Renesas R1Q2A7218ABB-40IB0
- Part No.:
- R1Q2A7218ABB-40IB0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
R1Q2A7218ABB-40IB0.pdf
- Description:
- STANDARD SRAM, 4MX18, 0.45NS
- Quantity:
- Payment:

- Shipping:

Inventory:1,024
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R1Q2A7218ABB from Renesas Electronics is a 4,194,304-word × 18-bit synchronous Quad Data Rate II (QDR-II) SRAM with burst-of-2 operation, 1.8 V core supply (VDD), 1.5 V I/O supply (VDDQ), and 165-pin FBGA (13 × 15 mm) packaging. It features dual clock pairs (K/̅K for input registration, C/̅C for output timing), HSTL I/O, programmable output impedance via ZQ pin, and JTAG 1149.1 test access - designed for high-bandwidth packet buffering in network switches and routers.
For engineers reviewing the R1Q2A7218ABB datasheet, R1Q2A7218ABB pinout, R1Q2A7218ABB application, or R1Q2A7218ABB equivalent, key selection criteria include its 250 MHz max operating frequency (4.0 ns cycle time), 1.5-cycle read latency, separate read/write ports enabling concurrent transactions, DLL/PLL-based data valid window control, and industrial temperature range (−40°C to +85°C) support.
Technical Context
The R1Q2A7218ABB implements a true synchronous architecture where all address, control, and data inputs are registered on rising edges of K and /K clocks. Its burst-of-2 operation delivers two words per transaction across independent read and write ports, achieving 100% bus utilization in DDR mode.
It integrates a DLL/PLL for precise output timing alignment with echo clocks CQ/̅CQ, supports clock-stop with microsecond restart, and uses HSTL-compatible I/O with user-programmable output impedance via external ZQ resistor - enabling robust signal integrity at 250 MHz in high-speed backplane and switch fabric applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 4,194,304 × 18-bit (72 Mbit total density) |
| Max Operating Frequency | 250 MHz - enables 500 MT/s per data pin with 4.0 ns cycle time |
| Read Latency | 1.5 cycles - determines minimum time from /R assertion to first valid Q output |
| Core Supply Voltage (VDD) | 1.7–1.9 V - powers internal logic and memory array; requires tight regulation |
| I/O Supply Voltage (VDDQ) | 1.4–1.5 V - powers HSTL output buffers; must not exceed VDD |
| Burst Length | 2-word burst - minimizes transaction overhead for small packet buffering |
| Package | 165-pin FBGA (13 mm × 15 mm × 1.4 mm) - RoHS-compliant, industrial-grade thermal profile |
Pinout & Package
Package: 165-ball plastic FBGA (13 × 15 mm, 0.8 mm pitch), Pb-free, industrial temperature grade (−40°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, /K | Input clock pair | Registers address/control on rising edge of K; registers input data on both K and /K rising edges |
| C, /C | Output clock pair | Controls output timing reference for Q/CQ outputs; may be tied high to use K/̅K instead |
| /R, /W | Synchronous read/write enable | Low-active commands latched on K rising edge; initiate burst read or write cycle |
| SA[0:19] | Synchronous address inputs | 20-bit address bus registered on K rising edge; supports 4M-word addressing |
| D[0:17], Q[0:17] | Data input/output bus | 18-bit bidirectional data path; D pins active during write, Q pins active during read |
| /BW0, /BW1 | Byte write enable | Enable writing to lower (D0–D8) or upper (D9–D17) 9-bit byte lanes independently |
| ZQ | Output impedance calibration | External resistor to ground sets output driver impedance to 0.2 × RQ (e.g., 250 Ω RQ → 50 Ω output) |
| TMS, TCK, TDI, TDO | JTAG 1149.1 interface | IEEE-standard boundary scan for test and debug; operates at 1.8 V I/O level |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Read/Write Ports | Enables simultaneous access to same memory array without arbitration delay - critical for full-duplex packet buffering |
| HSTL I/O with Programmable Impedance | Supports impedance matching to 50 Ω PCB traces via ZQ calibration - reduces signal reflections at 250 MHz |
| Dual Clock Architecture (K/̅K + C/̅C) | Decouples input registration from output timing - simplifies system-level clock tree design and skew management |
| 1.5-Cycle Read Latency | Minimizes pipeline stalls in high-throughput switching ASIC interfaces - aligns with typical SerDes-to-SRAM handshaking |
| Industrial Temperature Range | Guaranteed operation from −40°C to +85°C - suitable for uncontrolled telecom and industrial chassis environments |
Applications
| Network Switch Buffering | Router Packet Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/L3 switching ASICs with line-rate throughput. IC Role / Device Role / Timing Role: High-speed, low-latency shared memory buffer interfacing directly to switch fabric controller via QDR-II protocol. Use Value: Concurrent read/write ports eliminate arbitration bottlenecks; 250 MHz operation sustains ≥9 Gbps aggregate bandwidth (18 bits × 250 MHz × 2 transfers/cycle). | Use Scenario: Temporary storage of fragmented IP packets during classification, queuing, and forwarding in core routers. IC Role / Device Role / Timing Role: Burst-oriented SRAM acting as deep packet buffer between network processor and traffic manager. Use Value: 1.5-cycle read latency ensures minimal queuing delay; HSTL I/O maintains signal integrity across 10+ inch backplane traces. |
| Telecom Baseband Processing | Test Equipment Pattern Memory |
Use Scenario: Holding channel estimation coefficients and FFT intermediate results in LTE/5G baseband units requiring deterministic access timing. IC Role / Device Role / Timing Role: Synchronous SRAM providing jitter-free, cycle-accurate memory access synchronized to FPGA-based DSP pipelines. Use Value: Clock-stop capability allows power gating between bursts; DLL/PLL ensures stable data valid window across process/voltage/temperature corners. | Use Scenario: Storing high-speed digital stimulus and expected response patterns in automated test equipment (ATE) for SoC validation. IC Role / Device Role / Timing Role: Deterministic, low-jitter memory delivering precise timing-aligned vectors to DUT pins. Use Value: Dual-clock architecture (K/̅K + C/̅C) enables independent control of pattern load and compare clocks - essential for setup/hold margin testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR-II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2663KV18-400BZI | Same 72-Mbit ×18 organization, 400 MHz max (2.5 ns), 1.8 V core, but uses 225-ball FBGA (15 × 17 mm) | Higher speed grade; larger package footprint; identical industrial temp rating (−40°C to +85°C) | Select when system requires >250 MHz bandwidth and board layout accommodates larger package |
| AS7C36256P-15TIN | Asynchronous 256-K × 18 SRAM, 15 ns access, 3.3 V only, no burst or QDR interface | Fundamentally different architecture: no clocks, no burst, no concurrent ports - suited for glue logic or low-speed control memory | Only consider for non-critical, low-bandwidth subsystems where QDR timing and concurrency are unnecessary |
Compared with CY7C2663KV18-400BZI, the R1Q2A7218ABB offers smaller 13×15 mm FBGA and lower power at 250 MHz, while AS7C36256P-15TIN lacks QDR functionality entirely - making it unsuitable for high-speed packet buffering where deterministic latency and dual-port concurrency are mandatory.
