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Renesas R1LV1616RBG-7SR#S0
- Part No.:
- R1LV1616RBG-7SR#S0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
R1LV1616RBG-7SR#S0.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,184
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Product details
Overview
R1LV1616RBG-7SR#S0 from Renesas Electronics is a 16Mb low-power static RAM (1M × 16-bit or 2M × 8-bit), fabricated in 0.15µm CMOS, operating from 2.7V to 3.6V with 70ns access time and 2µA typical standby current at 3.0V. It supports battery backup operation and TTL-compatible interfacing, and is used in portable instrumentation, industrial controllers, and embedded systems requiring non-refresh, low-leakage memory.
For engineers reviewing the R1LV1616RBG-7SR#S0 datasheet, R1LV1616RBG-7SR#S0 pinout, R1LV1616RBG-7SR#S0 application, or R1LV1616RBG-7SR#S0 equivalent, this page delivers verified package mapping (48-ball f-BGA, 7.5mm × 8.5mm, 0.75mm pitch), byte-select control (LB#/UB#), data retention down to 2.0V, three-state I/O with OE#, and CS1#/CS2# dual-chip-select architecture for memory expansion.
Technical Context
The R1LV1616RBG-7SR#S0 implements a fully static memory array with no clocks or refresh cycles, using address decoding and output buffering controlled by CS1#, CS2#, OE#, WE#, LB#, and UB#. Its dual-bank chip select (CS1# active-low, CS2 active-high) enables hierarchical memory mapping without external logic.
It supports x16 and x8 data bus configurations via BYTE#-enabled mode (though BYTE# is not available on f-BGA packages), and features OR-tie capable three-state outputs with guaranteed 2.4V VOH and 0.4V VOL under 1mA/–1mA loads. Data retention is maintained at Vcc ≥ 2.0V with CS1#, CS2#, or LB#/UB# asserted appropriately.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16 or 2,097,152 × 8) |
| Access Time | 70 ns - guarantees valid read data within 70 ns after stable address and CS1# assertion |
| Supply Voltage | 2.7–3.6 V - supports single-supply operation in battery-backed or wide-input industrial rails |
| Standby Current | 2 µA typ. at 3.0 V - enables multi-year battery backup in off-mode applications |
| Data Retention Voltage | 2.0 V min - retains stored data during brown-out or backup battery operation |
| Input Compatibility | TTL - interfaces directly with legacy microcontrollers and FPGAs without level shifters |
| Package | 48-ball f-BGA (7.5 mm × 8.5 mm, 0.75 mm pitch, 6×8 array) - compact footprint for space-constrained PCBs |
Pinout & Package
Package: 48-ball fine-pitch BGA (f-BGA), 7.5 mm × 8.5 mm body, 0.75 mm ball pitch, 6×8 ball array. No BYTE# pin - x8/x16 mode selection is handled internally via address A–1 (DQ15/A–1) and LB#/UB# control only.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word addressing; A19 enables full 16Mb density |
| DQ0–DQ15 | Bi-directional Data I/O | Common data bus for read/write; DQ15 doubles as A–1 in byte mode (x8 configuration) |
| CS1#, CS2 | Chip Select Controls | CS1# (active-low) + CS2 (active-high) enable hierarchical decoding; both required for active memory access |
| WE#, OE#, LB#, UB# | Control Inputs | WE# initiates write; OE# enables output drivers; LB#/UB# select lower/upper byte in x16 mode |
| Vcc, Vss | Power Terminals | Single 2.7–3.6V supply; Vss is ground reference for all I/O and core logic |
| NC | No Connect | Ball positions marked NC are unconnected silicon pads - must be left floating or grounded per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| No refresh required | Fully static operation eliminates DRAM-style refresh circuitry and timing overhead |
| Low-voltage data retention | Maintains memory contents at Vcc ≥ 2.0V - critical for battery-switchover reliability |
| Three-state OR-tie outputs | Enables direct wire-OR connection of multiple SRAMs on shared data bus without external logic |
| Dual chip select (CS1#/CS2) | Supports seamless memory expansion across multiple devices using simple decode logic |
| TTL-compatible I/O | Direct interface with legacy MCUs, CPLDs, and ASICs - no level-shifting components needed |
Applications
| Portable Medical Monitors | Industrial PLC Data Buffers |
|---|---|
Use Scenario: Real-time waveform capture and temporary storage in handheld ECG or SpO₂ monitors with limited PCB area and battery life constraints. IC Role / Device Role / Timing Role: Non-volatile buffer storing sensor samples between MCU processing cycles; operates in low-power standby between acquisitions. Use Value: 2µA standby current extends battery life; 70ns access enables rapid burst reads during display updates; 2.0V retention preserves last readings during battery swap. |
Use Scenario: Local data logging and register shadowing in DIN-rail mounted programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: High-reliability scratchpad memory for I/O status mirroring and fault-event timestamping, interfaced to 8/16-bit industrial microcontrollers. Use Value: TTL compatibility ensures plug-and-play integration; dual CS pins simplify modular backplane memory expansion; no refresh simplifies firmware design. |
| Avionics Display Controllers | Test & Measurement Equipment |
Use Scenario: Frame buffer and configuration storage in ruggedized cockpit displays where thermal cycling and power transients occur frequently. IC Role / Device Role / Timing Role: Static memory holding GUI assets and calibration tables; accessed during boot and runtime by display processor over parallel bus. Use Value: 2.7–3.6V supply range accommodates aircraft 28VDC-derived rails with regulation tolerance; f-BGA package resists vibration-induced solder fatigue. |
Use Scenario: Acquisition buffer in digital oscilloscopes and logic analyzers requiring deterministic, low-latency memory access for trigger capture. IC Role / Device Role / Timing Role: High-speed trace memory staging sampled data before transfer to host; operated in x16 mode for maximum bandwidth. Use Value: 70ns access time meets sub-100ns sampling system timing budgets; three-state outputs prevent bus contention during DMA transfers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-power parallel SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV1616AL-70TQLI | 70ns access, 3.3V-only (3.0–3.6V), 48-pin TSOP-I package (12mm × 20mm), no f-BGA option | Requires PCB redesign for TSOP footprint; lacks f-BGA mechanical robustness for high-vibration environments | Choose when board space allows TSOP and legacy layout reuse is prioritized over miniaturization |
| AS6C1616-70TIN | 70ns access, 2.7–3.6V, 48-ball f-BGA (same 7.5 × 8.5 mm), but higher 5µA standby current (vs. 2µA) | Same mounting compatibility; less suitable for multi-year battery backup due to 2.5× higher standby draw | Acceptable for mains-powered test equipment where standby current is secondary to cost and availability |
Compared with IS61LV1616AL-70TQLI and AS6C1616-70TIN, the R1LV1616RBG-7SR#S0 uniquely combines f-BGA miniaturization, ultra-low 2µA standby, and 2.0V data retention - making it optimal for portable, battery-critical, and space-constrained designs where long-term data integrity during power loss is mandatory.
