Renesas R1LV0414DSB-7LI#B0
- Part No.:
- R1LV0414DSB-7LI#B0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
R1LV0414DSB-7LI#B0.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:474
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R1LV0414DSB-7LI#B0 from Renesas Electronics is a 4-Mbit static RAM organized as 256-kword × 16-bit, fabricated in 0.15 µm CMOS/TFT process, operating from a single 3.0 V supply (2.7–3.6 V), with 70 ns max access time and 3 µW typical standby power dissipation - designed for low-power battery-backed memory applications in industrial and communications equipment.
For engineers reviewing the R1LV0414DSB-7LI#B0 datasheet, R1LV0414DSB-7LI#B0 pinout, R1LV0414DSB-7LI#B0 application, or R1LV0414DSB-7LI#B0 equivalent, key selection criteria include TSOP II package compatibility, byte-selectable 16-bit I/O interface, −40°C to +85°C industrial temperature range, and low-voltage data retention down to 2.0 V.
Technical Context
This SRAM implements asynchronous operation with independent upper/lower byte control via UB# and LB# pins, enabling partial-word writes without disturbing adjacent bytes. Its architecture supports common I/O with three-state outputs, chip select (CS#), output enable (OE#), and write enable (WE#) for standard parallel memory interfacing.
The device features dual standby modes: one activated by CS# high, another triggered by simultaneous LB# and UB# high with CS# low - both achieving sub-10 µA current at +25°C. Data retention remains valid at VCC ≥ 2.0 V across the full operating temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256 kwords × 16 bits) - supports 16-bit microprocessor/microcontroller data bus interfaces without external multiplexing. |
| Access Time | 70 ns (max) - defines minimum read cycle timing for synchronous system integration at up to ~14 MHz burst rate. |
| Supply Voltage | 2.7 V to 3.6 V - compatible with 3.3 V logic families and tolerant of brown-out conditions during battery backup. |
| Standby Current | 10 µA (typ, +25°C) - enables multi-year battery life in always-on backup memory applications. |
| Data Retention VCC | 2.0 V min - guarantees nonvolatile data hold during deep sleep or power-fail transitions without external capacitor hold-up. |
| Operating Temperature | −40°C to +85°C - qualified for industrial-grade embedded systems including base stations and programmable logic controllers. |
| Package | 44-pin TSOP II (400-mil) - surface-mount footprint compatible with legacy PCB layouts and automated assembly processes. |
Pinout & Package
44-pin plastic TSOP II (400-mil) package with standard JEDEC-compliant lead pitch and body dimensions; suitable for reflow soldering and high-density board layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address input | 18-bit address bus supporting full 256-kword decoding; no internal address latching required. |
| I/O0–I/O7 | Data I/O (lower byte) | Bi-directional 8-bit data path enabled only when LB# = low and CS# = low. |
| I/O8–I/O15 | Data I/O (upper byte) | Bi-directional 8-bit data path enabled only when UB# = low and CS# = low. |
| CS# | Chip select | Active-low global enable; places device in standby when high, overriding all other controls. |
| OE# | Output enable | Active-low read gate; controls output drivers independently of CS# for bus sharing. |
| WE# | Write enable | Active-low write strobe; initiates write cycles when CS# and LB#/UB# are also asserted. |
| UB#, LB# | Byte select | Independent active-low controls for upper/lower byte masking during writes or reads. |
| VCC | Power supply | Single 3.3 V supply pin; decoupling recommended within 10 mm per datasheet layout guidelines. |
| VSS | Ground | Dedicated ground reference; multiple VSS pins distributed to minimize switching noise. |
| NC | No connection | Pin 44 is unconnected; must remain floating - not to be tied to VCC, VSS, or signal lines. |
Key Features
| Feature | Design Value |
|---|---|
| Single 3.0 V supply operation | Eliminates need for dual-voltage regulators or level shifters in 3.3 V systems, reducing BOM count and board area. |
| Byte-selectable 16-bit I/O | Enables efficient 8-bit or 16-bit data transfers without external glue logic or data bus multiplexing. |
| Sub-10 µA standby current at +25°C | Extends battery life in uninterruptible memory backup applications beyond 5 years under typical usage. |
| 2.0 V data retention threshold | Permits seamless transition to backup power sources (e.g., coin cell or supercapacitor) without data loss. |
| Industrial temperature range (−40°C to +85°C) | Validated for deployment in harsh environments including factory automation and outdoor telecom infrastructure. |
Applications
| Industrial PLC Data Buffer | Telecom Baseband Memory |
|---|---|
Use Scenario: Real-time I/O status logging and configuration storage in programmable logic controllers during mains power interruption. IC Role / Device Role / Timing Role: Asynchronous parallel SRAM providing nonvolatile shadow memory with fast random-access read/write for runtime variables. Use Value: Enables deterministic <70 ns register updates and guaranteed data retention at 2.0 V, eliminating need for EEPROM wear-leveling or flash programming delays. |
Use Scenario: Temporary frame buffering in 3G/4G baseband processing units where low-latency access and power efficiency are critical. IC Role / Device Role / Timing Role: High-speed 16-bit data buffer interfaced directly to DSP or FPGA memory controllers using standard CS#/OE#/WE# protocol. Use Value: Delivers consistent 70 ns access across temperature and voltage, supporting real-time signal processing pipelines without wait states. |
| Medical Diagnostic Equipment Cache | Point-of-Sale Terminal Backup RAM |
