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Renesas R1LV0416DBG-7LI#B0

Part No.:
R1LV0416DBG-7LI#B0
Manufacturer:
Renesas
Category:
Memory
Package:
48-TFBGA
Datasheet:
AetrixR1LV0416DBG-7LI#B0.pdf
Description:
IC SRAM 4MBIT PARALLEL 48TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:817

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Product details

Overview

R1LV0416DBG-7LI#B0 from Renesas Electronics is a 4-Mbit static RAM organized as 256-kword × 16-bit, fabricated in 0.15 µm CMOS/TFT process. It operates from a single 3.0 V supply (2.7–3.6 V), delivers 70 ns max access time, consumes only 10 µA typical standby current at +25°C, and supports battery backup via dual chip select (CS1#, CS2) - making it suitable for portable instrumentation and industrial data loggers requiring nonvolatile data retention during power loss.

For engineers reviewing the R1LV0416DBG-7LI#B0 datasheet, R1LV0416DBG-7LI#B0 pinout, R1LV0416DBG-7LI#B0 application, or R1LV0416DBG-7LI#B0 equivalent, key selection criteria include its 48-ball fine-pitch CSP package (PTBG0048HB-A), byte-selectable I/O (UB#/LB#), three-state outputs, and low-voltage data retention down to 2.0 V.

Technical Context

This SRAM implements asynchronous parallel interface logic with independent upper/lower byte control, enabling partial-word writes without disturbing adjacent bytes. Its dual chip select architecture allows seamless integration into battery-backed memory subsystems where CS2 activation triggers ultra-low-power retention mode.

The device uses address latching and output enable (OE#) timing to support deterministic read cycles with tOE ≤ 40 ns, and write cycles governed by overlapping CS1#, WE#, and LB#/UB# assertions - all validated across −40°C to +85°C ambient temperature range under 2.7–3.6 V supply.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density4 Mbit (256 kwords × 16 bits) - provides compact 16-bit data bus interface with minimal footprint
Access time70 ns max - defines worst-case latency from address valid to stable data output
Supply voltage2.7 V to 3.6 V - enables direct compatibility with 3.3 V logic systems and brown-out tolerant operation
Standby current10 µA typ at +25°C - ensures multi-year battery life in always-on backup applications
Data retention voltage2.0 V min - guarantees memory state preservation during deep brown-out or battery sag
Operating temperature−40°C to +85°C - qualified for industrial-grade embedded control and telemetry environments
Package type48-ball fine-pitch BGA (0.75 mm pitch, PTBG0048HB-A) - supports high-density PCB layouts with thermal and electrical performance advantages over TSOP

Pinout & Package

Package: 48-ball fine-pitch ball grid array (CSP), 0.75 mm ball pitch, PTBG0048HB-A footprint.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address input18-bit address bus supporting full 256-kword addressing space
I/O0–I/O15Data input/outputBi-directional 16-bit data bus with three-state output control
CS1#, CS2Chip select inputsCS1# enables normal operation; CS2 activates ultra-low-power data retention mode
OE#, WE#Output enable / Write enableAsynchronous control of read/write direction and output driver state
UB#, LB#Upper/lower byte selectEnables byte-granularity writes to I/O8–I/O15 or I/O0–I/O7 independently
VCC, VSSPower supply / GroundSingle 3.3 V supply domain; decoupling required per JEDEC BGA guidelines
NCNo connectionUnbonded pads - must be left floating or grounded per layout best practice

Key Features

FeatureDesign Value
Battery backup supportDual chip select (CS1#, CS2) enables automatic transition to <10 µA retention mode without external circuitry
Byte-selectable I/OIndependent UB# and LB# controls allow 8-bit writes to upper or lower half without read-modify-write overhead
Low-voltage data retentionMaintains stored data down to VCC = 2.0 V, critical for systems with weak or aging backup batteries
Industrial temperature rangeGuaranteed operation from −40°C to +85°C supports deployment in uncontrolled environmental enclosures
Fine-pitch CSP packaging48-ball 0.75 mm pitch BGA reduces board area by ~40% vs. 44-pin TSOP while improving thermal dissipation

Applications

Portable Data LoggerIndustrial PLC Memory Buffer

Use Scenario: Battery-powered field recorder capturing sensor readings at 10 Hz for 72 hours without host CPU intervention.

IC Role / Device Role / Timing Role: Primary nonvolatile buffer holding timestamped analog/digital samples during main power outage.

Use Value: 2.0 V data retention threshold and 10 µA standby current extend usable battery life beyond 5 years in sleep mode.

Use Scenario: Real-time control unit storing I/O state snapshots and firmware update staging data across power cycles.

IC Role / Device Role / Timing Role: High-speed scratchpad memory interfacing directly to microcontroller's 16-bit EBI bus.

Use Value: 70 ns access time and byte-select capability reduce interrupt latency and eliminate software overhead for partial register updates.

Medical Diagnostic HandheldAutomotive Telematics Black Box

Use Scenario: Portable ultrasound device storing frame buffers and calibration coefficients between clinical sessions.

IC Role / Device Role / Timing Role: Low-power SRAM backing up volatile configuration and image metadata during battery swaps.

Use Value: Dual CS architecture allows seamless handoff to backup power without CPU involvement or timing-critical firmware sequences.

Use Scenario: Crash-data recorder capturing CAN bus messages and sensor streams during vehicle impact events.

IC Role / Device Role / Timing Role: Fault-tolerant memory staging raw event data prior to EEPROM commit after safe shutdown detection.

