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Renesas R1LV0108ESN-7SI#B0

Part No.:
R1LV0108ESN-7SI#B0
Manufacturer:
Renesas
Category:
Memory
Package:
32-SOIC (0.450", 11.40mm Width)
Datasheet:
AetrixR1LV0108ESN-7SI#B0.pdf
Description:
IC SRAM 1MBIT PARALLEL 32SOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,470

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Product details

Overview

R1LV0108ESN-7SI#B0 from Renesas Electronics is a 1Mb (131,072 × 8-bit) low-power static RAM IC operating from a single 2.7–3.6V supply, featuring 70 ns access time, -40°C to +85°C industrial temperature range, and 32-pin SOP package. It delivers 0.6 µA typical standby current at 3.0V and supports battery-backed memory systems in portable instrumentation and industrial controllers.

For engineers reviewing the R1LV0108ESN-7SI#B0 datasheet, R1LV0108ESN-7SI#B0 pinout, R1LV0108ESN-7SI#B0 application, or R1LV0108ESN-7SI#B0 equivalent, key selection criteria include its TTL-compatible I/O, dual chip select architecture for memory expansion, no-refresh operation, and verified data retention down to 2.0V with sub-10 µA retention current at +85°C.

Technical Context

This SRAM implements a fully static 128k-word × 8-bit memory array using Renesas's 0.15 µm CMOS process, with independent address buffer control via CS2 and full TTL-level compatibility on all inputs and outputs. Its dual chip select (CS1# and CS2) enables seamless memory banking and expansion without external logic.

The device operates with zero refresh cycles and no internal clocks, relying on asynchronous read/write timing controlled by WE#, OE#, and CS signals. Data retention mode is activated either by pulling CS2 ≤ 0.2V or asserting CS1# ≥ Vcc−0.2V while holding CS2 within valid high/low bounds - enabling ultra-low-power hold states in battery-critical applications.

Key Specifications

ParameterValue and Actual Design Meaning
Memory size131,072 × 8-bit (1 Mb); supports byte-wide data bus interfacing without multiplexing or external latching.
Access time70 ns max; ensures reliable interface with microcontrollers and FPGAs running at ≤14 MHz system clocks.
Supply voltage2.7–3.6 V; compatible with 3.3V logic rails and tolerant of Li-ion battery discharge profiles (3.6V → 2.7V).
Standby current0.6 µA typical at 3.0V/25°C; enables multi-year battery life in always-on backup memory applications.
Data retention VCC2.0 V min; guarantees nonvolatile data hold during brown-out or battery switchover without external capacitors.
Operating temperature-40°C to +85°C; qualified for industrial-grade embedded systems including motor drives and PLCs.
I/O compatibilityTTL input thresholds (VIH ≥ 2.0 V, VIL ≤ 0.6 V) and output drive (VOH ≥ 2.4 V @ -0.5 mA); interoperable with legacy 5V-tolerant microcontrollers via level-shifting or direct 3.3V interfaces.

Pinout & Package

Package: 32-pin plastic SOP (525-mil), JEDEC MS-012AC compliant, body size 13.97 mm × 17.88 mm × 2.67 mm.

Pin/TerminalCircuit RoleDesign Meaning
A0–A16Address inputs17-bit address bus supporting full 131,072-word decoding; A16 is MSB for 1Mb capacity.
DQ0–DQ7Bi-directional data I/OCommon data bus with three-state outputs; enables OR-tie capability for shared-bus architectures.
CS1#, CS2Chip select inputsTwo independent enables: CS2 gates address buffers; CS1# enables write/read paths - allows hierarchical memory mapping.
WE#Write enableActive-low control for write cycles; timing synchronized with CS1#/CS2 to define valid write window per AC specs.
OE#Output enableControls DQ bus direction and tristate; prevents contention when multiple devices share data lines.
Vcc, VssPower and groundSingle-supply operation; decoupling required per 0.1 µF ceramic near Vcc pin for noise immunity.
NCNo connectPin 1 (SOP top-left corner) is unconnected; must remain floating - not tied to Vcc/Vss.