Use Scenario: Storing calibration coefficients and last-known sensor readings in portable ultrasound or ECG devices during battery swaps. IC Role / Device Role / Timing Role: Low-power static RAM maintaining volatile configuration data during brief power gaps between battery modules. Use Value: Achieves 10 µA standby current at +25°C and retains data down to 2.0 V, ensuring zero data loss during hot-swap operations. |
Use Scenario: Preserving transaction logs and session state in retail POS terminals powered by backup batteries during AC outages. IC Role / Device Role / Timing Role: Byte-addressable SRAM used for atomic write operations on financial records with LB#/UB# granularity. Use Value: Supports reliable partial-word writes without read-modify-write overhead, reducing EEPROM endurance stress and improving transaction throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV25616AL-70TQLI | Same density and 16-bit bus, but uses 48-pin TSOPII; 70 ns access, 3.3 V only; no explicit low-VCC retention spec. | Lacks documented 2.0 V data retention - unsuitable for battery-fail scenarios requiring extended hold-up. | Select when board layout accommodates 48-pin footprint and retention voltage margin is not required. |
| AS6C4008-70PCN | 4-Mbit × 8-bit organization; 44-pin SOJ; 70 ns access; 2.7–3.6 V; 1 µA standby (typ); no byte-select pins. | Fixed 8-bit bus width requires two devices for 16-bit interface; no UB#/LB# - limits partial-word write flexibility. | Choose for cost-sensitive 8-bit systems where byte masking is unnecessary and SOJ is acceptable. |
Compared with IS61LV25616AL-70TQLI and AS6C4008-70PCN, R1LV0414DSB-7LI#B0 uniquely combines 44-pin TSOP II compatibility, true 16-bit byte-select capability, and verified 2.0 V data retention - making it optimal for space-constrained industrial designs requiring robust battery-backup integrity.
Availability
R1LV0414DSB-7LI#B0 is available at Aetrix Electronics and suitable for industrial PLCs, telecom baseband units, and medical diagnostic equipment requiring stable component supply, long-lifecycle support, and guaranteed TSOP II packaging consistency.
Supply support for R1LV0414DSB-7LI#B0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog and power devices, and memory solutions for industrial, automotive, and communications markets.
The R1LV0414D Series was developed to deliver high-density, low-power asynchronous SRAM for battery-backed applications in space- and energy-constrained embedded systems.
FAQ
What is the maximum operating frequency supported by R1LV0414DSB-7LI#B0?
R1LV0414DSB-7LI#B0 does not operate synchronously and has no clock input; its performance is defined by access and cycle times. With a 70 ns maximum access time, it supports effective burst read/write rates up to approximately 14.3 MHz in systems with zero wait-state controllers. Actual throughput depends on bus protocol overhead and controller timing margins.
Does R1LV0414DSB-7LI#B0 support true 16-bit parallel operation?
Yes, R1LV0414DSB-7LI#B0 supports full 16-bit parallel operation via I/O0–I/O15 pins. It also allows independent 8-bit access using LB# and UB# controls - enabling efficient byte-level writes without affecting adjacent data, which is essential for compact firmware variable storage.
Can R1LV0414DSB-7LI#B0 retain data during complete power loss?
No - R1LV0414DSB-7LI#B0 is a volatile SRAM and requires continuous power to retain data. However, it maintains data integrity down to VCC = 2.0 V, allowing integration with backup sources like supercapacitors or coin cells to bridge short power interruptions without data loss.
Is R1LV0414DSB-7LI#B0 RoHS compliant?
Yes, R1LV0414DSB-7LI#B0 is RoHS compliant per EU Directive 2011/65/EU. Renesas confirms lead-free TSOP II packaging and halogen-free molding compound in accordance with industry-standard environmental specifications published in the device's official compliance documentation.
What is the meaning of "#B0" suffix in R1LV0414DSB-7LI#B0?
The "#B0" suffix in R1LV0414DSB-7LI#B0 denotes a specific tape-and-reel packaging variant per Renesas ordering conventions: "B0" indicates 1,000-unit reels with standard carrier tape width and orientation, optimized for SMT placement equipment compatibility and traceable lot control.
R1LV0414DSB-7LI#B0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
R1LV0414DSB-7LI#B0 FAQ
1.How can I place an order for R1LV0414DSB-7LI#B0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R1LV0414DSB-7LI#B0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R1LV0414DSB-7LI#B0 reliable?
The price and inventory of R1LV0414DSB-7LI#B0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1LV0414DSB-7LI#B0 is usually 5 days.
3.What payment methods are accepted for R1LV0414DSB-7LI#B0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1LV0414DSB-7LI#B0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R1LV0414DSB-7LI#B0?
R1LV0414DSB-7LI#B0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R1LV0414DSB-7LI#B0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R1LV0414DSB-7LI#B0?
For technical support, including R1LV0414DSB-7LI#B0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1LV0414DSB-7LI#B0 requirements.
6.How does Aetrix verify that R1LV0414DSB-7LI#B0 is sourced from the original manufacturer or authorized distributors?
All R1LV0414DSB-7LI#B0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1LV0414DSB-7LI#B0 meets industry standards.
7.What is the process for return or replacement of R1LV0414DSB-7LI#B0?
All R1LV0414DSB-7LI#B0 units undergo pre-shipment inspection (PSI). If there is an issue with R1LV0414DSB-7LI#B0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R1LV0414DSB-7LI#B0 part is unused and in its original packaging.
Return procedure for R1LV0414DSB-7LI#B0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R1LV0414DSB-7LI#B0 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

