Renesas R1LV0216BSB-7SI#B0
- Part No.:
- R1LV0216BSB-7SI#B0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
R1LV0216BSB-7SI#B0.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:3,452
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Product details
Overview
R1LV0216BSB-7SI#B0 from Renesas Electronics is a 2Mb low-power static RAM organized as 131,072 × 16-bit, operating from a single 2.7–3.6V supply, with 70 ns access time and -40°C to +85°C industrial temperature range, packaged in 44-pin TSOP (II). It delivers ultra-low standby current (1 µA typical at 3.0V), requires no refresh or clocks, and supports byte-selectable writes for embedded memory expansion in battery-backed systems.
For engineers reviewing the R1LV0216BSB-7SI#B0 datasheet, R1LV0216BSB-7SI#B0 pinout, R1LV0216BSB-7SI#B0 application, or R1LV0216BSB-7SI#B0 equivalent, this page provides verified technical context, pin-level I/O roles, TTL-compatible interface behavior, byte-enable timing constraints, and validated alternatives for industrial SRAM replacement scenarios.
Technical Context
The R1LV0216BSB-7SI#B0 implements a fully asynchronous static RAM architecture with independent upper- and lower-byte enables (UB#, LB#), enabling partial-word writes without external logic. Its address buffer, data I/O buffers, and control input buffers are all TTL-compatible and powered by a single Vcc rail.
Operation relies on three active-low control signals-CS#, WE#, and OE#-with defined timing windows for read/write cycles, output enable/disable transitions, and chip deselect-to-high-Z delays. Data retention is guaranteed down to 2.0V with ≤10 µA current draw at +85°C, supporting robust battery backup functionality.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 2 Mbit (131,072 × 16-bit) - supports 16-bit data bus interfacing without glue logic |
| Access Time | 70 ns - defines maximum clock rate for synchronous controllers interfacing via wait-state logic |
| Supply Voltage | 2.7–3.6 V - compatible with 3.3V system rails and brown-out tolerant down to 2.0V for data retention |
| Standby Current | 1 µA typical at 3.0V/25°C - enables multi-year battery operation in always-on backup mode |
| Operating Temp | -40°C to +85°C - qualified for industrial-grade embedded control and automotive body electronics |
| I/O Interface | TTL-compatible inputs/outputs - eliminates level-shifter requirements when interfacing with legacy microcontrollers |
| Package | 44-pin TSOP (II), 400-mil - surface-mount compatible with standard reflow profiles and board space-constrained designs |
Pinout & Package
44-pin plastic TSOP (II), normal-bend type (package code PTSB0044GD-B), 400-mil width, JEDEC-standard footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Vcc | Power supply | Single 2.7–3.6V supply rail; decoupling required within 10 mm of pin |
| Vss | Ground | Primary reference for all I/O and internal logic; must be low-impedance connection |
| A0–A16 | Address inputs | 17-bit address bus supporting full 131k-word addressing; latched on CS# assertion |
| DQ0–DQ15 | Data I/O | Bidirectional 16-bit data bus; three-state controlled by CS#, OE#, and byte enables |
| CS# | Chip select | Active-low global enable; places device in standby when high, enables access when low |
| WE# | Write enable | Active-low write strobe; initiates write cycle when low with valid CS# and LB#/UB# |
| OE# | Output enable | Active-low output gate; prevents bus contention during shared-memory multiplexing |
| LB#, UB# | Byte enables | Independent active-low controls for lower (DQ0–7) and upper (DQ8–15) byte writes |
| NC | No connection | Two pins (pins 23 and 44) are unconnected; must remain floating or grounded per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| No refresh required | Eliminates DRAM controller overhead and timing-critical refresh circuitry in MCU-based systems |
| 1 µA standby current | Enables >10-year battery life in non-volatile memory retention applications using coin-cell sources |
| Byte-selectable write | Reduces bus traffic and power consumption by allowing 8-bit updates without disturbing adjacent bytes |
| TTL-compatible I/O | Direct interface with legacy 5V-tolerant microcontrollers and FPGAs without level translation |
| Common data I/O | Simplifies PCB routing and reduces pin count versus separate input/output bus architectures |
Applications
| Industrial PLC Memory Buffer | Medical Device Data Logger |
|---|---|
Use Scenario: Real-time acquisition of sensor readings in programmable logic controllers with periodic flash backup. IC Role / Device Role / Timing Role: Primary working memory for instruction execution and I/O image storage; accessed asynchronously during scan cycles. Use Value: 70 ns access time ensures deterministic response within 100 µs scan intervals; low standby current preserves data during mains failure. |
Use Scenario: Continuous ECG waveform buffering in portable diagnostic equipment with battery fallback. IC Role / Device Role / Timing Role: High-reliability temporary storage for raw analog samples prior to compression and wireless transmission. Use Value: -40°C to +85°C rating supports clinical use across ambient conditions; 2.0V data retention enables seamless transition to backup power. |
| Automotive Body Control Module | Point-of-Sale Terminal EEPROM Cache |
Use Scenario: Storing configuration parameters and fault codes in door module ECUs with infrequent write cycles. IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding calibration data and runtime counters; updated only on ignition-off events. Use Value: Byte-write capability minimizes wear on downstream flash; TSOP package withstands automotive thermal cycling per AEC-Q200. |
Use Scenario: Accelerating transaction logging in retail terminals where EEPROM endurance limits frequent writes. IC Role / Device Role / Timing Role: Write-through cache between processor and serial EEPROM, absorbing burst writes before committing to flash. Use Value: No-refresh operation avoids latency spikes during high-throughput receipt printing; TTL compatibility matches legacy 8051-based controllers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-power SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV25616AL-70TQLI | 70 ns access, same 256K×16 organization, but 3.3V-only (3.135–3.465V); higher ISB (5 µA typical) | Requires tighter Vcc regulation; less suitable for wide-input battery systems | Preferred where strict 3.3V rail stability exists and board layout favors TQFP over TSOP |
| AS6C4008-70PCN | 70 ns access, 256K×16, 2.7–3.6V supply, but 55°C max operating temp (commercial grade) | Not rated for industrial temperature range; unsuitable for under-hood or factory-floor deployment | Valid cost-optimized option for consumer-grade devices with ambient-controlled environments |
Compared with R1LV0216BSB-7SI#B0, the IS61LV25616AL-70TQLI offers better packaging flexibility but narrower voltage tolerance, while the AS6C4008-70PCN sacrifices industrial temperature qualification for lower unit cost-making R1LV0216BSB-7SI#B0 the optimal choice for ruggedized, battery-backed embedded memory requiring guaranteed -40°C operation and sub-µA retention.
