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Renesas R1LV0216BSB-5SI#B1

Part No.:
R1LV0216BSB-5SI#B1
Manufacturer:
Renesas
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixR1LV0216BSB-5SI#B1.pdf
Description:
IC SRAM 2MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:160

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Product details

Overview

R1LV0216BSB-5SI#B1 from Renesas Electronics is a 2Mb low-power static RAM organized as 131,072 × 16-bit, fabricated in 0.15µm CMOS/TFT technology, operating from 2.7V–3.6V with 55 ns access time and 1 µA typical standby current at 3.0V, used in battery-backed memory systems requiring no refresh and TTL-compatible interfacing.

For engineers reviewing the R1LV0216BSB-5SI#B1 datasheet, R1LV0216BSB-5SI#B1 pinout, R1LV0216BSB-5SI#B1 application, or R1LV0216BSB-5SI#B1 equivalent, key selection criteria include single-supply 2.7–3.6V operation, byte-selectable write capability via LB#/UB#, 44-pin TSOP (II) package compatibility, and sub-1µA data retention current at 2.0V VCC.

Technical Context

This SRAM implements a fully asynchronous architecture with no clocks or refresh cycles required. Its address buffer, I/O drivers, and byte-enable logic are all controlled by CS#, WE#, OE#, LB#, and UB# signals, enabling flexible word/byte-level read/write operations without external timing control.

The device supports three independent write modes-lower byte, upper byte, and full word-determined by the combination of LB# and UB# states during active CS# and WE#. Data retention is maintained down to 2.0V VCC with ISB1 ≤ 10 µA at +85°C when CS# or LB#/UB# are held high.

Key Specifications

ParameterValue and Actual Design Meaning
Memory size2 Mbit (131,072 × 16-bit), enabling compact 16-bit data bus systems without external multiplexing
Access time55 ns max, supporting 18.2 MHz burst read/write cycles in synchronous system interfaces
Supply voltage2.7–3.6 V, compatible with 3.3V logic domains and battery-backed 3.0V systems
Standby current1 µA typical at 3.0V/25°C, reducing power budget in always-on backup memory applications
Data retention VCC2.0 V min, allowing extended hold time during brown-out or battery switchover events
Package44-pin TSOP (II), 400-mil width, surface-mount compatible with standard PCB assembly processes
I/O interfaceTTL-compatible inputs/outputs, eliminating level-shifter requirements in legacy 3.3V microcontroller designs

Pinout & Package

44-pin plastic TSOP (II) package, 400-mil body width, JEDEC-standard footprint with gull-wing leads for reflow soldering.

Pin/TerminalCircuit RoleDesign Meaning
VccPower supplyPrimary 2.7–3.6V supply rail; decoupling capacitor placement critical for noise immunity during fast transitions
Vss (GND)Ground referenceCommon return path for all digital and I/O circuits; requires low-inductance connection to plane
A0–A16Address input17-bit address bus supporting full 131k-word addressing; A0 least significant bit
DQ0–DQ15Data I/O16-bit bidirectional data bus with three-state outputs; OR-tie capable for bus sharing
CS#Chip selectActive-low enable controlling all internal buffers; high state forces full standby mode
WE#Write enableActive-low signal initiating write cycle; combined with LB#/UB# determines byte granularity
OE#Output enableActive-low control for output drivers; prevents bus contention when multiple devices share DQ lines
LB# / UB#Byte enableIndependent active-low controls for lower (DQ0–7) and upper (DQ8–15) byte writes
NCNo connectionUnbonded pins at positions 23 and 44; must remain unconnected per design

Key Features

FeatureDesign Value
No refresh requiredEliminates external refresh controller or timer overhead in embedded systems with limited MCU resources
Byte-selectable writeReduces bus arbitration complexity and enables partial updates without full-word read-modify-write sequences
Sub-1µA standby currentExtends battery life in portable medical monitors and smart meters where memory must retain data for years
2.0V data retentionSupports seamless transition from main supply to backup battery during power failure without data loss
TTL-compatible I/ODirect interface with legacy 3.3V microcontrollers (e.g., Renesas RL78, SH-2A) without level translation

Applications

Industrial PLC Memory BufferMedical Patient Monitor Data Log

Use Scenario: Real-time logging of sensor waveforms and alarm timestamps during mains power interruption.

IC Role / Device Role / Timing Role: Non-volatile data buffer retaining critical patient history using battery backup.

Use Value: 2.0V data retention threshold ensures >72-hour hold-up time on coin-cell backup without refresh circuitry.

Use Scenario: Storing calibration coefficients and last-known vital signs in handheld diagnostic tools.

IC Role / Device Role / Timing Role: Low-leakage SRAM holding configuration data between power cycles.

Use Value: 1 µA typical standby current at 3.0V extends shelf life of sealed battery-powered units beyond 5 years.

Automotive Telematics Event RecorderSmart Meter Firmware Cache

Use Scenario: Capturing CAN bus fault logs and GPS coordinates during vehicle crash events.

IC Role / Device Role / Timing Role: High-speed write buffer capturing time-critical event data before main ECU shutdown.

Use Value: 55 ns access time enables reliable capture of 100+ bytes within 1 µs window after trigger detection.

Use Scenario: Caching firmware update payloads and metering registers during OTA upgrade cycles.

IC Role / Device Role / Timing Role: Temporary storage for encrypted firmware blocks prior to flash programming.

