My Inquiry
My Account
Renesas R1LV0108ESF-7SR#B0
- Part No.:
- R1LV0108ESF-7SR#B0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 32-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
R1LV0108ESF-7SR#B0.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:694
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R1LV0108ESF-7SR#B0 from Renesas Electronics is a 1Mb low-power static RAM (131,072 × 8-bit) fabricated in 0.15µm CMOS/TFT technology, operating from a single 2.7–3.6V supply with 70ns access time and 0.6µA typical standby current at 3.0V, designed for battery-backed memory systems in portable instrumentation and industrial control.
For engineers reviewing the R1LV0108ESF-7SR#B0 datasheet, R1LV0108ESF-7SR#B0 pinout, R1LV0108ESF-7SR#B0 application, or R1LV0108ESF-7SR#B0 equivalent, key selection criteria include TSOP-I package compatibility, TTL-level I/O interface, dual chip select architecture (CS1#/CS2), no-refresh operation, and low-voltage data retention down to 2.0V.
Technical Context
The R1LV0108ESF-7SR#B0 implements a fully static memory array with asynchronous read/write control via independent CS1#, CS2, WE#, and OE# signals. Its dual chip select enables seamless memory expansion without external logic, while OR-tie capable three-state outputs support bus sharing across multiple devices.
It features no internal clocks or refresh circuitry, eliminating timing overhead and power spikes associated with DRAM. Standby current drops to 0.6µA at +25°C when CS2 is low or CS1# is high with CS2 high, supporting long-term battery backup in power-constrained applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Mb (131,072 words × 8 bits) - supports byte-wide data paths without multiplexing or external width conversion. |
| Access Time | 70 ns - guarantees valid data on DQ0–DQ7 within 70 ns after address and CS1#/CS2 stabilization for deterministic timing in real-time control loops. |
| Supply Voltage | 2.7–3.6 V - compatible with standard 3.3V logic rails and tolerant of Li-ion battery discharge profiles (down to 2.7V). |
| Standby Current | 0.6 µA typical at 3.0V/+25°C - enables multi-year battery life in always-on backup mode without periodic wake-up. |
| Data Retention Voltage | 2.0 V minimum - maintains stored data during brown-out or deep sleep when main supply drops below 2.7V. |
| I/O Interface | TTL-compatible inputs/outputs - interoperates directly with legacy 3.3V microcontrollers and FPGAs without level-shifting. |
| Operating Temperature | 0 to +70°C - qualified for commercial-grade embedded systems including point-of-sale terminals and test equipment. |
Pinout & Package
Package: 32-pin TSOP (normal-bend type), 8mm × 20mm footprint (PTSA0032KA-A), surface-mount compatible with standard reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address input | 17-bit address bus supporting full 131,072-word addressing; no multiplexing required. |
| DQ0–DQ7 | Data input/output | Bi-directional 8-bit data bus with three-state control; enables shared bus topology via OE# and CS# coordination. |
| CS1#, CS2 | Chip select inputs | Two independent enables allow hierarchical memory mapping: CS2 enables address buffer, CS1# selects device activation. |
| WE# | Write enable | Active-low signal initiating write cycle; latches data on rising edge of WE# when CS1# low and CS2 high. |
| OE# | Output enable | Controls output drivers only; allows read data to be gated without affecting internal state or standby current. |
| Vcc, Vss | Power supply | Single 2.7–3.6V supply with dedicated ground; decoupling recommended per JEDEC TSOP guidelines. |
| NC | No connection | Pin 1 (NC) is unconnected - must remain floating or tied to ground per layout best practice; not usable as spare I/O. |
Key Features
| Feature | Design Value |
|---|---|
| No refresh required | Eliminates system-level refresh overhead and timing constraints - simplifies firmware and guarantees deterministic latency. |
| Low standby current (0.6 µA) | Extends battery life in backup mode beyond 5 years for typical coin-cell applications (e.g., CR2032 @ 220mAh). |
| Common Data I/O (DQ0–DQ7) | Reduces PCB trace count and package pin count versus separate data-in/data-out architectures. |
| OR-tie capability | Enables wired-OR bus configurations for multi-device read arbitration without external pull-ups or logic gates. |
| Dual chip select (CS1#/CS2) | Supports up to four R1LV0108E devices in linear address space using simple decode logic or FPGA address lines. |
Applications
| Portable Medical Monitor | Industrial PLC Data Logger |
|---|---|
Use Scenario: Battery-powered ECG monitor storing waveform snapshots during intermittent wireless transmission. IC Role / Device Role / Timing Role: Non-volatile data buffer retaining acquired samples during RF transmit gaps and power cycling. Use Value: 0.6µA standby current extends CR2032 battery life to >3 years; 2.0V data retention sustains memory through brown-out events. |
Use Scenario: Compact DIN-rail PLC capturing sensor readings at 100ms intervals with local storage during network outages. IC Role / Device Role / Timing Role: Local SRAM cache holding last 10,000 timestamped measurements before upload to cloud gateway. Use Value: 70ns access time ensures real-time logging without CPU wait states; TTL compatibility avoids level-shifters on MCU bus. |
| Point-of-Sale Terminal | Test Equipment Configuration Memory |
Use Scenario: Retail terminal maintaining transaction history and tax tables during AC power loss and battery switchover. IC Role / Device Role / Timing Role: Battery-backed memory preserving critical financial records and firmware configuration across power cycles. Use Value: Dual CS# pins simplify integration with existing 8-bit microcontroller address decoding; no refresh reduces firmware complexity. |
Use Scenario: Automated test system storing calibration coefficients and user-defined test sequences between power cycles. IC Role / Device Role / Timing Role: Fast-access configuration store enabling sub-second instrument boot and setup restoration. Use Value: 32-pin TSOP package fits dense PCB layouts; 2.7–3.6V operation aligns with system's regulated 3.3V rail. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-power static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV10248AL-70TQLI | 70ns access, 3.3V-only (3.135–3.465V), 15µA typical standby current at +25°C | Higher standby current limits battery lifetime; tighter Vcc tolerance requires precise regulation. | Select when board already uses strict 3.3V regulation and lower cost outweighs standby penalty. |
| AS6C1008-70SCN | 70ns access, 2.7–3.6V supply, 1.0µA typical standby at +25°C, 32-pin SOP package | SOP footprint increases board area vs. TSOP; slightly higher ISB impacts ultra-low-power designs. | Prefer for through-hole prototyping or where SOP thermal/mechanical reliability is prioritized over size. |
Compared with R1LV0108ESF-7SR#B0, the IS61LV10248AL-70TQLI demands tighter voltage control and draws ~17× more standby current, while the AS6C1008-70SCN trades TSOP compactness for SOP manufacturability and adds 0.4µA standby burden - making R1LV0108ESF-7SR#B0 optimal for space- and battery-limited commercial applications.