Availability
R1Q2A7218ABB is available at Aetrix Electronics and suitable for network switch buffering, router packet memory, telecom baseband processing, and test equipment pattern memory requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R1Q2A7218ABB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The R1Q2A7218ABB belongs to Renesas' QDR-II SRAM product line, engineered specifically for high-bandwidth, low-latency data buffering in networking and communications equipment where deterministic timing and concurrent access are critical.
FAQ
What is the maximum operating frequency and corresponding cycle time for the R1Q2A7218ABB?
The R1Q2A7218ABB is rated for a maximum operating frequency of 250 MHz, corresponding to a minimum cycle time of 4.0 ns. This specification is guaranteed under industrial temperature conditions (−40°C to +85°C) with VDD = 1.8 V ±0.1 V and VDDQ = 1.5 V. The device achieves 500 million transfers per second (MT/s) on its 18-bit data bus using burst-of-2 QDR-II protocol.
Does the R1Q2A7218ABB support concurrent read and write operations on the same memory array?
Yes, the R1Q2A7218ABB features fully independent read and write data paths with separate address and control registers, enabling true concurrent read and write transactions to the same memory array without arbitration or pipeline stalls. This is implemented via dedicated /R and /W command inputs, both registered on the rising edge of the K clock, and is fundamental to its use in full-duplex packet buffering applications.
What are the power supply requirements for the R1Q2A7218ABB, and how do they differ between core and I/O domains?
The R1Q2A7218ABB requires two distinct power supplies: VDD (core) at 1.7–1.9 V nominal (1.8 V typical) for internal logic and memory array, and VDDQ (I/O) at 1.4–1.5 V for HSTL output drivers. VDDQ must never exceed VDD. Both supplies must be ramped in sequence (VSS → VDD → VDDQ → VREF → VIN) within 200 ms, with VDDQ applied after or simultaneously with VREF to ensure proper HSTL input buffer biasing.
How is output impedance calibrated on the R1Q2A7218ABB, and what resistor value yields 50 Ω drive strength?
Output impedance is calibrated via the ZQ pin, which must be connected to ground through an external precision resistor (RQ). The output driver impedance equals 0.2 × RQ. To achieve 50 Ω nominal output impedance, a 250 Ω resistor is used (0.2 × 250 Ω = 50 Ω). The RQ resistor tolerance must be ≤1% and total ZQ ball capacitance <7.5 pF to maintain ±15% impedance accuracy across voltage and temperature.
What is the function of the C and /C pins on the R1Q2A7218ABB, and can they be omitted in system design?
The C and /C pins on the R1Q2A7218ABB serve as user-controlled output timing reference clocks - their rising edges define when Q and CQ outputs are valid. These pins may be tied high (to VDDQ) to disable the C/̅C path and force the device to use K/̅K as the output reference instead, eliminating the need for a second clock source. When tied high, C and /C must remain static and never toggle during operation.
R1Q2A7218ABB-40IB0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
R1Q2A7218ABB-40IB0 FAQ
1.How can I place an order for R1Q2A7218ABB-40IB0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R1Q2A7218ABB-40IB0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R1Q2A7218ABB-40IB0 reliable?
The price and inventory of R1Q2A7218ABB-40IB0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1Q2A7218ABB-40IB0 is usually 5 days.
3.What payment methods are accepted for R1Q2A7218ABB-40IB0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1Q2A7218ABB-40IB0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R1Q2A7218ABB-40IB0?
R1Q2A7218ABB-40IB0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R1Q2A7218ABB-40IB0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R1Q2A7218ABB-40IB0?
For technical support, including R1Q2A7218ABB-40IB0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1Q2A7218ABB-40IB0 requirements.
6.How does Aetrix verify that R1Q2A7218ABB-40IB0 is sourced from the original manufacturer or authorized distributors?
All R1Q2A7218ABB-40IB0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1Q2A7218ABB-40IB0 meets industry standards.
7.What is the process for return or replacement of R1Q2A7218ABB-40IB0?
All R1Q2A7218ABB-40IB0 units undergo pre-shipment inspection (PSI). If there is an issue with R1Q2A7218ABB-40IB0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R1Q2A7218ABB-40IB0 part is unused and in its original packaging.
Return procedure for R1Q2A7218ABB-40IB0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R1Q2A7218ABB-40IB0 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

