Renesas R1LV0416DBG-7LI#B0
- Part No.:
- R1LV0416DBG-7LI#B0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
R1LV0416DBG-7LI#B0.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:817
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Product details
Overview
R1LV0416DBG-7LI#B0 from Renesas Electronics is a 4-Mbit static RAM organized as 256-kword × 16-bit, fabricated in 0.15 µm CMOS/TFT process. It operates from a single 3.0 V supply (2.7–3.6 V), delivers 70 ns max access time, consumes only 10 µA typical standby current at +25°C, and supports battery backup via dual chip select (CS1#, CS2) - making it suitable for portable instrumentation and industrial data loggers requiring nonvolatile data retention during power loss.
For engineers reviewing the R1LV0416DBG-7LI#B0 datasheet, R1LV0416DBG-7LI#B0 pinout, R1LV0416DBG-7LI#B0 application, or R1LV0416DBG-7LI#B0 equivalent, key selection criteria include its 48-ball fine-pitch CSP package (PTBG0048HB-A), byte-selectable I/O (UB#/LB#), three-state outputs, and low-voltage data retention down to 2.0 V.
Technical Context
This SRAM implements asynchronous parallel interface logic with independent upper/lower byte control, enabling partial-word writes without disturbing adjacent bytes. Its dual chip select architecture allows seamless integration into battery-backed memory subsystems where CS2 activation triggers ultra-low-power retention mode.
The device uses address latching and output enable (OE#) timing to support deterministic read cycles with tOE ≤ 40 ns, and write cycles governed by overlapping CS1#, WE#, and LB#/UB# assertions - all validated across −40°C to +85°C ambient temperature range under 2.7–3.6 V supply.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 4 Mbit (256 kwords × 16 bits) - provides compact 16-bit data bus interface with minimal footprint |
| Access time | 70 ns max - defines worst-case latency from address valid to stable data output |
| Supply voltage | 2.7 V to 3.6 V - enables direct compatibility with 3.3 V logic systems and brown-out tolerant operation |
| Standby current | 10 µA typ at +25°C - ensures multi-year battery life in always-on backup applications |
| Data retention voltage | 2.0 V min - guarantees memory state preservation during deep brown-out or battery sag |
| Operating temperature | −40°C to +85°C - qualified for industrial-grade embedded control and telemetry environments |
| Package type | 48-ball fine-pitch BGA (0.75 mm pitch, PTBG0048HB-A) - supports high-density PCB layouts with thermal and electrical performance advantages over TSOP |
Pinout & Package
Package: 48-ball fine-pitch ball grid array (CSP), 0.75 mm ball pitch, PTBG0048HB-A footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address input | 18-bit address bus supporting full 256-kword addressing space |
| I/O0–I/O15 | Data input/output | Bi-directional 16-bit data bus with three-state output control |
| CS1#, CS2 | Chip select inputs | CS1# enables normal operation; CS2 activates ultra-low-power data retention mode |
| OE#, WE# | Output enable / Write enable | Asynchronous control of read/write direction and output driver state |
| UB#, LB# | Upper/lower byte select | Enables byte-granularity writes to I/O8–I/O15 or I/O0–I/O7 independently |
| VCC, VSS | Power supply / Ground | Single 3.3 V supply domain; decoupling required per JEDEC BGA guidelines |
| NC | No connection | Unbonded pads - must be left floating or grounded per layout best practice |
Key Features
| Feature | Design Value |
|---|---|
| Battery backup support | Dual chip select (CS1#, CS2) enables automatic transition to <10 µA retention mode without external circuitry |
| Byte-selectable I/O | Independent UB# and LB# controls allow 8-bit writes to upper or lower half without read-modify-write overhead |
| Low-voltage data retention | Maintains stored data down to VCC = 2.0 V, critical for systems with weak or aging backup batteries |
| Industrial temperature range | Guaranteed operation from −40°C to +85°C supports deployment in uncontrolled environmental enclosures |
| Fine-pitch CSP packaging | 48-ball 0.75 mm pitch BGA reduces board area by ~40% vs. 44-pin TSOP while improving thermal dissipation |
Applications
| Portable Data Logger | Industrial PLC Memory Buffer |
|---|---|
Use Scenario: Battery-powered field recorder capturing sensor readings at 10 Hz for 72 hours without host CPU intervention. IC Role / Device Role / Timing Role: Primary nonvolatile buffer holding timestamped analog/digital samples during main power outage. Use Value: 2.0 V data retention threshold and 10 µA standby current extend usable battery life beyond 5 years in sleep mode. | Use Scenario: Real-time control unit storing I/O state snapshots and firmware update staging data across power cycles. IC Role / Device Role / Timing Role: High-speed scratchpad memory interfacing directly to microcontroller's 16-bit EBI bus. Use Value: 70 ns access time and byte-select capability reduce interrupt latency and eliminate software overhead for partial register updates. |
| Medical Diagnostic Handheld | Automotive Telematics Black Box |
Use Scenario: Portable ultrasound device storing frame buffers and calibration coefficients between clinical sessions. IC Role / Device Role / Timing Role: Low-power SRAM backing up volatile configuration and image metadata during battery swaps. Use Value: Dual CS architecture allows seamless handoff to backup power without CPU involvement or timing-critical firmware sequences. | Use Scenario: Crash-data recorder capturing CAN bus messages and sensor streams during vehicle impact events. IC Role / Device Role / Timing Role: Fault-tolerant memory staging raw event data prior to EEPROM commit after safe shutdown detection. Use Value: −40°C to +85°C rating and robust 0.15 µm process ensure reliable operation in under-hood thermal transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV25616AL-7TLI | 512-kword × 16-bit (8 Mbit), 70 ns access, 44-pin TSOP-II package | Larger capacity but larger footprint; no battery backup mode or dual CS | Choose when higher density is needed and board space permits TSOP; not drop-in due to pinout and feature mismatch |
| AS6C4008-70ZIN | 256-kword × 16-bit (4 Mbit), 70 ns access, 48-ball CSP, single CS | Same density and package, but lacks CS2-driven retention mode and byte-select flexibility | Acceptable for cost-sensitive designs where battery backup is handled externally; requires additional logic for byte masking |
Compared with IS61LV25616AL-7TLI and AS6C4008-70ZIN, the R1LV0416DBG-7LI#B0 uniquely integrates dual chip select for autonomous low-power retention and hardware byte enable - reducing system-level complexity and power management firmware burden in battery-critical applications.
