My Inquiry
My Account
NXP Semiconductors QN9022/DY
- Part No.:
- QN9022/DY
- Manufacturer:
- NXP Semiconductors
- Category:
- RF Transceiver ICs
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
QN9022/DY.pdf
- Description:
- IC RF TXRX BLE 40HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
QN9022/DY from NXP Semiconductors is an ultra-low-power Bluetooth LE 4.2 System-on-Chip integrating a 32-bit ARM Cortex-M0 MCU, 2.4 GHz RF transceiver, 128 kB flash (external interface), 64 kB system memory, and analog/digital peripherals. It operates from 1.8 V to 3.6 V, delivers −93 dBm RX sensitivity (DC-DC mode), supports master/slave dual-mode operation, and targets coin-cell-powered wearable electronics.
For engineers reviewing the QN9022/DY datasheet, QN9022/DY pinout, QN9022/DY application, or QN9022/DY equivalent, this page delivers verified technical context on its BLE SoC architecture, HVQFN40 package integration, low-power sleep modes (2 µA deep sleep), UART/SPI/I²C interfaces, and role as either standalone wireless MCU or network processor - all critical for wearable, sensor, and medical BLE design validation.
Technical Context
QN9022/DY implements a fully integrated Bluetooth LE v4.2 stack with radio, link controller, and host software on-die, enabling direct BLE connectivity without external protocol handling. Its ARM Cortex-M0 core executes user applications while managing BLE timing via dual oscillators: 16/32 MHz HFXO for radio accuracy and 32.768 kHz LFXO for low-power RTC/sleep timer synchronization.
The device uses a configurable DC-to-DC converter to reduce active current by ~30%, achieving 8.8 mA TX @ 0 dBm and 9.25 mA RX. Its analog subsystem includes a 4-channel 10-bit ADC, two analog comparators, battery monitor, and AES-128 coprocessor - all accessible via GPIOs mapped to its 40-pin HVQFN40 footprint with dedicated RF ports (RFP/RFN) and crystal terminals (XTAL1/XTAL2).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| BLE Standard | Bluetooth LE v4.2 compliant radio + full protocol stack and profiles - enables certified out-of-box BLE connectivity without external host processing. |
| Supply Voltage | 1.8 V to 3.6 V - supports direct operation from single coin-cell batteries (e.g., CR2032) and eliminates need for external voltage regulation in space-constrained wearables. |
| RF Performance | −93 dBm RX sensitivity (DC-DC mode); +4 dBm to −20 dBm programmable TX power - ensures robust link budget up to 99 dB for reliable short-range sensor telemetry. |
| Power Modes | 2 µA deep sleep (RAM retained); 3 µA sleep (32 kHz RC on); 8.8 mA TX @ 0 dBm - extends battery life to months in intermittent-sensing applications like fitness trackers. |
| Memory | 64 kB system RAM; external flash interface (no on-chip flash) - allows flexible firmware storage and over-the-air updates using cost-optimized external SPI flash. |
| Peripherals | 4-channel 10-bit ADC; two analog comparators; two UARTs; two SPIs; I²C; AES-128 coprocessor; 22 GPIOs - enables direct sensor interfacing, secure data encryption, and multi-interface host communication. |
| Package | HVQFN40, 5 mm × 5 mm × 0.85 mm - compact thermal-enhanced quad flat no-lead package optimized for high-density PCB layouts in miniature wearables. |
Pinout & Package
HVQFN40 package (SOT1369-2), 5 mm × 5 mm body, 0.85 mm height, thermally enhanced with grounded back plate. Pin 1 marked by top-side dot; requires PCB ground connection to back plate for optimal RF performance and thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC (Pin 1) | Core power supply | Primary digital supply input (1.8–3.6 V); decoupling required per layout guidelines to stabilize MCU and BLE baseband operation. |
| RFP / RFN (Pins 34 / 33) | Differential RF port | Direct connection points for 50 Ω antenna matching network; require controlled-impedance routing and minimal stub length for optimal 2.4 GHz radiation efficiency. |
| XTAL1 / XTAL2 (Pins 39 / 40) | HF crystal oscillator inputs | Interface to 16 MHz or 32 MHz fundamental-mode crystal; internal load capacitance reduces external BOM count and simplifies clock circuit design. |
| XTAL1_32K / XTAL2_32K (Pins 5 / 4) | LF crystal oscillator inputs | Connect to 32.768 kHz tuning-fork crystal for precise RTC and BLE advertising interval timing; essential for low-power periodic wake-up scheduling. |
| RSTN (Pin 31) | Active-low hardware reset | Asynchronous reset input; must be held low ≥100 ns to initiate cold boot; compatible with push-button or supervisor IC reset circuits. |