Use Value: Byte-selectable LB#/UB# control allows partial writes without disturbing adjacent register banks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-power SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY62128ELL-55ZSXIT55 ns access, 2.7–5.5V supply range, 44-pin TSOP (II), 1 µA ISB at 3.3VWider voltage range supports mixed 3.3V/5V systems but higher ISB at 2.7VSelect when system uses 5V peripherals or requires backward compatibility with legacy 5V designs
IS62WV25616BLL-55NLI55 ns access, 2.7–3.6V supply, 48-pin TSOP (I), 2 µA ISB at 3.0V48-pin footprint requires PCB redesign; slightly higher standby currentChoose only if board layout accommodates larger TSOP (I) pitch and higher leakage is acceptable

Compared with CY62128ELL-55ZSXIT and IS62WV25616BLL-55NLI, the R1LV0216BSB-5SI#B1 offers tighter 2.0V data retention and lower 1 µA standby current at 3.0V, making it optimal for ultra-low-power battery backup where voltage headroom is constrained.

Availability

R1LV0216BSB-5SI#B1 is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical patient monitor data logs, and automotive telematics event recorders requiring stable component supply across extended product lifecycles.

Supply support for R1LV0216BSB-5SI#B1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The R1LV0216BSB-5SI#B1 belongs to Renesas' Advanced LPSRAM product line, engineered specifically for battery-operated and low-voltage memory applications demanding zero-refresh operation and extended data retention under brown-out conditions.

FAQ

What is the minimum supply voltage required to retain data in R1LV0216BSB-5SI#B1?

The R1LV0216BSB-5SI#B1 guarantees data retention down to 2.0V VCC, provided CS# or both LB# and UB# are held at ≥ VCC − 0.2V while CS# ≤ 0.2V. This enables reliable hold-up during battery voltage sag or power-fail transitions without external supervision circuitry. The R1LV0216BSB-5SI#B1 maintains stored data at temperatures up to +85°C with ICCDR ≤ 10 µA under these conditions.

Does R1LV0216BSB-5SI#B1 require a clock or refresh signal?

No, the R1LV0216BSB-5SI#B1 is a true static RAM with no clock input and zero refresh requirement. Its 0.15µm CMOS/TFT cell design retains data indefinitely as long as VCC remains within specification and appropriate control signals (CS#, LB#, UB#) are asserted for standby. This eliminates timing-critical refresh overhead in resource-constrained microcontrollers. The R1LV0216BSB-5SI#B1 operates fully asynchronously using only address, data, and enable signals.

What is the function of LB# and UB# pins on R1LV0216BSB-5SI#B1?

LB# (Lower Byte Enable) and UB# (Upper Byte Enable) are active-low signals that independently gate write operations to DQ0–DQ7 and DQ8–DQ15 respectively. When LB# is low and UB# is high, only the lower byte is written; vice versa for upper byte. Both low enables full 16-bit word write. These pins allow precise byte-level memory updates without read-modify-write cycles. The R1LV0216BSB-5SI#B1 uses this scheme to minimize bus traffic in partial-register update scenarios.

Can R1LV0216BSB-5SI#B1 be used with 3.3V microcontrollers without level shifters?

Yes, the R1LV0216BSB-5SI#B1 features fully TTL-compatible inputs and outputs, with VIH = 2.2V min and VOL = 0.4V max at IOL = 2mA. It interfaces directly with standard 3.3V microcontrollers such as Renesas RL78/G13 or STMicro STM32F4 series without level translation. Input leakage is ≤1 µA and output drive strength meets TTL fan-out requirements. The R1LV0216BSB-5SI#B1 simplifies system design by eliminating external voltage translators in 3.3V-only systems.

What package type and dimensions does R1LV0216BSB-5SI#B1 use?

The R1LV0216BSB-5SI#B1 is packaged in a 44-pin plastic TSOP (II) with 400-mil body width, compliant with JEDEC MO-141BA. Pin pitch is 0.8 mm, overall dimensions are 18.4 mm × 10.16 mm × 1.2 mm (L × W × H). The package uses gull-wing leads suitable for standard reflow soldering profiles. This footprint matches industry-standard 44-pin SRAM layouts, enabling drop-in replacement in existing designs. The R1LV0216BSB-5SI#B1's TSOP (II) form factor ensures mechanical compatibility with automated assembly equipment.

R1LV0216BSB-5SI#B1 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM
Memory Size:
2Mbit
Memory Organization:
128K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
55ns
Access Time:
55 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

R1LV0216BSB-5SI#B1 FAQ

1.How can I place an order for R1LV0216BSB-5SI#B1 through Aetrix?

Please submit a Request for Quotation (RFQ) for R1LV0216BSB-5SI#B1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R1LV0216BSB-5SI#B1 reliable?

The price and inventory of R1LV0216BSB-5SI#B1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1LV0216BSB-5SI#B1 is usually 5 days.

3.What payment methods are accepted for R1LV0216BSB-5SI#B1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1LV0216BSB-5SI#B1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R1LV0216BSB-5SI#B1?

R1LV0216BSB-5SI#B1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R1LV0216BSB-5SI#B1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R1LV0216BSB-5SI#B1?

For technical support, including R1LV0216BSB-5SI#B1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1LV0216BSB-5SI#B1 requirements.

6.How does Aetrix verify that R1LV0216BSB-5SI#B1 is sourced from the original manufacturer or authorized distributors?

All R1LV0216BSB-5SI#B1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1LV0216BSB-5SI#B1 meets industry standards.

7.What is the process for return or replacement of R1LV0216BSB-5SI#B1?

All R1LV0216BSB-5SI#B1 units undergo pre-shipment inspection (PSI). If there is an issue with R1LV0216BSB-5SI#B1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R1LV0216BSB-5SI#B1 part is unused and in its original packaging.

Return procedure for R1LV0216BSB-5SI#B1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R1LV0216BSB-5SI#B1 Tags

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  • R1LV0216BSB-5SI#B1 PDF
  • R1LV0216BSB-5SI#B1 Datasheet
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