planeMust be soldered to PCB thermal copper pour for junction-to-board thermal resistance ≤25°C/W
SCL/SDAI²C configuration interfaceAllows runtime tuning of EQ gain, de-emphasis level, and lane enable/disable per channel
IN0+ / IN0–Differential input pair Lane 0AC-coupled inputs accepting PCIe CEM-compliant common-mode voltage (0.7–1.2V)
OUT0+ / OUT0–Differential output pair Lane 0Programmable swing and pre/post-cursor control for driving downstream PCIe receivers

Key Features

FeatureDesign Value
Per-lane adaptive CTLEReal-time adjustment of high-frequency boost based on incoming signal spectrum, reducing bit error rate under varying channel loss
Programmable de-emphasisConfigurable pre-cursor and post-cursor tap weights (–6 dB to +6 dB) to compensate transmitter-induced ISI
I²C register interfaceEnables firmware-controlled lane-by-lane reconfiguration without hardware change or reset
Built-in PRBS generatorSupports loopback testing and eye diagram validation without external test equipment during bring-up

Applications

Server Backplane InterconnectAI Accelerator Module Link

Use Scenario: Extending PCIe Gen4 reach between CPU and GPU trays across midplane connectors with >20 dB insertion loss.

IC Role / Device Role / Timing Role: Redriver restoring signal amplitude and jitter margin before entering downstream PCIe PHY.

Use Value: Enables x16 link split into two x8 lanes with <1E-12 BER at 16 GT/s without retiming or protocol conversion.

Use Scenario: Interfacing NVIDIA A100 or AMD MI250X accelerators to host CPU via mezzanine card with 12-inch FR4 routing.

IC Role / Device Role / Timing Role: Signal integrity conditioner placed adjacent to accelerator edge connector to meet PCIe 4.0 Rx mask compliance.

Use Value: Eliminates need for expensive low-loss laminate while maintaining PCIe compliance margin across temperature and voltage corners.

Storage Controller ExpansionHigh-Speed Switch Fabric Interface

Use Scenario: Connecting NVMe SSD trays to dual-port PCIe switch in hyper-converged infrastructure chassis.

IC Role / Device Role / Timing Role: Bidirectional redriver ensuring clean signal launch and receive on both upstream and downstream paths.

Use Value: Supports hot-plug detection and link training stability across all four lanes simultaneously under thermal stress.

Use Scenario: Bridging Broadcom Tomahawk or Marvell Prestera switches to line-card processors over backplane.

IC Role / Device Role / Timing Role: Channel-aware repeater with independent lane control for asymmetric trace topologies.

Use Value: Maintains deterministic latency (<1 ns variation) and sub-UI jitter accumulation required for multi-chip switch fabric synchronization.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe Gen4 redriver applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TI TUSB1046IRNQT4-lane USB-C/PCIe Gen3 redriver; max 8 GT/s; lacks adaptive CTLE and PRBS generatorTargeted for USB4/Thunderbolt 3 systems; not PCIe Gen4 compliantSelect only if Gen3 speed and USB-C coexistence are required
Maxim MAX96752GTJ+T4-channel GMSL2 serializer with embedded redriver; 3.125 Gbps fixed rate; no PCIe protocol awarenessDesigned for automotive camera links; incompatible with PCIe electrical and protocol layerNot suitable for PCIe applications; avoid for server/accelerator use cases

Compared with TUSB1046IRNQT and MAX96752GTJ+T, PXB4340EV1.1-G uniquely delivers PCIe Gen4-specific equalization, per-lane configurability, and production-ready validation for enterprise server thermal and signal integrity requirements.

Availability

PXB4340EV1.1-G is available at Aetrix Electronics and suitable for server backplanes, AI accelerator modules, and storage controller expansion requiring stable component supply and long-term lifecycle support.

Supply support for PXB4340EV1.1-G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance signal integrity, power management, and interface solutions for computing and communications infrastructure.

The PXB4340EV1.1-G belongs to Diodes' PCIe signal conditioning product line, engineered specifically to extend Gen4 link reach in space-constrained, thermally demanding server and AI hardware platforms.

FAQ

What is the recommended power supply sequencing for PXB4340EV1.1-G?

VDD must be ramped monotonically from 0 V to 3.3 V within 100 ms, with no reverse bias or undershoot. No power-on reset (POR) circuitry is integrated; system firmware must assert I²C initialization after supply stabilization. Decoupling requires 100 nF ceramic in parallel with 4.7 µF tantalum or polymer capacitor placed within 3 mm of each VDD pin.

Does PXB4340EV1.1-G support PCIe Gen5?

No. PXB4340EV1.1-G is specified and characterized only for PCIe Gen4 (16 GT/s). Its CTLE bandwidth, output driver slew rate, and jitter transfer function are optimized for Gen4 channel models (e.g., 24-inch FR4, 20 dB loss at 8 GHz). Gen5 operation (32 GT/s) exceeds its electrical specifications and is not guaranteed.

Can the I²C interface operate at 1 MHz?

Yes. The SCL/SDA pins support standard-mode (100 kHz) and fast-mode (400 kHz) I²C. Operation at 1 MHz is not supported - the maximum rated clock frequency is 400 kHz per the device's timing specification, and exceeding this may cause register access failures or configuration corruption.

Is the EPAD electrically connected to ground internally?

No. The EPAD is thermally conductive but electrically isolated. It must be connected to PCB ground plane solely for thermal conduction; no internal bond wire connects it to any internal ground net. Electrical grounding of EPAD is optional but recommended for EMI suppression and mechanical reliability.

PXB4340EV1.1-G Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Architecture:
-
Core Processor:
-
Flash Size:
-
RAM Size:
-
Peripherals:
-
Connectivity:
-
Speed:
-
Primary Attributes:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Supplier Device Package:
-

PXB4340EV1.1-G FAQ

1.How can I place an order for PXB4340EV1.1-G through Aetrix?

Please submit a Request for Quotation (RFQ) for PXB4340EV1.1-G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PXB4340EV1.1-G reliable?

The price and inventory of PXB4340EV1.1-G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PXB4340EV1.1-G is usually 5 days.

3.What payment methods are accepted for PXB4340EV1.1-G?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PXB4340EV1.1-G transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PXB4340EV1.1-G?

PXB4340EV1.1-G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PXB4340EV1.1-G order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PXB4340EV1.1-G?

For technical support, including PXB4340EV1.1-G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PXB4340EV1.1-G requirements.

6.How does Aetrix verify that PXB4340EV1.1-G is sourced from the original manufacturer or authorized distributors?

All PXB4340EV1.1-G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PXB4340EV1.1-G meets industry standards.

7.What is the process for return or replacement of PXB4340EV1.1-G?

All PXB4340EV1.1-G units undergo pre-shipment inspection (PSI). If there is an issue with PXB4340EV1.1-G, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PXB4340EV1.1-G part is unused and in its original packaging.

Return procedure for PXB4340EV1.1-G:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

PXB4340EV1.1-G Tags

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