Availability
R1LV0108ESF-7SR#B0 is available at Aetrix Electronics and suitable for portable medical monitors, industrial PLC data loggers, and point-of-sale terminals requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for R1LV0108ESF-7SR#B0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and enterprise applications.
The R1LV0108E Series was developed for low-voltage, low-power memory applications where battery operation, simple interfacing, and data retention during brown-out are critical - targeting portable instrumentation and industrial control systems.
FAQ
What is the maximum operating temperature range for R1LV0108ESF-7SR#B0?
R1LV0108ESF-7SR#B0 is rated for 0°C to +70°C ambient operation (R-version). It is not qualified for extended industrial temperature ranges (–40°C to +85°C); that specification applies to variants ending in "I" such as R1LV0108ESF-7SI#B0. Thermal derating is not supported beyond the specified range.
Does R1LV0108ESF-7SR#B0 require an external clock or refresh signal?
No, R1LV0108ESF-7SR#B0 is a fully static RAM with no internal clock or refresh circuitry. All operations are asynchronous and controlled solely by address, CS1#, CS2, WE#, and OE# signals - eliminating timing-critical refresh cycles and simplifying system design.
Can R1LV0108ESF-7SR#B0 retain data when Vcc drops below 2.7V?
Yes, R1LV0108ESF-7SR#B0 maintains data integrity down to 2.0V Vcc under defined retention conditions: either CS2 ≤ 0.2V or CS1# ≥ Vcc–0.2V with CS2 ≥ Vcc–0.2V. At 3.0V and +25°C, typical data retention current is 0.6µA.
What is the function of the NC pin on R1LV0108ESF-7SR#B0?
Pin 1 of R1LV0108ESF-7SR#B0 is designated NC (No Connection) and must remain unconnected - it is not internally bonded and has no electrical function. Do not tie it to Vcc, Vss, or any control signal; floating is the correct implementation.
How does the dual chip select (CS1# and CS2) improve memory expansion with R1LV0108ESF-7SR#B0?
R1LV0108ESF-7SR#B0 uses CS2 to enable internal buffers (address, WE#, OE#, Din) and CS1# to activate the memory array. This two-level hierarchy allows up to four devices to share address/data buses using simple decode logic on higher-order address bits, reducing glue logic and PCB complexity.
R1LV0108ESF-7SR#B0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 32-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-TSOP
R1LV0108ESF-7SR#B0 FAQ
1.How can I place an order for R1LV0108ESF-7SR#B0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R1LV0108ESF-7SR#B0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R1LV0108ESF-7SR#B0 reliable?
The price and inventory of R1LV0108ESF-7SR#B0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1LV0108ESF-7SR#B0 is usually 5 days.
3.What payment methods are accepted for R1LV0108ESF-7SR#B0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1LV0108ESF-7SR#B0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R1LV0108ESF-7SR#B0?
R1LV0108ESF-7SR#B0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R1LV0108ESF-7SR#B0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R1LV0108ESF-7SR#B0?
For technical support, including R1LV0108ESF-7SR#B0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1LV0108ESF-7SR#B0 requirements.
6.How does Aetrix verify that R1LV0108ESF-7SR#B0 is sourced from the original manufacturer or authorized distributors?
All R1LV0108ESF-7SR#B0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1LV0108ESF-7SR#B0 meets industry standards.
7.What is the process for return or replacement of R1LV0108ESF-7SR#B0?
All R1LV0108ESF-7SR#B0 units undergo pre-shipment inspection (PSI). If there is an issue with R1LV0108ESF-7SR#B0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R1LV0108ESF-7SR#B0 part is unused and in its original packaging.
Return procedure for R1LV0108ESF-7SR#B0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R1LV0108ESF-7SR#B0 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