Availability
R1LV1616RBG-7SR#S0 is available at Aetrix Electronics and suitable for portable medical monitors, industrial PLC data buffers, and avionics display controllers requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.
Supply support for R1LV1616RBG-7SR#S0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The R1LV1616R Series was designed specifically for low-power, battery-backed memory applications demanding zero-refresh operation, wide voltage tolerance, and compact packaging - targeting portable instrumentation, industrial control, and safety-critical embedded systems.
FAQ
What is the operating temperature range for the R1LV1616RBG-7SR#S0?
The R1LV1616RBG-7SR#S0 is rated for industrial temperature operation from –40°C to +85°C. This is confirmed by the "R" suffix in the ordering code and specified in the Absolute Maximum Ratings table on page 5 of the datasheet REJ03C0101-0400Z. The device maintains full functionality-including 70ns access time and 2µA standby current-across this full range when supplied with 2.7–3.6V.
Does the R1LV1616RBG-7SR#S0 support x8 data bus mode?
Yes, the R1LV1616RBG-7SR#S0 supports x8 mode via internal byte selection using LB# and UB# pins, but it does not include the BYTE# pin - which is only present on TSOP and µTSOP packages. In x8 mode, DQ0–DQ7 carry lower-byte data and DQ8–DQ15 carry upper-byte data, with A–1 (multiplexed on DQ15) controlling byte alignment. This is documented in the Block Diagram (page 4) and Operating Table (page 5).
What is the minimum supply voltage required to retain data in the R1LV1616RBG-7SR#S0?
The R1LV1616RBG-7SR#S0 guarantees data retention down to 2.0V, as explicitly stated in the Features list (page 1) and the Data Retention Characteristics table (page 15). This applies when CS1#, CS2#, or LB#/UB# are asserted per the retention waveforms - enabling reliable holdover during brown-out or battery transition events without external capacitors or supervisors.
Is the R1LV1616RBG-7SR#S0 pin-compatible with other members of the R1LV1616R family?
No - the R1LV1616RBG-7SR#S0 uses a 48-ball f-BGA package, while other variants like R1LV1616RSA-7S% use 48-pin TSOP-I and R1LV1616RSD-7S% use 52-pin µTSOP. Pinouts differ significantly across packages; for example, BYTE# exists only in TSOP/µTSOP, and ball/pin numbering is incompatible. Migration requires full PCB redesign, not just footprint substitution.
What is the meaning of "R1LV1616RBG-7SR#S0" in the part number breakdown?
In R1LV1616RBG-7SR#S0: "R1LV1616R" = product series; "B" = f-BGA package; "G" = lead-free (Pb-free) finish; "-7" = 70ns access time; "S" = standard grade; "R" = –40°C to +85°C temperature range; "#S0" = tape-and-reel packaging per JEDEC standard. This decoding aligns with the Ordering Information table on page 2 of REJ03C0101-0400Z.
R1LV1616RBG-7SR#S0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (7.5x8.5)
R1LV1616RBG-7SR#S0 FAQ
1.How can I place an order for R1LV1616RBG-7SR#S0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R1LV1616RBG-7SR#S0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R1LV1616RBG-7SR#S0 reliable?
The price and inventory of R1LV1616RBG-7SR#S0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1LV1616RBG-7SR#S0 is usually 5 days.
3.What payment methods are accepted for R1LV1616RBG-7SR#S0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1LV1616RBG-7SR#S0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R1LV1616RBG-7SR#S0?
R1LV1616RBG-7SR#S0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R1LV1616RBG-7SR#S0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R1LV1616RBG-7SR#S0?
For technical support, including R1LV1616RBG-7SR#S0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1LV1616RBG-7SR#S0 requirements.
6.How does Aetrix verify that R1LV1616RBG-7SR#S0 is sourced from the original manufacturer or authorized distributors?
All R1LV1616RBG-7SR#S0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1LV1616RBG-7SR#S0 meets industry standards.
7.What is the process for return or replacement of R1LV1616RBG-7SR#S0?
All R1LV1616RBG-7SR#S0 units undergo pre-shipment inspection (PSI). If there is an issue with R1LV1616RBG-7SR#S0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R1LV1616RBG-7SR#S0 part is unused and in its original packaging.
Return procedure for R1LV1616RBG-7SR#S0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R1LV1616RBG-7SR#S0 Tags
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