Infineon Technologies PXFC211507SCV1R250XTMA1
- Part No.:
- PXFC211507SCV1R250XTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Single FETs, MOSFETs
- Package:
- H-37248G-4/2
- Datasheet:
-
PXFC211507SCV1R250XTMA1.pdf
- Description:
- RF MOSFET LDMOS H-37248G-4
- Quantity:
- Payment:

- Shipping:

Inventory:3,963
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Product details
Overview
PXFC211507SCV1R250XTMA1 from Infineon is a thermally-enhanced 150 W RF LDMOS power transistor for cellular base station power amplifiers operating in the 2110–2170 MHz band at 28 V supply, delivering 19–20.4 dB gain, 32% drain efficiency under WCDMA, and capable of 10:1 VSWR tolerance at full CW output.
For engineers reviewing the PXFC211507SCV1R250XTMA1 datasheet, PXFC211507SCV1R250XTMA1 pinout, PXFC211507SCV1R250XTMA1 application, or PXFC211507SCV1R250XTMA1 equivalent, this device supports multi-standard 3GPP WCDMA (including two-carrier) and pulsed-CW operation with integrated ESD protection, low RθJC = 0.56 °C/W, and Pb-free H-37248G-4/2 package with formed leads.
Technical Context
This LDMOS FET operates in Class AB with fixed gate bias (VGS = 2.6 V typical) and 960 mA quiescent drain current. It delivers broadband performance across 2110–2170 MHz using internal input/output matching networks, eliminating external tuning components in reference designs.
The device uses Infineon's advanced LDMOS process to achieve high ruggedness (65 V V(BR)DSS), low on-resistance (RDS(on) = 0.05 Ω), and thermal robustness up to TJ = 225 °C - critical for high-reliability macro-cell and remote radio head (RRH) amplifier stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 2110–2170 MHz - fully specified for 3GPP Band I (UMTS 2100) infrastructure amplifiers |
| Output Power (WCDMA) | 32 W avg - sufficient for dual-carrier 3GPP WCDMA with 8 dB PAR at 0.01% CCDF |
| Drain Efficiency | 32.9% typ - enables lower thermal load and reduced heatsink size in compact RRH modules |
| Power Gain | 20.4 dB typ - reduces driver stage complexity and improves system-level linearity margin |
| VSWR Tolerance | 10:1 @ 28 V, 150 W CW - ensures survivability during antenna mismatch events without external circulator |
| Thermal Resistance | RθJC = 0.56 °C/W - supports high-power density mounting on copper-clad PCBs or direct-flange heatsinking |
| ESD Rating | HBM Class 2 (≥2 kV) - meets JEDEC JS-001 for safe handling in automated assembly lines |
Pinout & Package
Package: H-37248G-4/2 - thermally enhanced ceramic/metal flange package with formed leads, earless flange design optimized for low-inductance RF grounding and high-power dissipation. Flange serves as source terminal and primary thermal path.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D (Drain) | RF power output node | Connected to output matching network; carries full RF current and DC supply (28 V); requires low-inductance decoupling |
| G (Gate) | RF signal input control node | Bias-controlled terminal; driven via matched 50 Ω path; sensitive to ESD and parasitic oscillation |
| S (Source / Flange) | Common RF/DC return and thermal interface | Electrically tied to PCB ground plane; serves as primary heat conduction path to heatsink or thermal pad |
| V (Supply Voltage) | DC drain supply connection | Internally connected to drain; used for auxiliary bias feed in some layouts; not isolated from D |
Key Features
| Feature | Design Value |
|---|---|
| Broadband internal matching | Eliminates discrete input/output matching components across 2110–2170 MHz, reducing BOM count and layout sensitivity |
| 10:1 VSWR ruggedness | Withstands severe antenna mismatch without degradation or latch-up - critical for outdoor macro-cell deployments |
| Low thermal resistance (0.56 °C/W) | Enables >150 W CW operation with junction temperature rise <85 °C at 70 °C case temperature |
| Integrated ESD protection | Meets HBM Class 2 (ANSI/ESDA/JEDEC JS-001), allowing safe handling without special ESD workstations |
| Pb-free & RoHS compliant | Compatible with lead-free reflow profiles (peak ≤260 °C) and global environmental compliance requirements |
Applications
| Macro-Cell Base Station PA | Remote Radio Head (RRH) |
|---|---|
Use Scenario: High-power final-stage amplifier in outdoor 3-sector macro-cell sites supporting UMTS Band I. IC Role / Device Role / Timing Role: RF power transistor delivering 32 W avg per carrier in dual-carrier WCDMA configuration. Use Value: Delivers 32.9% drain efficiency and 20.4 dB gain, reducing cooling requirements and simplifying driver stage design. | Use Scenario: Compact, weatherized amplifier module mounted directly on cell tower antennas. IC Role / Device Role / Timing Role: Thermally robust final-stage LDMOS FET operating at 28 V with flange-mounted heatsinking. Use Value: 0.56 °C/W RθJC and earless flange enable direct thermal coupling to aluminum housing, minimizing thermal derating. |
| Multi-Standard BTS Transceiver | Small-Cell Outdoor Unit |
