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Renesas R1Q3A7236ABB-33IA0

Part No.:
R1Q3A7236ABB-33IA0
Manufacturer:
Renesas
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixR1Q3A7236ABB-33IA0.pdf
Description:
STANDARD SRAM, 2MX36, 0.45NS
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,081

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Product details

Overview

R1Q3A7236ABB from Renesas Electronics is a 72-Mbit QDR™ II synchronous SRAM with 2,097,152-word × 36-bit organization, fabricated in advanced CMOS using full six-transistor memory cells. It operates at 1.8 V core (VDD) and 1.4–1.5 V I/O (VDDQ), supports 333 MHz max frequency (3.0 ns cycle time), features four-tick burst, dual-clock DDR timing (K/̅K and C/̅C), and is packaged in a 165-pin 13×15 mm FBGA. It serves high-bandwidth packet buffering in network switches and routers.

For engineers reviewing the R1Q3A7236ABB datasheet, R1Q3A7236ABB pinout, R1Q3A7236ABB application, or R1Q3A7236ABB equivalent, key selection criteria include its QDR-II burst architecture, 1.5-cycle read latency, HSTL I/O compatibility, programmable output impedance via ZQ, and industrial temperature range (−40°C to +85°C).

Technical Context

This device implements a true quad data rate interface: two independent data ports enable concurrent read/write operations, while synchronized address/control latching on K/̅K rising edges ensures precise DDR timing. The integrated burst counter and self-timed write control eliminate external sequencing logic.

It uses separate input clocks (K/̅K) for address/control registration and output clocks (C/̅C) to minimize skew; echo clocks (CQ/̅CQ) provide deterministic data valid windows. DLL/PLL circuitry enables stable operation down to 120 MHz and supports future frequency scaling.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (2,097,152 words × 36 bits)
Max Clock Frequency333 MHz - enables 1.332 GB/s peak bandwidth (36-bit × 2 transfers/cycle × 333 MHz)
Read Latency1.5 cycles - first output data appears 1.5 clock cycles after /R assertion, enabling tight pipeline alignment
Supply VoltagesVDD = 1.7–1.9 V (core); VDDQ = 1.4–1.5 V (I/O) - decoupled rails reduce noise coupling between logic and I/O
Burst Length4-word burst - reduces address bus toggling by 75% vs. single-word access, lowering system EMI
Package165-pin FBGA (13 mm × 15 mm × 1.4 mm) - industry-standard footprint compatible with automated PCB assembly
Operating Temperature−40°C to +85°C - qualified for industrial networking and telecom infrastructure environments

Pinout & Package

Package: 165-pin plastic FBGA (13 × 15 × 1.4 mm), RoHS-compliant Pb-free, marked "R1Q3A7236ABB".

Pin/TerminalCircuit RoleDesign Meaning
K, /KInput clock pairRegisters all address and control inputs on rising edges; defines fundamental timing reference for all operations
C, /COutput clock pairControls output data timing (first/third data on /C rise, second/fourth on C rise); may be tied high to use K/̅K instead
CQ, /CQOutput echo clocksEdge-aligned with Q outputs; used as data-valid strobes in high-speed capture systems without added skew
/R, /WSynchronous command inputsActive-low read/write initiators - sampled on K rising edge; /R takes precedence over /W in concurrent request scenarios
/BW0–/BW3Byte write enablesFour independent 9-bit byte masks for granular 36-bit write control; each asserted low enables corresponding D[8:0], D[17:9], D[26:18], D[35:27]
ZQImpedance calibration inputTerminated to ground via precision resistor (RQ); sets Q/CQ output impedance to 0.2 × RQ (e.g., 50 Ω for RQ = 250 Ω)
Q0–Q35Data outputs36-bit synchronous outputs aligned to C/̅C or K/̅K; tri-state during /R inactive or power-up
D0–D35Data inputs36-bit synchronous inputs registered on both K and /K rising edges - requires strict setup/hold timing
SA[0:18]Synchronous address inputs19-bit address bus registered on K rising edge; internal LSBs auto-generate burst sequence A, A+1, A+2, A+3
TCK, TMS, TDI, TDOJTAG test interfaceIEEE 1149.1 compliant; supports boundary-scan testing and debug; TCK must tie to VSS if unused

