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Renesas R1LP0108ESF-5SI#B0

Part No.:
R1LP0108ESF-5SI#B0
Manufacturer:
Renesas
Category:
Memory
Package:
32-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixR1LP0108ESF-5SI#B0.pdf
Description:
IC SRAM 1MBIT PARALLEL 32TSOP I
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,549

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Product details

Overview

R1LP0108ESF-5SI#B0 from Renesas Electronics is a 1Mb (131,072 × 8-bit) low-power static RAM with 55 ns access time, -40°C to +85°C industrial temperature range, and 4.5–5.5 V single-supply operation. It features TTL-compatible I/O, no refresh requirement, and dual chip select (CS1#, CS2) for seamless memory expansion in embedded controllers and battery-backed systems.

For engineers reviewing the R1LP0108ESF-5SI#B0 datasheet, R1LP0108ESF-5SI#B0 pinout, R1LP0108ESF-5SI#B0 application, or R1LP0108ESF-5SI#B0 equivalent, key selection criteria include standby current (0.6 µA typical at 5.0 V), data retention down to 2.0 V, TSOP packaging compatibility, and support for OR-tie bus configurations via three-state outputs.

Technical Context

This device implements a fully static CMOS memory architecture with no internal clocks or refresh circuitry, relying on direct address decoding and latch-based storage cells. Its dual chip select logic (CS1# active-low, CS2 active-high) enables hierarchical memory mapping without external glue logic.

Input and output buffers are TTL-compatible with VIH ≥ 2.2 V and VIL ≤ 0.8 V, and output drive meets VOH ≥ 2.4 V (IOH = –1 mA) and VOL ≤ 0.4 V (IOL = 2 mA). Standby mode is entered when CS2 is low or both CS2 high and CS1# high, reducing current to sub-microamp levels.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 1 Mb (131,072 words × 8 bits) - supports byte-wide data buses in microcontroller peripherals and legacy ISA-style interfaces.
Access Time 55 ns - ensures compatibility with 12–15 MHz system clocks in industrial microcontrollers and FPGA-based controllers.
Supply Voltage 4.5–5.5 V - operates directly from standard 5 V rails without regulation, simplifying power design in cost-sensitive applications.
Standby Current 0.6 µA typical at 5.0 V, 25°C - enables multi-year battery backup in real-time clock modules and energy-harvesting sensor nodes.
Data Retention Voltage 2.0 V minimum - maintains stored data during brown-out conditions or primary supply failure, critical for nonvolatile configuration storage.
Operating Temperature –40°C to +85°C - qualified for industrial automation, motor drives, and outdoor telemetry equipment without derating.
Package Type 32-pin TSOP (8 mm × 20 mm, normal-bend) - surface-mount compatible with automated assembly and space-constrained PCB layouts.

Pinout & Package

Package: 32-pin plastic TSOP (PTSA0032KA-A / 32P3H-E), 8 mm × 20 mm body, normal-bend leads, JEDEC-standard footprint.

Pin/Terminal Circuit Role Design Meaning
A0–A16 Address input 17-bit address bus supporting full 131,072-word addressing; no multiplexing required.
DQ0–DQ7 Data I/O Bi-directional 8-bit data bus with three-state control; enables shared bus topology via OE# and CS# coordination.
CS1# Chip select 1 Active-low enable; must be low with CS2 high for read/write operations; high with CS2 high places outputs in high-Z.
CS2 Chip select 2 Active-high enable; controls buffer activation and data retention entry when low or held at rail extremes.
WE# Write enable Active-low write strobe; initiates write cycle on falling edge when CS1# low and CS2 high.
OE# Output enable Active-low control for output drivers; prevents bus contention during multi-device sharing or idle cycles.
Vcc Power supply +4.5 V to +5.5 V supply; decoupling required within 10 mm of pin per JEDEC guidelines.
Vss Ground Reference return path for all I/O and core logic; requires low-impedance connection to PCB ground plane.
NC No connect Pin 1 (SOP/TSOP top-left corner) is unconnected; must remain floating - no routing or soldering allowed.