Availability
R1LV0416DBG-7LI#B0 is available at Aetrix Electronics and suitable for portable instrumentation, industrial data loggers, medical handhelds, and automotive black box recorders requiring stable component supply and long-term lifecycle support.
Supply support for R1LV0416DBG-7LI#B0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The R1LV0416D Series was designed specifically for low-power, battery-backed memory applications demanding industrial temperature resilience, byte-select efficiency, and ultra-low standby current - targeting portable and mission-critical embedded systems.
FAQ
What is the maximum operating frequency supported by the R1LV0416DBG-7LI#B0?
The R1LV0416DBG-7LI#B0 is an asynchronous SRAM with no internal clock; its speed is defined by access and cycle times rather than frequency. With a 70 ns maximum access time (tAA), it supports effective bus rates up to approximately 14.3 MHz in ideal conditions. Actual throughput depends on system-level timing margins, address/data setup/hold requirements, and controller interface design - all specified in the AC Characteristics table on page 7 of the datasheet.
Does the R1LV0416DBG-7LI#B0 support true 16-bit wide data transfers?
Yes, the R1LV0416DBG-7LI#B0 supports full 16-bit parallel data transfers via its I/O0–I/O15 pins. The device includes independent upper byte (UB#) and lower byte (LB#) controls, allowing simultaneous or selective access to either 8-bit half without requiring read-modify-write sequences. This enables efficient handling of mixed-width data structures in microcontroller-based systems using the R1LV0416DBG-7LI#B0 as primary working memory.
How does the dual chip select (CS1# and CS2) function in the R1LV0416DBG-7LI#B0?
In the R1LV0416DBG-7LI#B0, CS1# enables normal active operation (read/write), while CS2 serves as the dedicated battery backup trigger: when CS2 is asserted low (VIL), the device enters ultra-low-power data retention mode drawing only 10 µA typical current. Both signals can be used together for hierarchical memory control - for example, CS1# gated by processor enable and CS2 tied to backup power rail - enabling fully autonomous retention during main power failure without firmware intervention.
What is the minimum supply voltage required to retain data in the R1LV0416DBG-7LI#B0?
The R1LV0416DBG-7LI#B0 guarantees data retention down to VCC = 2.0 V, as specified in the Low VCC Data Retention Characteristics table (page 13). This applies across the full industrial temperature range (−40°C to +85°C) when entering retention mode via CS2 assertion or other qualifying conditions (e.g., LB#/UB# high with CS2 high and CS1# low). At 2.0 V, typical retention current is 10 µA at +25°C, increasing slightly at elevated temperatures.
Is the R1LV0416DBG-7LI#B0 RoHS compliant and lead-free?
Yes, the R1LV0416DBG-7LI#B0 is RoHS compliant and lead-free. Per Renesas documentation and product marking conventions, the "#B0" suffix denotes lead-free, halogen-free packaging meeting EU RoHS Directive 2011/65/EU requirements. The 48-ball CSP uses matte tin surface finish on solder balls and complies with JEDEC J-STD-020 moisture sensitivity level (MSL) 3 handling guidelines.
R1LV0416DBG-7LI#B0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (7.5x8.5)
R1LV0416DBG-7LI#B0 FAQ
1.How can I place an order for R1LV0416DBG-7LI#B0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R1LV0416DBG-7LI#B0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R1LV0416DBG-7LI#B0 reliable?
The price and inventory of R1LV0416DBG-7LI#B0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1LV0416DBG-7LI#B0 is usually 5 days.
3.What payment methods are accepted for R1LV0416DBG-7LI#B0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1LV0416DBG-7LI#B0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R1LV0416DBG-7LI#B0?
R1LV0416DBG-7LI#B0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R1LV0416DBG-7LI#B0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R1LV0416DBG-7LI#B0?
For technical support, including R1LV0416DBG-7LI#B0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1LV0416DBG-7LI#B0 requirements.
6.How does Aetrix verify that R1LV0416DBG-7LI#B0 is sourced from the original manufacturer or authorized distributors?
All R1LV0416DBG-7LI#B0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1LV0416DBG-7LI#B0 meets industry standards.
7.What is the process for return or replacement of R1LV0416DBG-7LI#B0?
All R1LV0416DBG-7LI#B0 units undergo pre-shipment inspection (PSI). If there is an issue with R1LV0416DBG-7LI#B0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R1LV0416DBG-7LI#B0 part is unused and in its original packaging.
Return procedure for R1LV0416DBG-7LI#B0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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