Use Value: −40°C to +85°C rating and robust 0.15 µm process ensure reliable operation in under-hood thermal transients.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61LV25616AL-7TLI512-kword × 16-bit (8 Mbit), 70 ns access, 44-pin TSOP-II packageLarger capacity but larger footprint; no battery backup mode or dual CSChoose when higher density is needed and board space permits TSOP; not drop-in due to pinout and feature mismatch
AS6C4008-70ZIN256-kword × 16-bit (4 Mbit), 70 ns access, 48-ball CSP, single CSSame density and package, but lacks CS2-driven retention mode and byte-select flexibilityAcceptable for cost-sensitive designs where battery backup is handled externally; requires additional logic for byte masking

Compared with IS61LV25616AL-7TLI and AS6C4008-70ZIN, the R1LV0416DBG-7LI#B0 uniquely integrates dual chip select for autonomous low-power retention and hardware byte enable - reducing system-level complexity and power management firmware burden in battery-critical applications.

Availability

R1LV0416DBG-7LI#B0 is available at Aetrix Electronics and suitable for portable instrumentation, industrial data loggers, medical handhelds, and automotive black box recorders requiring stable component supply and long-term lifecycle support.

Supply support for R1LV0416DBG-7LI#B0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.

The R1LV0416D Series was designed specifically for low-power, battery-backed memory applications demanding industrial temperature resilience, byte-select efficiency, and ultra-low standby current - targeting portable and mission-critical embedded systems.

FAQ

What is the maximum operating frequency supported by the R1LV0416DBG-7LI#B0?

The R1LV0416DBG-7LI#B0 is an asynchronous SRAM with no internal clock; its speed is defined by access and cycle times rather than frequency. With a 70 ns maximum access time (tAA), it supports effective bus rates up to approximately 14.3 MHz in ideal conditions. Actual throughput depends on system-level timing margins, address/data setup/hold requirements, and controller interface design - all specified in the AC Characteristics table on page 7 of the datasheet.

Does the R1LV0416DBG-7LI#B0 support true 16-bit wide data transfers?

Yes, the R1LV0416DBG-7LI#B0 supports full 16-bit parallel data transfers via its I/O0–I/O15 pins. The device includes independent upper byte (UB#) and lower byte (LB#) controls, allowing simultaneous or selective access to either 8-bit half without requiring read-modify-write sequences. This enables efficient handling of mixed-width data structures in microcontroller-based systems using the R1LV0416DBG-7LI#B0 as primary working memory.

How does the dual chip select (CS1# and CS2) function in the R1LV0416DBG-7LI#B0?

In the R1LV0416DBG-7LI#B0, CS1# enables normal active operation (read/write), while CS2 serves as the dedicated battery backup trigger: when CS2 is asserted low (VIL), the device enters ultra-low-power data retention mode drawing only 10 µA typical current. Both signals can be used together for hierarchical memory control - for example, CS1# gated by processor enable and CS2 tied to backup power rail - enabling fully autonomous retention during main power failure without firmware intervention.

What is the minimum supply voltage required to retain data in the R1LV0416DBG-7LI#B0?

The R1LV0416DBG-7LI#B0 guarantees data retention down to VCC = 2.0 V, as specified in the Low VCC Data Retention Characteristics table (page 13). This applies across the full industrial temperature range (−40°C to +85°C) when entering retention mode via CS2 assertion or other qualifying conditions (e.g., LB#/UB# high with CS2 high and CS1# low). At 2.0 V, typical retention current is 10 µA at +25°C, increasing slightly at elevated temperatures.

Is the R1LV0416DBG-7LI#B0 RoHS compliant and lead-free?

Yes, the R1LV0416DBG-7LI#B0 is RoHS compliant and lead-free. Per Renesas documentation and product marking conventions, the "#B0" suffix denotes lead-free, halogen-free packaging meeting EU RoHS Directive 2011/65/EU requirements. The 48-ball CSP uses matte tin surface finish on solder balls and complies with JEDEC J-STD-020 moisture sensitivity level (MSL) 3 handling guidelines.

R1LV0416DBG-7LI#B0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
48-TFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
70ns
Access Time:
70 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TFBGA (7.5x8.5)

R1LV0416DBG-7LI#B0 FAQ

1.How can I place an order for R1LV0416DBG-7LI#B0 through Aetrix?

Please submit a Request for Quotation (RFQ) for R1LV0416DBG-7LI#B0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R1LV0416DBG-7LI#B0 reliable?

The price and inventory of R1LV0416DBG-7LI#B0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1LV0416DBG-7LI#B0 is usually 5 days.

3.What payment methods are accepted for R1LV0416DBG-7LI#B0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1LV0416DBG-7LI#B0 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R1LV0416DBG-7LI#B0?

R1LV0416DBG-7LI#B0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R1LV0416DBG-7LI#B0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R1LV0416DBG-7LI#B0?

For technical support, including R1LV0416DBG-7LI#B0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1LV0416DBG-7LI#B0 requirements.

6.How does Aetrix verify that R1LV0416DBG-7LI#B0 is sourced from the original manufacturer or authorized distributors?

All R1LV0416DBG-7LI#B0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1LV0416DBG-7LI#B0 meets industry standards.

7.What is the process for return or replacement of R1LV0416DBG-7LI#B0?

All R1LV0416DBG-7LI#B0 units undergo pre-shipment inspection (PSI). If there is an issue with R1LV0416DBG-7LI#B0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R1LV0416DBG-7LI#B0 part is unused and in its original packaging.

Return procedure for R1LV0416DBG-7LI#B0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R1LV0416DBG-7LI#B0 Tags

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