Renesas R1Q3A7236ABB-33IA0
- Part No.:
- R1Q3A7236ABB-33IA0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
R1Q3A7236ABB-33IA0.pdf
- Description:
- STANDARD SRAM, 2MX36, 0.45NS
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
R1Q3A7236ABB from Renesas Electronics is a 72-Mbit QDR™ II synchronous SRAM with 2,097,152-word × 36-bit organization, fabricated in advanced CMOS using full six-transistor memory cells. It operates at 1.8 V core (VDD) and 1.4–1.5 V I/O (VDDQ), supports 333 MHz max frequency (3.0 ns cycle time), features four-tick burst, dual-clock DDR timing (K/̅K and C/̅C), and is packaged in a 165-pin 13×15 mm FBGA. It serves high-bandwidth packet buffering in network switches and routers.
For engineers reviewing the R1Q3A7236ABB datasheet, R1Q3A7236ABB pinout, R1Q3A7236ABB application, or R1Q3A7236ABB equivalent, key selection criteria include its QDR-II burst architecture, 1.5-cycle read latency, HSTL I/O compatibility, programmable output impedance via ZQ, and industrial temperature range (−40°C to +85°C).
Technical Context
This device implements a true quad data rate interface: two independent data ports enable concurrent read/write operations, while synchronized address/control latching on K/̅K rising edges ensures precise DDR timing. The integrated burst counter and self-timed write control eliminate external sequencing logic.
It uses separate input clocks (K/̅K) for address/control registration and output clocks (C/̅C) to minimize skew; echo clocks (CQ/̅CQ) provide deterministic data valid windows. DLL/PLL circuitry enables stable operation down to 120 MHz and supports future frequency scaling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2,097,152 words × 36 bits) |
| Max Clock Frequency | 333 MHz - enables 1.332 GB/s peak bandwidth (36-bit × 2 transfers/cycle × 333 MHz) |
| Read Latency | 1.5 cycles - first output data appears 1.5 clock cycles after /R assertion, enabling tight pipeline alignment |
| Supply Voltages | VDD = 1.7–1.9 V (core); VDDQ = 1.4–1.5 V (I/O) - decoupled rails reduce noise coupling between logic and I/O |
| Burst Length | 4-word burst - reduces address bus toggling by 75% vs. single-word access, lowering system EMI |
| Package | 165-pin FBGA (13 mm × 15 mm × 1.4 mm) - industry-standard footprint compatible with automated PCB assembly |
| Operating Temperature | −40°C to +85°C - qualified for industrial networking and telecom infrastructure environments |
Pinout & Package
Package: 165-pin plastic FBGA (13 × 15 × 1.4 mm), RoHS-compliant Pb-free, marked "R1Q3A7236ABB".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, /K | Input clock pair | Registers all address and control inputs on rising edges; defines fundamental timing reference for all operations |
| C, /C | Output clock pair | Controls output data timing (first/third data on /C rise, second/fourth on C rise); may be tied high to use K/̅K instead |
| CQ, /CQ | Output echo clocks | Edge-aligned with Q outputs; used as data-valid strobes in high-speed capture systems without added skew |
| /R, /W | Synchronous command inputs | Active-low read/write initiators - sampled on K rising edge; /R takes precedence over /W in concurrent request scenarios |
| /BW0–/BW3 | Byte write enables | Four independent 9-bit byte masks for granular 36-bit write control; each asserted low enables corresponding D[8:0], D[17:9], D[26:18], D[35:27] |
| ZQ | Impedance calibration input | Terminated to ground via precision resistor (RQ); sets Q/CQ output impedance to 0.2 × RQ (e.g., 50 Ω for RQ = 250 Ω) |
| Q0–Q35 | Data outputs | 36-bit synchronous outputs aligned to C/̅C or K/̅K; tri-state during /R inactive or power-up |
| D0–D35 | Data inputs | 36-bit synchronous inputs registered on both K and /K rising edges - requires strict setup/hold timing |
| SA[0:18] | Synchronous address inputs | 19-bit address bus registered on K rising edge; internal LSBs auto-generate burst sequence A, A+1, A+2, A+3 |