Key Features

FeatureDesign Value
No refresh / no clock requiredEliminates timing-critical clock distribution and refresh interrupt overhead in MCU-based systems.
Dual chip select (CS1#, CS2)Enables 2× memory bank selection or cascaded decoding - reduces need for external address decoders.
Common data I/O with three-state outputsReduces PCB trace count and simplifies bus arbitration in multi-device memory subsystems.
Low-voltage data retention (2.0V min)Supports seamless power-fail hold using small backup capacitors or coin cells without voltage regulators.
TTL-compatible I/ODirect interface with legacy 3.3V/5V microcontrollers (e.g., ARM7, PIC, MSP430) without level translators.

Applications

Industrial PLC Data BufferPortable Medical Instrument Memory

Use Scenario: Storing real-time sensor logs and configuration parameters in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Nonvolatile backup RAM holding critical state data during mains power loss or firmware updates.

Use Value: 0.6 µA standby current and 2.0V data retention guarantee >10-year battery-backed operation without maintenance.

Use Scenario: Retaining calibration coefficients and patient history in handheld ECG monitors powered by rechargeable Li-ion batteries.

IC Role / Device Role / Timing Role: Primary working memory with instant-on capability and zero-latency read/write during active measurement cycles.

Use Value: 70 ns access time and TTL compatibility enable direct connection to low-power Cortex-M0+ MCUs without glue logic.

Smart Energy Meter Firmware CacheAutomotive Body Control Module Log Storage

Use Scenario: Caching tariff tables and consumption history in ANSI C12.19-compliant electricity meters exposed to wide ambient temperatures.

IC Role / Device Role / Timing Role: High-reliability scratchpad memory supporting secure firmware updates and tamper-proof logging.

Use Value: -40°C to +85°C rating and 0.33 mA max standby current ensure compliance with ANSI C12.22 environmental requirements.

Use Scenario: Recording door lock actuation events and lighting fault codes in automotive BCMs operating under engine bay thermal stress.

IC Role / Device Role / Timing Role: Crash-resistant nonvolatile storage retaining diagnostic data after ignition-off and battery disconnect.

Use Value: Verified data retention at 2.0V and <10 µA current at +85°C meets ISO 16750-4 transient and thermal robustness standards.

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-power SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61LV25616AL-10TLI256K × 16-bit (4 Mb), 10 ns access, 3.3V only, 44-pin TSOP; higher density but larger footprint and faster speed.Requires PCB redesign for 44-pin layout and 16-bit data bus; suited for high-throughput buffering, not drop-in replacement.Select only if bandwidth >100 MB/s and 16-bit interface are required; not suitable for space-constrained 32-pin SOP designs.
AS6C4008-70SCN512K × 8-bit (4 Mb), 70 ns access, 2.7–3.6V, 32-pin SOP; same package and speed grade but 4× capacity and higher ICC1 (28 mA typ).Compatible pinout and voltage range; usable as capacity upgrade where board area permits and higher active current is acceptable.Valid option for capacity scaling without layout change - verify thermal dissipation and battery runtime impact before substitution.

Compared with R1LV0108ESN-7SI#B0, IS61LV25616AL-10TLI offers greater bandwidth but demands new PCB routing and 16-bit bus support, whereas AS6C4008-70SCN provides 4× memory depth in identical 32-pin SOP packaging at the cost of +85% active current - making R1LV0108ESN-7SI#B0 optimal for ultra-low-power, space-constrained 1Mb use cases.

Availability

R1LV0108ESN-7SI#B0 is available at Aetrix Electronics and suitable for industrial PLCs, portable medical instruments, smart energy meters, and automotive body control modules requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for R1LV0108ESN-7SI#B0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.

The R1LV0108E Series was designed specifically for low-voltage, low-power static RAM applications in battery-operated and thermally demanding environments - emphasizing data retention integrity, TTL interoperability, and minimal standby current without sacrificing access speed.

FAQ

What is the maximum operating frequency supported by R1LV0108ESN-7SI#B0?

