Renesas R1LP0108ESN-7SI#B0
- Part No.:
- R1LP0108ESN-7SI#B0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 32-SOIC (0.450", 11.40mm Width)
- Datasheet:
-
R1LP0108ESN-7SI#B0.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32SOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
R1LP0108ESN-7SI#B0 from Renesas Electronics is a 1Mb (131,072 × 8-bit) low-power static RAM with 70 ns access time, operating on a single 4.5–5.5 V supply and featuring 0.6 µA typical standby current at 5.0 V. It uses TTL-compatible I/O, supports easy memory expansion via dual chip select inputs (CS1# and CS2), and is designed for battery-backed or low-voltage embedded systems requiring non-refreshed, reliable data retention.
For engineers reviewing the R1LP0108ESN-7SI#B0 datasheet, R1LP0108ESN-7SI#B0 pinout, R1LP0108ESN-7SI#B0 application, or R1LP0108ESN-7SI#B0 equivalent, key selection criteria include industrial temperature support (–40°C to +85°C), 32-pin SOP package compatibility, low-leakage data retention down to 2.0 V, and OR-tie capable three-state outputs for bus sharing.
Technical Context
The R1LP0108ESN-7SI#B0 implements a fully static 128k-word × 8-bit memory array using Renesas's 0.15 µm CMOS and TFT process, eliminating need for clocks or refresh cycles. Its dual chip select architecture (CS1# active-low, CS2 active-high) enables hierarchical memory mapping and seamless expansion without external logic.
Read and write operations are controlled by independent OE# (output enable) and WE# (write enable) signals, with three-state outputs supporting bus contention avoidance. Data retention mode is activated either by pulling CS2 ≤ 0.2 V or asserting CS1# ≥ Vcc–0.2 V while holding CS2 in valid high/low state - enabling ultra-low ICCDR of 0.6 µA at 25°C and 3.0 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 131,072 × 8-bit (1 Mb); supports byte-wide data interface without external multiplexing |
| Access time | 70 ns max; ensures compatibility with legacy 8-bit microcontrollers and FPGA glue logic |
| Supply voltage | 4.5–5.5 V; operates across full TTL-compatible range without regulation overhead |
| Standby current | 0.6 µA typical at 5.0 V / 25°C; enables multi-year battery backup in portable instrumentation |
| Data retention VCC | 2.0 V min; maintains stored data during brown-out or backup battery discharge |
| Operating temperature | –40°C to +85°C; qualified for industrial control and automotive under-hood auxiliary modules |
| I/O compatibility | TTL input thresholds (VIL ≤ 0.8 V, VIH ≥ 2.2 V); interfaces directly with 5 V logic families without level shifters |
| Output drive | VOH ≥ 2.4 V @ –1 mA, VOL ≤ 0.4 V @ 2 mA; meets standard TTL fan-out requirements |
Pinout & Package
Package: 32-pin 525-mil plastic SOP (PRSP0032DF-A), surface-mount, gull-wing lead form with 0.8 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address inputs | 17-bit address bus supporting full 128k-word decoding; A16 is MSB for 1-Mb capacity |
| DQ0–DQ7 | Bi-directional data I/O | Common data bus with three-state output control; supports OR-tie for shared-bus architectures |
| CS1#, CS2 | Chip select inputs | CS1# active-low and CS2 active-high allow hierarchical decoding; both required for active memory access |
| WE# | Write enable | Active-low signal initiating write cycle; timing synchronized to CS1#/CS2 edges per AC specs |
| OE# | Output enable | Active-low control for output buffer; prevents bus contention when multiple devices share DQ lines |
| Vcc, Vss | Power supply | Single 5 V supply rail; no separate VDDQ or ground separation required |
| NC | No connection | Pin 1 (SOP top-left corner) is unconnected; must remain floating or grounded per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| No clock, no refresh | Eliminates system-level timing constraints and refresh controller logic; reduces firmware complexity |
| Low standby current | 0.6 µA typical enables >10-year data retention on coin-cell batteries in metering applications |
| OR-tie capable outputs | Three-state DQ pins allow wired-OR bus configurations without external pull-ups or diodes |
| Dual chip select interface | CS1# and CS2 enable modular memory expansion up to 4 MB using simple address decoding |
| 2.0 V data retention | Maintains valid data at VCC as low as 2.0 V, supporting graceful degradation during power failure |
Applications
| Industrial PLC Memory Buffer | Portable Medical Device Data Log |
|---|---|
Use Scenario: Storing real-time sensor history and configuration parameters in programmable logic controllers with limited board space and no refresh-capable host CPU. IC Role / Device Role / Timing Role: Non-volatile SRAM buffer interfacing directly to 8-bit microcontroller address/data bus; acts as fast-access scratchpad between volatile RAM and EEPROM. Use Value: 70 ns access time meets cycle timing of 14 MHz 8051 derivatives; –40°C to +85°C rating ensures operation inside sealed control cabinets. | Use Scenario: Capturing ECG waveform samples during battery-powered operation where main MCU enters deep sleep between acquisitions. IC Role / Device Role / Timing Role: Battery-backed memory storing up to 128 kB of raw waveform data; retains content during 3.3 V system brown-out using internal 3 V coin cell. Use Value: 0.6 µA standby current extends coin-cell life beyond 5 years; 2.0 V data retention threshold aligns with Li-MnO₂ cutoff voltage. |
| Automotive Body Control Module | Smart Energy Meter Firmware Cache |
Use Scenario: Holding calibration tables and fault logs in body control units exposed to under-dash thermal cycling and intermittent 12 V supply. IC Role / Device Role / Timing Role: Industrial-grade SRAM providing deterministic read/write latency for CAN message buffering and diagnostic storage. Use Value: Qualified for –40°C to +85°C ambient; TTL-compatible I/O eliminates level-shifting components in 5 V CAN subsystems. | Use Scenario: Caching firmware update payloads and tariff tables in utility meters powered by supercapacitors during grid outages. IC Role / Device Role / Timing Role: High-reliability memory holding critical operational code during brief AC loss; accessed only during boot or update phases. Use Value: 3 µA max ISB ensures <1 µW standby power draw; 32-pin SOP footprint allows direct replacement of legacy 28-pin SOJ SRAMs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-power static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV10248AL-70TQLI | 70 ns access, 3.3 V supply only; 32-pin TSOP-II; 1 µA standby at 3.3 V | Requires 3.3 V system design; not drop-in compatible due to voltage and package mismatch | Select if migrating to 3.3 V architecture and accepting TSOP-II footprint change |
| AS6C1008-70SCN | 70 ns access, 5 V supply; 32-pin SOP; 1 µA standby at 5 V; no data retention below 4.5 V | Lacks low-VCC data retention capability; unsuitable for battery-backup scenarios below 4.5 V | Choose for cost-sensitive 5 V-only designs where extended retention is unnecessary |
Compared with IS61LV10248AL-70TQLI and AS6C1008-70SCN, the R1LP0108ESN-7SI#B0 uniquely combines 5 V operation, industrial temperature range, 32-pin SOP compatibility, and verified 2.0 V data retention - making it the only option among the three suitable for battery-backed industrial logging with brown-out resilience.