Key Features

FeatureDesign Value
Quad Data Rate (QDR) InterfaceEnables simultaneous read and write on independent ports - eliminates arbitration delays in full-duplex buffer applications
Programmable Output ImpedanceZQ pin allows dynamic tuning of Q/CQ driver strength to match PCB trace impedance (±15% tolerance), reducing signal reflections
Four-Tick Burst ArchitectureDelivers four consecutive words per address cycle - cuts address bus bandwidth requirement by 75% versus discrete addressing
DLL/PLL with Clock-StopSupports μs-scale restart from stopped-clock state - ideal for power-gated subsystems without PLL relock delay
HSTL I/O CompatibilityMeets JEDEC HSTL Class I specifications - ensures interoperability with FPGA and ASIC memory controllers using 1.5 V swing
JTAG 1149.1 Test AccessProvides standardized boundary-scan capability for production test and field diagnostics without custom probe fixtures

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing ingress/egress packets in multi-gigabit Ethernet switches with line-rate forwarding.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between ingress parser and egress scheduler; reads and writes occur concurrently at 333 MHz.

Use Value: 1.332 GB/s bandwidth and 1.5-cycle read latency enable zero-packet-loss forwarding under bursty traffic loads.

Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH line cards requiring deterministic latency.

IC Role / Device Role / Timing Role: High-speed scratchpad memory for ATM cell reassembly and header processing engines.

Use Value: Four-word burst and HSTL I/O ensure reliable data transfer across backplane traces up to 20 cm at 333 MHz.

Baseband Processing in 4G LTEIndustrial Real-Time Control

Use Scenario: Inter-processor communication buffer between DSP and FPGA in wireless baseband units.

IC Role / Device Role / Timing Role: Synchronous dual-port memory bridging heterogeneous processing domains with precise clock domain crossing.

Use Value: Independent K/̅K and C/̅C clocks allow source-synchronous read capture and write initiation without FIFO synchronization overhead.

Use Scenario: Deterministic data logging and motion control loop storage in CNC machines operating at −40°C to +85°C.

IC Role / Device Role / Timing Role: Industrial-grade SRAM providing guaranteed timing margins and thermal stability for safety-critical firmware execution.

Use Value: Qualified industrial temperature range and 1.8 V core supply enable robust operation in uncooled enclosures with wide ambient swings.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR-II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C2663KV18Same 72-Mbit ×36 QDR-II architecture, 333 MHz, 165-pin FBGA; differs in JTAG pinout (TDO on A11 vs. R1Q3A7236ABB's R1) and /DOFF behavior during initializationIdentical use in packet buffers and telecom line cards; requires minor PCB layout adjustment for TDO relocationSelect when Cypress ecosystem support or legacy design reuse is prioritized over Renesas-specific features like ZQ calibration granularity
IS42Q256S3672-Mbit ×36 QDR-II, 333 MHz, 165-pin FBGA; lacks /DOFF pin and uses fixed-impedance outputs (no ZQ calibration)Suitable for cost-sensitive industrial controls where DLL bypass is unnecessary and impedance matching is handled externallyChoose for simplified power-up sequence and lower BOM count where programmable output impedance is not required

Compared with CY7C2663KV18 and IS42Q256S36, the R1Q3A7236ABB provides finer ZQ-based output impedance tuning and explicit DLL/PLL disable (/DOFF), making it preferable for high-signal-integrity designs requiring adaptive drive strength and low-jitter clock recovery.

