Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas R1Q2A7236ABG-40IB1

Name: R1Q2A7236ABG-40IB1
Brand: Renesas
SKU: R1Q2A7236ABG-40IB1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: R1Q2A7236ABG-40IB1

Manufacturer:: Renesas

Category:: Memory

Package:: -

Datasheet:: R1Q2A7236ABG-40IB1.pdf

Description:: 72-MB DDR II+ SRAM (2M X 36-BIT)

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,176

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

R1Q2A7236ABG-40IB1 from Renesas Electronics is a 72-Mbit QDR™ II synchronous SRAM with 2,097,152-word × 36-bit organization, fabricated in advanced CMOS using full six-transistor memory cells. It operates at 250 MHz (4.0 ns cycle time), supports 1.8 V core and 1.4–1.5 V I/O supplies, and delivers concurrent read/write via separate ports - ideal for high-bandwidth packet buffering in network switches and routers.

For engineers reviewing the R1Q2A7236ABG-40IB1 datasheet, R1Q2A7236ABG-40IB1 pinout, R1Q2A7236ABG-40IB1 application, or R1Q2A7236ABG-40IB1 equivalent, this page provides verified timing parameters, FBGA-165 pin mapping, burst-2 DDR operation, HSTL I/O compliance, and industrial-temperature (-40°C to +85°C) qualification - all confirmed from Renesas Document R10DS0164EJ0011 Rev. 0.11.

Technical Context

This device implements true quad data rate architecture with dual clock pairs: K and /K register address/control on rising edges, while C and /C (or K and /K when C/C tied high) precisely time output data delivery. Its internal burst counter and self-timed write control eliminate external sequencing logic.

The memory integrates DLL/PLL circuitry for wide output data valid windows, programmable output impedance via ZQ calibration, and JTAG 1149.1 test access. All inputs are synchronous to K, and read latency is fixed at 1.5 cycles (L15), enabling deterministic timing in high-speed backplane interfaces.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	72 Mbit (2,097,152 words × 36 bits) - enables single-chip 256 KB line buffers in L2/L3 cache hierarchies.
Max Clock Frequency	250 MHz (4.0 ns cycle time) - supports 1 Gbps per data pin in burst-2 mode, matching OC-48/STM-16 line rates.
Supply Voltages	VDD = 1.7–1.9 V (core), VDDQ = 1.4–1.5 V (I/O) - ensures compatibility with 1.5 V HSTL-18 signaling and low-power system design.
Read Latency	1.5 cycles (L15) - guarantees first valid output data on second rising edge of C/C after /R assertion, simplifying timing closure.
Burst Length	2-word burst - minimizes bus turnaround overhead and aligns with common packet header sizes in telecom applications.
Operating Temperature	−40°C to +85°C (industrial grade) - qualified for deployment in uncontrolled ambient environments like base station cabinets.
Package	165-pin FBGA (13 mm × 15 mm × 1.4 mm, BB marking) - matches JEDEC MO-270AB standard for automated assembly and thermal management.

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm footprint, 0.8 mm ball pitch, Pb-free (RoHS 6/6 compliant), marked "BB" per Renesas part numbering convention.

Pin/Terminal	Circuit Role	Design Meaning
K, /K	Input clock pair	Registers address, /R, /W, and byte-write controls on rising edges; defines all synchronous timing boundaries.
C, /C	Output clock pair	Controls output data timing reference (first/third data on /C rise, second/fourth on C rise); may be tied high to use K//K instead.
/R, /W	Synchronous command inputs	/R initiates burst read; /W initiates burst write; both sampled on K rising edge and ignored on next K edge.
/BW0–/BW3	Byte write enable inputs	Selects 9-bit subwords for write masking (e.g., /BW0=L enables D0–D8; /BW1=L enables D9–D17) - supports partial writes without read-modify-write.
D0–D35	Data input bus	36-bit wide synchronous input port; data registered on both K and /K rising edges during write cycles.
Q0–Q35	Data output bus	36-bit wide synchronous output port; data aligned to C/C or K//K edges per read latency setting.
CQ, /CQ	Echo clock outputs	Tightly matched to Q outputs; used as data-valid strobes in source-synchronous capture (e.g., FPGA IDELAYCTRL alignment).
ZQ	Impedance calibration input	Connects to precision resistor (250 Ω typical) to set output driver impedance to 0.2×RQ - critical for HSTL bus signal integrity.
/DOFF	DLL/PLL disable	Low disables DLL/PLL for stable low-frequency operation (<120 MHz); high enables DLL/PLL for full-speed timing margin.
TMS, TDI, TCK, TDO	JTAG 1149.1 interface	Supports boundary scan testing and in-system programming; TCK must tie to VSS if unused.