R1LV0108ESN-7SI#B0 does not operate on a clock signal - it is an asynchronous SRAM. Its 70 ns access time corresponds to a maximum effective interface rate of approximately 14.3 MHz when used with a microcontroller or FPGA driving address and control signals within specified setup/hold windows. Timing is governed entirely by tRC, tAA, and tOE parameters in the AC characteristics table, not by a system clock.

Does R1LV0108ESN-7SI#B0 require external refresh circuitry?

No, R1LV0108ESN-7SI#B0 is a true static RAM and requires no external refresh circuitry or periodic access to retain data. Its memory cells are built from cross-coupled inverters that maintain state indefinitely as long as Vcc remains within specification and CS signals are held inactive during standby. This eliminates refresh overhead in software and hardware design.

Can R1LV0108ESN-7SI#B0 be used with a 5V microcontroller system?

R1LV0108ESN-7SI#B0 operates strictly from 2.7–3.6V and is not 5V-tolerant. While its inputs meet TTL voltage thresholds (VIH ≥ 2.0V, VIL ≤ 0.6V), applying 5V signals will exceed absolute maximum ratings and cause permanent damage. Interface with 5V systems requires level translation on all address, control, and data lines - or use of a 3.3V-compatible MCU with 5V-tolerant I/O.

What is the data retention behavior of R1LV0108ESN-7SI#B0 during power loss?

R1LV0108ESN-7SI#B0 maintains stored data down to Vcc = 2.0V when placed in data retention mode - achieved by asserting CS2 ≤ 0.2V or CS1# ≥ Vcc−0.2V with CS2 held high/low. At +25°C, retention current is 0.6 µA typical; at +85°C, it rises to 10 µA max. This enables reliable hold using small backup capacitors or primary lithium cells without regulation.

Is the pinout of R1LV0108ESN-7SI#B0 compatible with other 32-pin SOP SRAMs like the CY62128EV30?

No - R1LV0108ESN-7SI#B0 uses a proprietary pin assignment optimized for Renesas' dual-CS architecture. While both are 32-pin SOP devices, CY62128EV30 places CE# and OE# on different pins and lacks CS2; its A16 is assigned to NC, whereas R1LV0108ESN-7SI#B0 uses A16 as a functional address line. Direct substitution would cause address decoding errors and bus contention.

R1LV0108ESN-7SI#B0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
32-SOIC (0.450", 11.40mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM
Memory Size:
1Mbit
Memory Organization:
128K x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
70ns
Access Time:
70 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
32-SOP

R1LV0108ESN-7SI#B0 FAQ

1.How can I place an order for R1LV0108ESN-7SI#B0 through Aetrix?

Please submit a Request for Quotation (RFQ) for R1LV0108ESN-7SI#B0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R1LV0108ESN-7SI#B0 reliable?

The price and inventory of R1LV0108ESN-7SI#B0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1LV0108ESN-7SI#B0 is usually 5 days.

3.What payment methods are accepted for R1LV0108ESN-7SI#B0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1LV0108ESN-7SI#B0 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R1LV0108ESN-7SI#B0?

R1LV0108ESN-7SI#B0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R1LV0108ESN-7SI#B0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R1LV0108ESN-7SI#B0?

For technical support, including R1LV0108ESN-7SI#B0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1LV0108ESN-7SI#B0 requirements.

6.How does Aetrix verify that R1LV0108ESN-7SI#B0 is sourced from the original manufacturer or authorized distributors?

All R1LV0108ESN-7SI#B0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1LV0108ESN-7SI#B0 meets industry standards.

7.What is the process for return or replacement of R1LV0108ESN-7SI#B0?

All R1LV0108ESN-7SI#B0 units undergo pre-shipment inspection (PSI). If there is an issue with R1LV0108ESN-7SI#B0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R1LV0108ESN-7SI#B0 part is unused and in its original packaging.

Return procedure for R1LV0108ESN-7SI#B0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R1LV0108ESN-7SI#B0 Tags

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