| P0_0–P0_7, P1_0–P1_7 | Wake-capable GPIOs | Only these 16 pins can exit sleep/deep sleep modes via interrupt - critical for designing responsive low-power sensor wakeup logic. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated BLE v4.2 stack | Full radio + link layer + host stack + qualified profiles (Heart Rate, Battery, HID) - eliminates need for external BLE host MCU or certification overhead. |
| ARM Cortex-M0 + 64 kB RAM | Self-contained application execution capability - runs custom sensor fusion, UI logic, or OTA update handlers without external processor dependency. |
| DC-to-DC converter | Reduces active current consumption by ~30% vs. LDO-only operation - directly extends operational time in battery-limited devices such as hearables. |
| AES-128 coprocessor | Hardware-accelerated encryption with DMA trigger - offloads security-critical operations from CPU, preserving MCU cycles for real-time sensor processing. |
| 22 GPIOs with analog functions | Includes 4 ADC inputs, 2 comparator inputs, and interrupt-capable wake sources - enables direct analog sensor integration (e.g., temperature, motion) with minimal external components. |
Applications
| Sports & Fitness Tracker | Wireless Medical Sensor |
|---|---|
|
Use Scenario: Compact wrist-worn device measuring heart rate, motion, and battery level with BLE broadcast to smartphone app. IC Role / Device Role / Timing Role: Standalone BLE SoC executing sensor acquisition, signal processing, and GATT-based Heart Rate Service transmission. Use Value: 2 µA deep sleep and coin-cell compatibility enable >6-month battery life; integrated ADC and comparators eliminate external signal conditioning ICs. |
Use Scenario: Disposable glucose monitor transmitting calibrated readings every 5 minutes to clinical gateway via BLE. IC Role / Device Role / Timing Role: Network processor interfacing with external glucose sensor IC via I²C, performing AES-encrypted packet assembly and scheduled BLE advertising. Use Value: Hardware AES-128 ensures HIPAA-compliant data confidentiality; 32.768 kHz RTC enables precise 5-minute intervals without MCU intervention. |
| Smart Remote Control | PC Peripheral (Wireless Mouse) |
|
Use Scenario: Sub-20 mm³ TV remote using capacitive touch keys and motion wake, transmitting HID over GATT to Android TV. IC Role / Device Role / Timing Role: Dual-role BLE device operating as HID peripheral (slave) during use and beacon advertiser (master) during idle. Use Value: 22 GPIOs support direct capacitive sensing matrix; UART/SPI allow firmware updates via dongle without disassembly. |
Use Scenario: Ultra-thin wireless mouse with optical sensor, button inputs, and scroll wheel, reporting HID reports at 125 Hz via BLE. IC Role / Device Role / Timing Role: BLE network processor connected to application MCU via UART, handling all BLE packetization, retransmission, and power management. Use Value: Low-latency UART interface (<10 µs ISR response) ensures <2 ms end-to-end HID report delay; 8.8 mA TX current sustains 10 m range at 0 dBm. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Bluetooth LE SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| nRF52833 DK | ARM Cortex-M4F core; 512 kB flash; integrated DC-DC; supports Bluetooth 5.1 and Thread - higher compute headroom but larger die size and 3.3 V min supply. | Better suited for complex mesh networking or audio streaming; less optimal for coin-cell wearables due to higher active current (4.9 mA RX). | Select nRF52833 DK when BLE 5.1 features (coded PHY, AoA/AoD) or concurrent multiprotocol operation are required. |
| DA14585-01FXQ2 | ARM Cortex-M0+ core; 64 kB RAM; 2 MB flash; 1.7–3.6 V supply; −95 dBm RX sensitivity - superior sensitivity but lacks integrated DC-DC and has larger HVQFN48 package. | Preferred for long-range industrial sensors where sensitivity outweighs size constraints; no built-in AES accelerator limits secure firmware update throughput. | Choose DA14585-01FXQ2 for applications demanding maximum link margin (>100 dB) and large local code storage without external flash. |
Compared with nRF52833 DK and DA14585-01FXQ2, QN9022/DY provides the lowest system-level BOM count for coin-cell wearables via integrated DC-DC, compact HVQFN40 footprint, and external flash interface - reducing PCB area and bill-of-materials cost without sacrificing BLE v4.2 compliance or security.
Availability
QN9022/DY is available at Aetrix Electronics and suitable for sports & fitness trackers, wireless medical sensors, smart remotes, and PC peripherals requiring stable component supply across high-mix, low-volume production runs.