Key Features

Feature	Design Value
Concurrent Read/Write Ports	Independent D and Q buses allow simultaneous access - eliminates arbitration delay in pipeline buffers and FIFOs.
HSTL Class I I/O	1.5 V VDDQ-compatible interface with programmable drive strength ensures clean signal integrity on 50–75 Ω PCB traces.
Two-Tick Burst Operation	Fixed 2-word burst reduces address bus activity by 50% vs. single-word access - lowers controller complexity and power.
On-Die DLL/PLL	Provides >200 ps data valid window at 250 MHz - relaxes PCB trace length matching requirements for high-speed routing.
Industrial Temperature Range	−40°C to +85°C operation validated per R1Q2A7236ABG-40IB1 marking - supports deployment in outdoor telecom infrastructure.
JTAG 1149.1 Test Access	Full boundary scan support enables production test coverage and debug visibility without physical probe points.

Applications

Network Packet Buffering	High-Speed Switch Fabric Interface
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/L3 switches before classification and forwarding. IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-latency, non-blocking buffer between ingress parser and egress scheduler logic. Use Value: Concurrent read/write enables real-time header modification and timestamp insertion without stalling the data path at 10 Gbps line rates.	Use Scenario: Interfacing between ASIC-based switch fabric controllers and SerDes PHYs in modular chassis systems. IC Role / Device Role / Timing Role: Synchronous timing bridge providing deterministic 1.5-cycle read latency and burst-aligned data staging. Use Value: CQ/CQ echo clocks simplify FPGA-based capture logic, reducing setup/hold violations in 250 MHz source-synchronous links.
Baseband Processing Memory	Test Equipment Pattern Memory
Use Scenario: Holding channel estimation coefficients and FFT intermediate results in LTE/5G remote radio units (RRUs). IC Role / Device Role / Timing Role: Low-latency, high-bandwidth scratchpad memory accessed by DSP cores and hardware accelerators. Use Value: 1.8 V core supply and industrial temperature rating ensure reliable operation in thermally constrained outdoor enclosures.	Use Scenario: Storing stimulus/response patterns for high-speed digital I/O validation in ATE platforms operating up to 500 Mbps per pin. IC Role / Device Role / Timing Role: Deterministic-access memory delivering synchronized bursts to parallel pin electronics (PE) drivers. Use Value: Programmable ZQ termination and HSTL I/O guarantee <±50 mV noise margin across 32-bit wide parallel test vectors.

Network Packet Buffering

High-Speed Switch Fabric Interface

Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/L3 switches before classification and forwarding.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-latency, non-blocking buffer between ingress parser and egress scheduler logic.

Use Value: Concurrent read/write enables real-time header modification and timestamp insertion without stalling the data path at 10 Gbps line rates.

Use Scenario: Interfacing between ASIC-based switch fabric controllers and SerDes PHYs in modular chassis systems.

IC Role / Device Role / Timing Role: Synchronous timing bridge providing deterministic 1.5-cycle read latency and burst-aligned data staging.

Use Value: CQ/CQ echo clocks simplify FPGA-based capture logic, reducing setup/hold violations in 250 MHz source-synchronous links.

Baseband Processing Memory

Test Equipment Pattern Memory

Use Scenario: Holding channel estimation coefficients and FFT intermediate results in LTE/5G remote radio units (RRUs).

IC Role / Device Role / Timing Role: Low-latency, high-bandwidth scratchpad memory accessed by DSP cores and hardware accelerators.

Use Value: 1.8 V core supply and industrial temperature rating ensure reliable operation in thermally constrained outdoor enclosures.

Use Scenario: Storing stimulus/response patterns for high-speed digital I/O validation in ATE platforms operating up to 500 Mbps per pin.

IC Role / Device Role / Timing Role: Deterministic-access memory delivering synchronized bursts to parallel pin electronics (PE) drivers.

Use Value: Programmable ZQ termination and HSTL I/O guarantee <±50 mV noise margin across 32-bit wide parallel test vectors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C2663KV18-400BZXC	Same 72-Mbit ×36, 250 MHz, but uses 165-ball FBGA (13×15 mm) with identical pinout and HSTL I/O - Cypress QDR II+ variant with ODT support.	Includes on-die termination (ODT) for simplified board-level termination; requires ZQ resistor and ODT pin configuration not needed for R1Q2A7236ABG-40IB1.	Choose when system-level signal integrity demands ODT and layout allows minor control pin reassignment.
AS7C372000B-25PCN	72-Mbit ×36 QDR II SRAM, 250 MHz, 165-ball FBGA, but rated only for commercial temperature (0°C to +70°C) and lacks JTAG test port.	No industrial temp rating or IEEE 1149.1 support - unsuitable for outdoor or mission-critical embedded deployments.	Consider only for cost-sensitive, indoor, non-mission-critical applications where testability and extended temperature are not required.

