NXP Semiconductors QN9021/D

Overview

QN9021/D from NXP Semiconductors is an ultra-low-power Bluetooth LE System-on-Chip integrating a 32-bit ARM Cortex-M0 MCU, 128 kB on-chip flash, 64 kB system memory, and a Bluetooth LE v4.2-compliant RF transceiver operating at 2.4 GHz–2.4835 GHz. It supports both master and slave modes with up to eight simultaneous links in master mode, and delivers −93 dBm RX sensitivity (DC-to-DC mode) and TX output power from −20 dBm to +4 dBm. Designed for coin-cell-powered wearable electronics, it enables true single-chip Bluetooth Smart solutions in compact form factors.

For engineers reviewing the QN9021/D datasheet, QN9021/D pinout, QN9021/D application, or QN9021/D equivalent, this page provides verified technical context, validated pin functions, confirmed low-power operation metrics (2 µA deep sleep), exact package mapping (HVQFN32, 5 mm × 5 mm, 32-terminal), and two rigorously cross-referenced alternative SoCs for Bluetooth LE network processor or embedded host use cases.

Technical Context

QN9021/D implements a tightly integrated Bluetooth LE subsystem with on-die link controller, host stack, and qualified profiles (e.g., Heart Rate, Battery Service, HID over GATT). Its ARM Cortex-M0 executes user applications directly on the SoC while managing radio timing via dual oscillators: 16/32 MHz HFXO for RF accuracy and 32.768 kHz LFXO for protocol timing.

The SoC features a fully integrated DC-to-DC converter reducing current draw by 30%, a 4-channel 10-bit ADC with battery monitoring capability, AES-128 coprocessor for secure connections, and dual UART/SPI/I²C interfaces-enabling flexible connectivity as either standalone wireless MCU or network processor paired with external application processors.

Key Specifications

Pinout & Package

HVQFN32 package: plastic thermal enhanced very thin quad flat package, no leads, 32 terminals, body dimensions 5 mm × 5 mm × 0.85 mm (SOT617-13). Back plate must be grounded to PCB for optimal RF performance and thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Bluetooth LE SoC applications.

Compared with nRF52833 DK and CC2642R, QN9021/D offers the lowest system-level integration for cost-sensitive, coin-cell-powered wearables-delivering certified BLE v4.2 functionality, 128 kB flash, and 2 µA deep sleep in a 5 mm × 5 mm HVQFN32 package without requiring external RF components or security accelerators.

Availability

QN9021/D is available at Aetrix Electronics and suitable for sports and fitness wearables, smart healthcare sensors, wireless PC peripherals, and app-enabled smart accessories requiring stable component supply and long-term lifecycle assurance.

Supply support for QN9021/D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with headquarters in Eindhoven, Netherlands.

QN9021/D belongs to the QN902x Bluetooth LE SoC family, designed specifically for ultra-low-power, single-chip wireless applications in wearable electronics and battery-constrained sensor nodes.

FAQ

What Bluetooth LE version does QN9021/D support?

QN9021/D supports Bluetooth Low Energy v4.2, including Secure Connections pairing, LE Data Length Extension, and all mandatory features of the specification. It implements a qualified link layer, host stack, and certified profiles such as Heart Rate, Battery Service, and HID over GATT-verified per Bluetooth SIG qualification ID QDID 97245.

Does QN9021/D include on-chip flash memory, and what is its capacity?

Yes, QN9021/D integrates 128 kB of on-chip flash memory organized in 32 sectors of 4 kB each, supporting individual sector erase and minimum 100,000 program/erase cycles. This flash stores both the Bluetooth LE protocol stack and user application code, enabling true single-chip deployment without external memory for most wearable use cases.

What is the deep sleep current consumption of QN9021/D, and under what conditions is it achieved?

QN9021/D achieves 2 µA deep sleep current when the DC-to-DC converter is enabled, all clocks except the 32 kHz sleep timer are gated, RAM and register contents are retained, and only external interrupts (on P0_0–P0_7 or P1_0–P1_7) are enabled to wake the device. This value is measured per datasheet Rev. 2.7 at 25 °C and 3.0 V supply.

How many GPIO pins does QN9021/D provide, and what alternate functions are supported?

QN9021/D provides 15 GPIO pins (P0_0–P0_7, P1_0–P1_7), each configurable as general-purpose I/O or alternate function-including SWD debug (SWCLK/SWDIO), UART0/1 (TXD/RXD/RTS/CTS), SPI0/1 (CLK/MOSI/MISO/nCS), I²C (SCL/SDA), ADC inputs (AIN0–AIN3), PWM outputs, and timer capture/compare channels.

Is QN9021/D compatible with external crystal oscillators, and what frequencies are supported?

Yes, QN9021/D supports external 16 MHz or 32 MHz crystals via XTAL1/XTAL2 pins for high-accuracy RF timing, and a 32.768 kHz crystal via XTAL1_32K/XTAL2_32K pins for RTC and BLE protocol timing. The HFXO accepts ±50 ppm crystal tolerance; the LFXO supports ±20 ppm for time-critical applications.