Availability
R1LV0216BSB-7SI#B0 is available at Aetrix Electronics and suitable for industrial automation, medical data logging, automotive body electronics, and point-of-sale terminal design requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R1LV0216BSB-7SI#B0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The R1LV0216BSB series was designed as an advanced LPSRAM family targeting low-voltage, low-power, and high-reliability memory applications in battery-operated and safety-critical embedded systems.
FAQ
What is the minimum supply voltage required to retain data in R1LV0216BSB-7SI#B0?
The R1LV0216BSB-7SI#B0 guarantees data retention down to 2.0V, as specified in its Low Vcc Data Retention Characteristics table. At this voltage, the device draws ≤10 µA at +85°C while maintaining stored contents-enabling reliable operation during brown-out or battery depletion events. This specification applies only when CS# or LB#/UB# are held in the appropriate high-impedance control state per the retention waveform diagram.
Does R1LV0216BSB-7SI#B0 require external refresh circuitry?
No, the R1LV0216BSB-7SI#B0 is a true static RAM and requires no refresh cycles. Its CMOS latch-based memory cells retain data indefinitely as long as power is applied and control signals meet setup/hold timing. This eliminates refresh overhead in microcontroller firmware and simplifies system-level timing design compared to DRAM or pseudo-SRAM solutions.
Can R1LV0216BSB-7SI#B0 interface directly with a 5V microcontroller?
Yes, the R1LV0216BSB-7SI#B0 features TTL-compatible inputs (VIH = 2.2V min, VIL = 0.6V max) and outputs (VOH ≥ 2.4V at -0.5mA), allowing direct connection to 5V-tolerant GPIOs of legacy MCUs such as the 8051 or PIC18F series. However, Vcc must remain within 2.7–3.6V; level shifters are unnecessary for signal integrity but not for supply voltage translation.
What is the significance of LB# and UB# pins on R1LV0216BSB-7SI#B0?
The LB# (Lower Byte Enable) and UB# (Upper Byte Enable) pins allow independent 8-bit write operations to DQ0–DQ7 or DQ8–DQ15 without affecting the other byte. This enables efficient partial-word updates-critical for reducing bus traffic, minimizing power consumption, and avoiding read-modify-write sequences in systems with mixed 8-bit and 16-bit peripherals.
Is R1LV0216BSB-7SI#B0 RoHS compliant and lead-free?
Yes, the R1LV0216BSB-7SI#B0 is RoHS compliant and lead-free, as confirmed by Renesas Electronics' environmental compliance documentation and material declarations. The TSOP (II) package uses matte tin terminations and meets EU Directive 2011/65/EU requirements, supporting environmentally conscious manufacturing and end-of-life recycling protocols.
R1LV0216BSB-7SI#B0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM
- Memory Size:
- 2Mbit
- Memory Organization:
- 128K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
R1LV0216BSB-7SI#B0 FAQ
1.How can I place an order for R1LV0216BSB-7SI#B0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R1LV0216BSB-7SI#B0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R1LV0216BSB-7SI#B0 reliable?
The price and inventory of R1LV0216BSB-7SI#B0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1LV0216BSB-7SI#B0 is usually 5 days.
3.What payment methods are accepted for R1LV0216BSB-7SI#B0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1LV0216BSB-7SI#B0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R1LV0216BSB-7SI#B0?
R1LV0216BSB-7SI#B0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R1LV0216BSB-7SI#B0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R1LV0216BSB-7SI#B0?
For technical support, including R1LV0216BSB-7SI#B0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1LV0216BSB-7SI#B0 requirements.
6.How does Aetrix verify that R1LV0216BSB-7SI#B0 is sourced from the original manufacturer or authorized distributors?
All R1LV0216BSB-7SI#B0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1LV0216BSB-7SI#B0 meets industry standards.
7.What is the process for return or replacement of R1LV0216BSB-7SI#B0?
All R1LV0216BSB-7SI#B0 units undergo pre-shipment inspection (PSI). If there is an issue with R1LV0216BSB-7SI#B0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R1LV0216BSB-7SI#B0 part is unused and in its original packaging.
Return procedure for R1LV0216BSB-7SI#B0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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