| TCK, TMS, TDI, TDO | JTAG test interface | IEEE 1149.1 compliant; supports boundary-scan testing and debug; TCK must tie to VSS if unused |
Key Features
| Feature | Design Value |
|---|---|
| Quad Data Rate (QDR) Interface | Enables simultaneous read and write on independent ports - eliminates arbitration delays in full-duplex buffer applications |
| Programmable Output Impedance | ZQ pin allows dynamic tuning of Q/CQ driver strength to match PCB trace impedance (±15% tolerance), reducing signal reflections |
| Four-Tick Burst Architecture | Delivers four consecutive words per address cycle - cuts address bus bandwidth requirement by 75% versus discrete addressing |
| DLL/PLL with Clock-Stop | Supports μs-scale restart from stopped-clock state - ideal for power-gated subsystems without PLL relock delay |
| HSTL I/O Compatibility | Meets JEDEC HSTL Class I specifications - ensures interoperability with FPGA and ASIC memory controllers using 1.5 V swing |
| JTAG 1149.1 Test Access | Provides standardized boundary-scan capability for production test and field diagnostics without custom probe fixtures |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing ingress/egress packets in multi-gigabit Ethernet switches with line-rate forwarding. IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between ingress parser and egress scheduler; reads and writes occur concurrently at 333 MHz. Use Value: 1.332 GB/s bandwidth and 1.5-cycle read latency enable zero-packet-loss forwarding under bursty traffic loads. | Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH line cards requiring deterministic latency. IC Role / Device Role / Timing Role: High-speed scratchpad memory for ATM cell reassembly and header processing engines. Use Value: Four-word burst and HSTL I/O ensure reliable data transfer across backplane traces up to 20 cm at 333 MHz. |
| Baseband Processing in 4G LTE | Industrial Real-Time Control |
Use Scenario: Inter-processor communication buffer between DSP and FPGA in wireless baseband units. IC Role / Device Role / Timing Role: Synchronous dual-port memory bridging heterogeneous processing domains with precise clock domain crossing. Use Value: Independent K/̅K and C/̅C clocks allow source-synchronous read capture and write initiation without FIFO synchronization overhead. | Use Scenario: Deterministic data logging and motion control loop storage in CNC machines operating at −40°C to +85°C. IC Role / Device Role / Timing Role: Industrial-grade SRAM providing guaranteed timing margins and thermal stability for safety-critical firmware execution. Use Value: Qualified industrial temperature range and 1.8 V core supply enable robust operation in uncooled enclosures with wide ambient swings. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR-II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2663KV18 | Same 72-Mbit ×36 QDR-II architecture, 333 MHz, 165-pin FBGA; differs in JTAG pinout (TDO on A11 vs. R1Q3A7236ABB's R1) and /DOFF behavior during initialization | Identical use in packet buffers and telecom line cards; requires minor PCB layout adjustment for TDO relocation | Select when Cypress ecosystem support or legacy design reuse is prioritized over Renesas-specific features like ZQ calibration granularity |
| IS42Q256S36 | 72-Mbit ×36 QDR-II, 333 MHz, 165-pin FBGA; lacks /DOFF pin and uses fixed-impedance outputs (no ZQ calibration) | Suitable for cost-sensitive industrial controls where DLL bypass is unnecessary and impedance matching is handled externally | Choose for simplified power-up sequence and lower BOM count where programmable output impedance is not required |
Compared with CY7C2663KV18 and IS42Q256S36, the R1Q3A7236ABB provides finer ZQ-based output impedance tuning and explicit DLL/PLL disable (/DOFF), making it preferable for high-signal-integrity designs requiring adaptive drive strength and low-jitter clock recovery.