Availability

R1Q3A7236ABB is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing in 4G LTE infrastructure, and industrial real-time control systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R1Q3A7236ABB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The R1Q3A7236ABB belongs to Renesas' QDR-II SRAM product line, engineered specifically for high-throughput, low-latency buffering in networking and telecommunications equipment where deterministic timing and dual-port concurrency are critical.

FAQ

What is the maximum operating frequency and corresponding cycle time for the R1Q3A7236ABB?

The R1Q3A7236ABB is rated for a maximum operating frequency of 333 MHz, corresponding to a minimum cycle time of 3.0 ns. This specification is validated under industrial temperature conditions (−40°C to +85°C) with VDD = 1.8 V ±0.1 V and VDDQ = 1.5 V. The device maintains timing compliance across this range without derating, supporting sustained 1.332 GB/s peak bandwidth in dual-port operation.

How does the R1Q3A7236ABB handle simultaneous read and write operations?

The R1Q3A7236ABB implements true dual-port architecture with physically separate read and write data paths. When /R and /W are asserted in the same clock cycle, the read operation takes precedence and executes immediately, while the write is deferred until the next available cycle. This priority scheme ensures deterministic latency for time-critical read responses in applications like packet forwarding engines.

What is the function of the ZQ pin on the R1Q3A7236ABB, and how is it configured?

The ZQ pin on the R1Q3A7236ABB is used for output impedance calibration. It must be terminated to ground via a precision resistor (RQ), typically 250 Ω, to set Q and CQ output driver impedance to 0.2 × RQ (e.g., 50 Ω). The total external capacitance on ZQ must remain below 7.5 pF. Leaving ZQ unconnected or tying it to VSS disables calibration and forces minimum impedance mode.

Does the R1Q3A7236ABB support industrial temperature operation, and what is the specified range?

Yes, the R1Q3A7236ABB is qualified for industrial temperature operation across −40°C to +85°C. This rating is confirmed by the "I" suffix in the part number variant (e.g., R1Q3A7236ABB-33IA0), and all DC and AC specifications in the datasheet are guaranteed over this full range with VDD = 1.8 V ±0.1 V and VDDQ = 1.5 V.

What are the power supply requirements for the R1Q3A7236ABB core and I/O circuits?

The R1Q3A7236ABB requires two independent supplies: VDD = 1.7–1.9 V (nominal 1.8 V) for the core logic and memory array, and VDDQ = 1.4–1.5 V (nominal 1.5 V) for the I/O buffers. VDDQ must never exceed VDD. Both supplies must ramp monotonically within 200 ms, with VDD stabilized before VDDQ, and VREF applied simultaneously with or after VDDQ to ensure proper HSTL input threshold referencing.

R1Q3A7236ABB-33IA0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Single Port, Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
HSTL
Clock Frequency:
300 MHz
Write Cycle Time - Word, Page:
-
Access Time:
450 ps
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-LBGA (13x15)

R1Q3A7236ABB-33IA0 FAQ

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Please submit a Request for Quotation (RFQ) for R1Q3A7236ABB-33IA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of R1Q3A7236ABB-33IA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1Q3A7236ABB-33IA0 is usually 5 days.

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5.How can I obtain technical support or documentation for R1Q3A7236ABB-33IA0?

For technical support, including R1Q3A7236ABB-33IA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1Q3A7236ABB-33IA0 requirements.

6.How does Aetrix verify that R1Q3A7236ABB-33IA0 is sourced from the original manufacturer or authorized distributors?

All R1Q3A7236ABB-33IA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1Q3A7236ABB-33IA0 meets industry standards.

7.What is the process for return or replacement of R1Q3A7236ABB-33IA0?

All R1Q3A7236ABB-33IA0 units undergo pre-shipment inspection (PSI). If there is an issue with R1Q3A7236ABB-33IA0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R1Q3A7236ABB-33IA0 part is unused and in its original packaging.

Return procedure for R1Q3A7236ABB-33IA0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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