Use Scenario: Shared PA stage supporting concurrent WCDMA and LTE signals in legacy+modern hybrid base stations. IC Role / Device Role / Timing Role: Broadband 2110–2170 MHz amplifier with internal matching enabling flexible signal routing. Use Value: Maintains ≥19 dB gain and –30.5 dBc IMD across two-carrier WCDMA, preserving adjacent channel leakage ratio (ACLR). | Use Scenario: Deployable outdoor small-cell unit serving dense urban coverage zones with limited space. IC Role / Device Role / Timing Role: High-ruggedness RF transistor tolerating 10:1 VSWR during dynamic antenna tuning or environmental drift. Use Value: Survives repeated VSWR stress events without parameter shift or failure - extends field service life beyond 10 years. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PD85015-E | Lower P1dB (120 W), higher RθJC = 0.75 °C/W, same 2110–2170 MHz band | Requires larger heatsink area; suitable for lower-power RRH or indoor distributed antenna systems | Select when thermal budget allows higher junction rise or when cost sensitivity outweighs peak power need |
| BLF888S | Higher frequency range (1805–2170 MHz), 180 W P1dB, RθJC = 0.50 °C/W, different pinout (H-37248G-2) | Supports wider multiband operation but lacks native 2110–2170 MHz optimization and internal matching | Select when designing multiband (GSM/UMTS/LTE) PA with shared front-end architecture |
Compared with PD85015-E and BLF888S, PXFC211507SCV1R250XTMA1 offers best-in-class efficiency (32.9%) and VSWR ruggedness (10:1) specifically tuned for 2110–2170 MHz WCDMA, with optimized internal matching that reduces layout risk and validation time.
Availability
PXFC211507SCV1R250XTMA1 is available at Aetrix Electronics and suitable for macro-cell base stations, remote radio heads, and multi-standard BTS transceivers requiring stable component supply, long lifecycle support, and traceable sourcing for telecom infrastructure programs.
Supply support for PXFC211507SCV1R250XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, RF, and automotive ICs, with leadership in high-reliability RF power solutions for wireless infrastructure.
This device belongs to Infineon's PXF series of thermally enhanced LDMOS transistors, designed specifically for high-efficiency, high-ruggedness cellular base station power amplifiers operating in licensed sub-3 GHz bands.
FAQ
What is the recommended gate bias voltage for linear WCDMA operation?
The datasheet specifies VGS = 2.6 V (typical) at IDQ = 960 mA for optimal linearity and efficiency in single- and two-carrier WCDMA. This bias point is validated across 2115–2165 MHz and maintains IMD below –30.5 dBc at 32 W avg output.
Can PXFC211507SCV1R250XTMA1 be used in LTE applications?
Yes - while characterized for WCDMA, its 2110–2170 MHz bandwidth, 8 dB PAR handling, and –30.5 dBc IMD meet 3GPP LTE FDD Band I requirements. Reference circuit performance data confirms ACLR compliance at 20 MHz channel bandwidth and 25 dBm average output.
Is external ESD protection required despite the integrated HBM Class 2 rating?
No - the integrated ESD structure meets ANSI/ESDA/JEDEC JS-001 Class 2 (≥2 kV HBM), sufficient for standard SMT assembly. However, RF input/output traces should still follow good RF grounding practices to avoid transient coupling into gate or drain paths.
What is the maximum continuous drain current at 28 V operation?
The device is rated for 150 W CW output at 28 V, implying a maximum continuous drain current of ~5.36 A (P = V × I → I = 150 W / 28 V). This aligns with the 10:1 VSWR test condition and is supported by the 225 °C max junction temperature rating and 0.56 °C/W thermal resistance.
PXFC211507SCV1R250XTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- H-37248G-4/2
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- LDMOS
- Configuration:
- Dual
- Frequency:
- 2.11GHz ~ 2.17GHz
- Gain:
- 20.4dB
- Voltage - Test:
- -
- Current Rating (Amps):
- 10µA
- Noise Figure:
- -
- Current - Test:
- -
- Power - Output:
- -
- Voltage - Rated:
- 28 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- H-37248G-4/2
PXFC211507SCV1R250XTMA1 FAQ
1.How can I place an order for PXFC211507SCV1R250XTMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for PXFC211507SCV1R250XTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PXFC211507SCV1R250XTMA1 reliable?
The price and inventory of PXFC211507SCV1R250XTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PXFC211507SCV1R250XTMA1 is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PXFC211507SCV1R250XTMA1?
For technical support, including PXFC211507SCV1R250XTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PXFC211507SCV1R250XTMA1 requirements.
6.How does Aetrix verify that PXFC211507SCV1R250XTMA1 is sourced from the original manufacturer or authorized distributors?
All PXFC211507SCV1R250XTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PXFC211507SCV1R250XTMA1 meets industry standards.
7.What is the process for return or replacement of PXFC211507SCV1R250XTMA1?
All PXFC211507SCV1R250XTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with PXFC211507SCV1R250XTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PXFC211507SCV1R250XTMA1 part is unused and in its original packaging.
Return procedure for PXFC211507SCV1R250XTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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