Key Features

Feature Design Value
No refresh required Eliminates external refresh controller or timer overhead, reducing firmware complexity and CPU load in resource-constrained systems.
0.6 µA standby current Enables >10-year battery life in SRAM-backed RTCs or configuration memory when paired with CR2032 coin cells.
TTL-compatible I/O Direct interface to legacy microcontrollers (e.g., 8051, Z80, PIC18) without level-shifting components or bus buffers.
OR-tie capability Three-state outputs allow multiple R1LP0108ESF-5SI#B0 devices to share a common data bus using wired-OR logic for status or interrupt aggregation.
Dual chip select (CS1#, CS2) Supports hierarchical memory banking - e.g., CS2 selects memory bank, CS1# selects device within bank - minimizing address decoder logic.

Applications

Industrial PLC Data Buffer Medical Device Configuration Storage

Use Scenario: Storing runtime I/O mapping tables and calibration coefficients in programmable logic controllers operating in factory environments with wide temperature swings.

IC Role / Device Role / Timing Role: Byte-accessible, non-refreshing SRAM serving as fast-access scratchpad memory for deterministic scan-cycle execution.

Use Value: 55 ns access time ensures zero-wait-state operation with 12 MHz Cortex-M4 MCUs; -40°C to +85°C rating guarantees reliability across seasonal thermal cycling.

Use Scenario: Holding user-configurable therapy parameters and device identity in portable infusion pumps requiring tamper-resistant, battery-backed memory.

IC Role / Device Role / Timing Role: Low-voltage data retention SRAM preserving settings during AC power loss or battery replacement.

Use Value: 2.0 V data retention threshold and 0.6 µA standby current extend CR2032 battery life beyond 5 years while maintaining parameter integrity.

Automotive Body Control Module Test Equipment Firmware Cache

Use Scenario: Caching CAN message filters and lighting sequence patterns in body control units where ECU reboots must preserve user preferences.

IC Role / Device Role / Timing Role: Static RAM acting as persistent shadow memory for volatile MCU RAM, updated only on parameter change.

Use Value: Dual CS logic allows seamless integration into existing 8-bit bus architectures; TSOP package fits compact under-dash ECU layouts.

Use Scenario: Accelerating firmware load times in automated test equipment by caching frequently accessed instruction blocks during self-test sequences.

IC Role / Device Role / Timing Role: High-speed, low-latency memory providing deterministic read latency to FPGA-based sequencers.

Use Value: 55 ns tAA and 30 ns tOE guarantee sub-60 ns read turnaround - critical for achieving <100 ns test step resolution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar static RAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61LV102416L-10TLI 2 Mb (128k × 16), 10 ns access, 3.3 V supply, 48-pin TSOP-I - higher density but incompatible voltage and bus width. Requires level translation and data bus widening; unsuitable for direct 5 V, 8-bit legacy systems. Select only if migrating to 3.3 V architecture and needing >1 Mb capacity with faster timing.
AS6C4008-55ZIN 4 Mb (512k × 8), 55 ns access, 5 V supply, 32-pin SOP - same speed and voltage, but larger die and different pinout (SOP vs TSOP). PCB redesign needed due to SOP footprint and altered pin assignments (e.g., A16 location, NC placement). Consider for cost-sensitive 5 V designs where board space permits SOP and layout revision is acceptable.

Compared with R1LP0108ESF-5SI#B0, IS61LV102416L-10TLI offers higher speed and density but mandates 3.3 V infrastructure changes, while AS6C4008-55ZIN matches voltage and timing but requires mechanical redesign for SOP packaging and lacks industrial temperature validation.

Availability

R1LP0108ESF-5SI#B0 is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and automotive body electronics requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R1LP0108ESF-5SI#B0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and memory solutions for industrial, automotive, and infrastructure markets.

The R1LP0108E Series was designed as low-power, drop-in-replacement SRAM for legacy 5 V systems requiring battery backup, minimal board space, and guaranteed industrial temperature operation - targeting cost-sensitive, long-lifecycle embedded applications.