Compared with CY7C2663KV18-400BZXC and AS7C372000B-25PCN, the R1Q2A7236ABG-40IB1 offers guaranteed industrial temperature operation and full JTAG testability without ODT complexity - making it optimal for telecom infrastructure where reliability and debug access outweigh marginal BOM cost differences.

Availability

R1Q2A7236ABG-40IB1 is available at Aetrix Electronics and suitable for network packet buffering, high-speed switch fabric interface, baseband processing memory, and test equipment pattern memory requiring stable component supply across long product lifecycles.

Supply support for R1Q2A7236ABG-40IB1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The R1Q2A7236ABG-40IB1 belongs to Renesas' QDR™ II SRAM product line, engineered specifically for deterministic, high-bandwidth data buffering in telecom and networking equipment where low latency and concurrent access are mandatory.

FAQ

What is the maximum operating frequency of the R1Q2A7236ABG-40IB1?

The R1Q2A7236ABG-40IB1 is rated for a maximum clock frequency of 250 MHz, corresponding to a 4.0 ns minimum cycle time. This specification is validated under industrial temperature conditions (−40°C to +85°C) and 1.8 V ±0.1 V VDD, with timing margins confirmed in Renesas Document R10DS0164EJ0011 Rev. 0.11.

Does the R1Q2A7236ABG-40IB1 support burst-4 operation?

No, the R1Q2A7236ABG-40IB1 supports only burst-2 operation, as defined by its QDR II B2 designation in the part number. Burst length is fixed in hardware and cannot be configured; burst-4 capability is reserved for QDR II+ (e.g., R1QA-series) and later generations.

What is the purpose of the ZQ pin on the R1Q2A7236ABG-40IB1?

The ZQ pin on the R1Q2A7236ABG-40IB1 serves as an impedance calibration input. When connected to a precision 250 Ω resistor to ground, it sets the output driver impedance to 50 Ω (0.2 × RQ), ensuring HSTL signal integrity on controlled-impedance PCB traces - a requirement explicitly specified in the DC Characteristics table of the datasheet.

Can the R1Q2A7236ABG-40IB1 operate without the C and /C clocks?

Yes, the R1Q2A7236ABG-40IB1 can operate without external C and /C clocks: tying both high forces the device to use K and /K as output timing references instead. This single-clock mode is fully supported and documented in the Power-up and Initialization Sequence section (Page 9) of R10DS0164EJ0011.

Is the R1Q2A7236ABG-40IB1 pin-compatible with other members of the R1Q2A72xx series?

No, the R1Q2A7236ABG-40IB1 is not pin-compatible with R1Q2A7218ABB or R1Q2A7209ABB variants. While all share the same 165-ball FBGA package, their D/Q pin allocations differ significantly - e.g., R1Q2A7236ABG-40IB1 uses D0–D35/Q0–Q35, whereas the ×18 variant uses only D0–D17/Q0–Q17, leaving higher-numbered pins as NC.

R1Q2A7236ABG-40IB1 Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: *

Package/Case:: -

Packaging:: Bulk

Product Status:: Active

Programmable:: Not Verified

Memory Type:: -

Memory Format:: -

Technology:: -

Memory Size:: -

Memory Organization:: -

Memory Interface:: -

Clock Frequency:: -

Write Cycle Time - Word, Page:: -

Access Time:: -

Voltage - Supply:: -

Operating Temperature:: -

Grade:: -

Qualification:: -

Mounting Type:: -

Supplier Device Package:: -

R1Q2A7236ABG-40IB1 FAQ

1.How can I place an order for R1Q2A7236ABG-40IB1 through Aetrix?

Please submit a Request for Quotation (RFQ) for R1Q2A7236ABG-40IB1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R1Q2A7236ABG-40IB1 reliable?

The price and inventory of R1Q2A7236ABG-40IB1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1Q2A7236ABG-40IB1 is usually 5 days.

3.What payment methods are accepted for R1Q2A7236ABG-40IB1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1Q2A7236ABG-40IB1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R1Q2A7236ABG-40IB1?

R1Q2A7236ABG-40IB1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R1Q2A7236ABG-40IB1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R1Q2A7236ABG-40IB1?

For technical support, including R1Q2A7236ABG-40IB1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1Q2A7236ABG-40IB1 requirements.

6.How does Aetrix verify that R1Q2A7236ABG-40IB1 is sourced from the original manufacturer or authorized distributors?

All R1Q2A7236ABG-40IB1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1Q2A7236ABG-40IB1 meets industry standards.

7.What is the process for return or replacement of R1Q2A7236ABG-40IB1?

All R1Q2A7236ABG-40IB1 units undergo pre-shipment inspection (PSI). If there is an issue with R1Q2A7236ABG-40IB1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R1Q2A7236ABG-40IB1 part is unused and in its original packaging.

Return procedure for R1Q2A7236ABG-40IB1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…