Availability
R1LP0108ESN-7SI#B0 is available at Aetrix Electronics and suitable for industrial PLC memory buffers, portable medical device data loggers, and automotive body control modules requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for R1LP0108ESN-7SI#B0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The R1LP0108E Series was developed as part of Renesas's LPSRAM portfolio to deliver low-power, high-reliability static RAM for battery-operated and safety-critical embedded systems requiring zero-refresh operation and extended data retention.
FAQ
What is the maximum operating temperature range supported by the R1LP0108ESN-7SI#B0?
The R1LP0108ESN-7SI#B0 is rated for operation from –40°C to +85°C, meeting industrial temperature specifications. This range is confirmed in the Ordering Information table on page 2 of the R10DS0151EJ0100 datasheet, where "I" suffix denotes the industrial grade. The device maintains full AC and DC performance across this range, including 70 ns access time and 0.6 µA standby current at 25°C.
Does the R1LP0108ESN-7SI#B0 require a refresh circuit or clock signal?
No, the R1LP0108ESN-7SI#B0 is a fully static RAM and requires no clock signal or periodic refresh cycles. Its architecture uses bistable latches for each memory cell, enabling indefinite data retention as long as power is applied and control signals meet timing specifications. This eliminates refresh overhead in microcontroller firmware and simplifies PCB design compared to DRAM or pseudo-SRAM solutions.
Can the R1LP0108ESN-7SI#B0 retain data when Vcc drops below 4.5 V?
Yes, the R1LP0108ESN-7SI#B0 supports data retention down to 2.0 V Vcc, as specified in the Low Vcc Data Retention Characteristics table on page 12 of the datasheet. In retention mode - activated by pulling CS2 ≤ 0.2 V or asserting CS1# ≥ Vcc–0.2 V - the device draws only 0.6 µA typical current at 3.0 V and 25°C, enabling multi-year backup from small batteries or supercapacitors.
What package type is used for the R1LP0108ESN-7SI#B0?
The R1LP0108ESN-7SI#B0 uses a 32-pin 525-mil plastic SOP (Small Outline Package) with gull-wing leads, identified by package code PRSP0032DF-A. This is explicitly listed in the Ordering Information table on page 2 of the R10DS0151EJ0100 datasheet under the "Package" column for the R1LP0108ESN-7SI#B* part family.
How does the dual chip select (CS1# and CS2) interface work on the R1LP0108ESN-7SI#B0?
The R1LP0108ESN-7SI#B0 requires both CS1# low and CS2 high to enable memory access - a two-signal decode scheme that supports hierarchical memory mapping. CS1# is active-low and CS2 is active-high; the device enters standby if either CS1# is high or CS2 is low. This arrangement allows straightforward expansion to larger memory spaces using standard address-line decoding without additional logic gates.
R1LP0108ESN-7SI#B0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 32-SOIC (0.450", 11.40mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOP
R1LP0108ESN-7SI#B0 FAQ
1.How can I place an order for R1LP0108ESN-7SI#B0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R1LP0108ESN-7SI#B0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R1LP0108ESN-7SI#B0 reliable?
The price and inventory of R1LP0108ESN-7SI#B0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1LP0108ESN-7SI#B0 is usually 5 days.
3.What payment methods are accepted for R1LP0108ESN-7SI#B0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1LP0108ESN-7SI#B0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R1LP0108ESN-7SI#B0?
R1LP0108ESN-7SI#B0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R1LP0108ESN-7SI#B0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R1LP0108ESN-7SI#B0?
For technical support, including R1LP0108ESN-7SI#B0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1LP0108ESN-7SI#B0 requirements.
6.How does Aetrix verify that R1LP0108ESN-7SI#B0 is sourced from the original manufacturer or authorized distributors?
All R1LP0108ESN-7SI#B0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1LP0108ESN-7SI#B0 meets industry standards.
7.What is the process for return or replacement of R1LP0108ESN-7SI#B0?
All R1LP0108ESN-7SI#B0 units undergo pre-shipment inspection (PSI). If there is an issue with R1LP0108ESN-7SI#B0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R1LP0108ESN-7SI#B0 part is unused and in its original packaging.
Return procedure for R1LP0108ESN-7SI#B0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R1LP0108ESN-7SI#B0 Tags

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