Availability
R1Q3A7236ABB is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing in 4G LTE infrastructure, and industrial real-time control systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R1Q3A7236ABB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The R1Q3A7236ABB belongs to Renesas' QDR-II SRAM product line, engineered specifically for high-throughput, low-latency buffering in networking and telecommunications equipment where deterministic timing and dual-port concurrency are critical.
FAQ
What is the maximum operating frequency and corresponding cycle time for the R1Q3A7236ABB?
The R1Q3A7236ABB is rated for a maximum operating frequency of 333 MHz, corresponding to a minimum cycle time of 3.0 ns. This specification is validated under industrial temperature conditions (−40°C to +85°C) with VDD = 1.8 V ±0.1 V and VDDQ = 1.5 V. The device maintains timing compliance across this range without derating, supporting sustained 1.332 GB/s peak bandwidth in dual-port operation.
How does the R1Q3A7236ABB handle simultaneous read and write operations?
The R1Q3A7236ABB implements true dual-port architecture with physically separate read and write data paths. When /R and /W are asserted in the same clock cycle, the read operation takes precedence and executes immediately, while the write is deferred until the next available cycle. This priority scheme ensures deterministic latency for time-critical read responses in applications like packet forwarding engines.
What is the function of the ZQ pin on the R1Q3A7236ABB, and how is it configured?
The ZQ pin on the R1Q3A7236ABB is used for output impedance calibration. It must be terminated to ground via a precision resistor (RQ), typically 250 Ω, to set Q and CQ output driver impedance to 0.2 × RQ (e.g., 50 Ω). The total external capacitance on ZQ must remain below 7.5 pF. Leaving ZQ unconnected or tying it to VSS disables calibration and forces minimum impedance mode.
Does the R1Q3A7236ABB support industrial temperature operation, and what is the specified range?
Yes, the R1Q3A7236ABB is qualified for industrial temperature operation across −40°C to +85°C. This rating is confirmed by the "I" suffix in the part number variant (e.g., R1Q3A7236ABB-33IA0), and all DC and AC specifications in the datasheet are guaranteed over this full range with VDD = 1.8 V ±0.1 V and VDDQ = 1.5 V.
What are the power supply requirements for the R1Q3A7236ABB core and I/O circuits?
The R1Q3A7236ABB requires two independent supplies: VDD = 1.7–1.9 V (nominal 1.8 V) for the core logic and memory array, and VDDQ = 1.4–1.5 V (nominal 1.5 V) for the I/O buffers. VDDQ must never exceed VDD. Both supplies must ramp monotonically within 200 ms, with VDD stabilized before VDDQ, and VREF applied simultaneously with or after VDDQ to ensure proper HSTL input threshold referencing.
R1Q3A7236ABB-33IA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Single Port, Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- HSTL
- Clock Frequency:
- 300 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 450 ps
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-LBGA (13x15)
R1Q3A7236ABB-33IA0 FAQ
1.How can I place an order for R1Q3A7236ABB-33IA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R1Q3A7236ABB-33IA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R1Q3A7236ABB-33IA0 reliable?
The price and inventory of R1Q3A7236ABB-33IA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1Q3A7236ABB-33IA0 is usually 5 days.
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5.How can I obtain technical support or documentation for R1Q3A7236ABB-33IA0?
For technical support, including R1Q3A7236ABB-33IA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1Q3A7236ABB-33IA0 requirements.
6.How does Aetrix verify that R1Q3A7236ABB-33IA0 is sourced from the original manufacturer or authorized distributors?
All R1Q3A7236ABB-33IA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1Q3A7236ABB-33IA0 meets industry standards.
7.What is the process for return or replacement of R1Q3A7236ABB-33IA0?
All R1Q3A7236ABB-33IA0 units undergo pre-shipment inspection (PSI). If there is an issue with R1Q3A7236ABB-33IA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R1Q3A7236ABB-33IA0 part is unused and in its original packaging.
Return procedure for R1Q3A7236ABB-33IA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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