FAQ

What is the maximum operating frequency supported by R1LP0108ESF-5SI#B0?

R1LP0108ESF-5SI#B0 does not operate on a clock signal - it is a static RAM with asynchronous access. Its 55 ns access time supports reliable interfacing with microcontrollers and FPGAs running up to ~12 MHz bus frequencies, assuming setup/hold timing margins are met. The R1LP0108ESF-5SI#B0 datasheet specifies tRC = 55 ns and tAA = 55 ns under industrial temperature and 5.0 V conditions.

Does R1LP0108ESF-5SI#B0 require an external clock or refresh circuit?

No, R1LP0108ESF-5SI#B0 is a fully static RAM and requires no external clock or periodic refresh cycles. Data retention is maintained indefinitely as long as power and valid control signals are applied. This eliminates refresh overhead in firmware and simplifies hardware design - a core advantage confirmed in the R1LP0108E Series datasheet Section 1.

Can R1LP0108ESF-5SI#B0 retain data during power loss?

Yes, R1LP0108ESF-5SI#B0 supports data retention down to 2.0 V supply voltage when placed in standby mode via CS2 low or CS1# high/CS2 high. At 3.0 V and 25°C, typical retention current is 0.6 µA - enabling multi-year backup with small coin cells. This behavior is explicitly characterized in the "Low Vcc Data Retention Characteristics" section (Page 12) of the R1LP0108E Series datasheet.

What is the function of the NC pin on R1LP0108ESF-5SI#B0?

The NC (No Connect) pin on R1LP0108ESF-5SI#B0 is Pin 1 in the 32-pin TSOP package (PTSA0032KA-A). It is internally unconnected and must remain electrically floating - no trace, pad, or solder connection should be made. This is verified in the Pin Arrangement diagram (Page 3) and Pin Description table (Page 4) of the R1LP0108E Series datasheet.

Is R1LP0108ESF-5SI#B0 RoHS compliant?

Yes, R1LP0108ESF-5SI#B0 is RoHS compliant. Renesas Electronics confirms environmental compliance in the "Notice" section (Page 12) of the R1LP0108E Series datasheet, stating adherence to the EU RoHS Directive and recommending compliance verification through official Renesas sales channels or authorized distributors.

R1LP0108ESF-5SI#B0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
32-TFSOP (0.724", 18.40mm Width)
Packaging:
Tray
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM
Memory Size:
1Mbit
Memory Organization:
128K x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
55ns
Access Time:
55 ns
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
32-TSOP I

R1LP0108ESF-5SI#B0 FAQ

1.How can I place an order for R1LP0108ESF-5SI#B0 through Aetrix?

Please submit a Request for Quotation (RFQ) for R1LP0108ESF-5SI#B0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R1LP0108ESF-5SI#B0 reliable?

The price and inventory of R1LP0108ESF-5SI#B0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1LP0108ESF-5SI#B0 is usually 5 days.

3.What payment methods are accepted for R1LP0108ESF-5SI#B0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1LP0108ESF-5SI#B0 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R1LP0108ESF-5SI#B0?

R1LP0108ESF-5SI#B0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R1LP0108ESF-5SI#B0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R1LP0108ESF-5SI#B0?

For technical support, including R1LP0108ESF-5SI#B0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1LP0108ESF-5SI#B0 requirements.

6.How does Aetrix verify that R1LP0108ESF-5SI#B0 is sourced from the original manufacturer or authorized distributors?

All R1LP0108ESF-5SI#B0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1LP0108ESF-5SI#B0 meets industry standards.

7.What is the process for return or replacement of R1LP0108ESF-5SI#B0?

All R1LP0108ESF-5SI#B0 units undergo pre-shipment inspection (PSI). If there is an issue with R1LP0108ESF-5SI#B0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R1LP0108ESF-5SI#B0 part is unused and in its original packaging.

Return procedure for R1LP0108ESF-5SI#B0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R1LP0108ESF-5SI#B0 Tags

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