Supply support for QN9022/DY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with headquarters in Eindhoven, Netherlands.
QN9022/DY belongs to NXP's QN902x Bluetooth LE SoC family, designed specifically for ultra-low-power wearable and medical edge devices requiring certified BLE functionality, extended battery life, and minimal external component count.
FAQ
What is the minimum supply voltage supported by QN9022/DY?
QN9022/DY operates from 1.8 V to 3.6 V, enabling direct use with common coin-cell batteries like CR2032 (nominal 3.0 V, discharge down to ~2.0 V) and alkaline cells. This 1.8 V lower limit distinguishes it from QN9020/1 (2.4 V min) and allows deeper battery utilization before system shutdown.
Does QN9022/DY include on-chip flash memory?
No, QN9022/DY does not integrate on-chip flash memory. Instead, it provides a dedicated external flash interface supporting SPI-connected flash devices. This architecture allows scalable firmware storage (e.g., 1–8 MB) and field-upgradable code without die size penalty - unlike QN9020/1 which embed 128 kB flash.
How many GPIOs are available on QN9022/DY, and which support wake-from-sleep?
QN9022/DY provides 22 general-purpose I/O pins. Only P0_0 through P0_7 and P1_0 through P1_7 (16 total) are capable of generating interrupts to wake the device from sleep or deep sleep modes - a hardware constraint critical for low-power sensor polling architecture.
What RF performance metrics define QN9022/DY's link reliability?
QN9022/DY achieves −93 dBm RX sensitivity in DC-DC mode and supports TX output from −20 dBm to +4 dBm, yielding a maximum link budget of 99 dB. Combined with fast RSSI and channel quality indication, this ensures robust connectivity in noisy 2.4 GHz environments typical of dense consumer electronics deployments.
Which communication interfaces does QN9022/DY support for connecting to external sensors or hosts?
QN9022/DY integrates two UARTs (supporting BLE Direct Test Mode), two SPIs (master/slave, 4-/3-wire), and one I²C-bus interface (master/slave, up to 400 kbit/s). These enable simultaneous connection to digital sensors (e.g., I²C accelerometer), host processors (UART), and external flash (SPI) - all without external level shifters or bus expanders.
QN9022/DY Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Type:
- TxRx Only
- RF Family/Standard:
- Bluetooth
- Protocol:
- Bluetooth v4.0
- Modulation:
- -
- Frequency:
- 2.4GHz
- Data Rate (Max):
- -
- Power - Output:
- 4dBm
- Sensitivity:
- -95dBm
- Memory Size:
- 128kB Flash
- Serial Interfaces:
- I2C, SPI, UART
- GPIO:
- 31
- Voltage - Supply:
- 2.4V ~ 3.6V
- Current - Receiving:
- 9.2mA
- Current - Transmitting:
- 8.8mA
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 40-HVQFN (5x5)
QN9022/DY FAQ
1.How can I place an order for QN9022/DY through Aetrix?
Please submit a Request for Quotation (RFQ) for QN9022/DY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for QN9022/DY reliable?
The price and inventory of QN9022/DY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for QN9022/DY is usually 5 days.
3.What payment methods are accepted for QN9022/DY?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for QN9022/DY transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for QN9022/DY?
QN9022/DY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your QN9022/DY order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for QN9022/DY?
For technical support, including QN9022/DY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your QN9022/DY requirements.
6.How does Aetrix verify that QN9022/DY is sourced from the original manufacturer or authorized distributors?
All QN9022/DY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that QN9022/DY meets industry standards.
7.What is the process for return or replacement of QN9022/DY?
All QN9022/DY units undergo pre-shipment inspection (PSI). If there is an issue with QN9022/DY, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The QN9022/DY part is unused and in its original packaging.
Return procedure for QN9022/DY:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
QN9022/DY Tags
-
ESP32-D0WD-V3
Espressif Systems
-
ESP8266EX
Espressif Systems
-
ESP32-S3
Espressif Systems
-
NRF24L01P-R7
Nordic Semiconductor ASA
-
NRF24L01P-R
Nordic Semiconductor ASA
-
ESP32-U4WDH
Espressif Systems
-
DA14531-00000OG2
Renesas
-
ESP32-C6FH4
Espressif Systems
-
DA14531-00000FX2
Renesas
-
NRF24L01P-T
Nordic Semiconductor ASA
-
NRF52810-QCAA-R
Nordic Semiconductor ASA
-
ESP32-S3FN8
Espressif Systems
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
