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Renesas R1Q4A7236ABG-40IA0

Part No.:
R1Q4A7236ABG-40IA0
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixR1Q4A7236ABG-40IA0.pdf
Description:
STANDARD SRAM, 2MX36, 0.45NS
Quantity:
Payment:
Payment
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Inventory:3,340

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Product details

Overview

R1Q4A7236ABG-40IA0 from Renesas Electronics is a 72-Mbit DDR II synchronous SRAM with 2,097,152-word × 36-bit organization, fabricated in advanced CMOS using full six-transistor memory cells. It operates at 1.8 V core and 1.4–1.5 V I/O supply, supports 250 MHz max frequency (4 ns cycle time), features HSTL I/O, burst-of-two operation, and is packaged in a 165-pin FBGA (15 × 17 × 1.4 mm) for high-speed networking buffer applications.

For engineers reviewing the R1Q4A7236ABG-40IA0 datasheet, R1Q4A7236ABG-40IA0 pinout, R1Q4A7236ABG-40IA0 application, or R1Q4A7236ABG-40IA0 equivalent, key selection criteria include DDR II burst timing, dual clock pair (K/̅K and C/̅C) synchronization, programmable output impedance via ZQ, DLL/PLL-enabled data valid window, and industrial temperature support (−40°C to +85°C).

Technical Context

This device implements a synchronous double-data-rate architecture where all inputs-including address (SAx), control (/LD, R/̅W, /BWx), and clocks (K, /K, C, /C)-are registered on rising edges. It uses pipelined DDR I/O with common DQ bus and echo clocks (CQ, /CQ) for precise data capture in high-bandwidth systems.

The internal burst counter and self-timed write control enable deterministic two-tick burst transactions. Clock-stop capability with microsecond restart and /DOFF pin allow low-power operation without loss of state, while JTAG 1149.1 support enables boundary-scan testability in complex PCB assemblies.

Key Specifications

ParameterValue and Actual Design Meaning
Density72 Mbit (2,097,152 words × 36 bits)
Max Frequency250 MHz (4 ns cycle time) - defines maximum sustained throughput of 1.8 Gbps per data line
Supply VoltagesVDD = 1.7–1.9 V (core); VDDQ = 1.4–1.5 V (I/O) - enables low-power, noise-immune HSTL signaling
Burst Length2-word linear burst - minimizes transaction overhead for packet buffering and streaming applications
Read Latency1.5 cycles (L15) - determines minimum clock-to-data delay for first valid output word
Package165-pin FBGA, 15 × 17 × 1.4 mm - standard footprint for high-density routing in telecom and switch fabric designs
Temperature RangeIndustrial: −40°C to +85°C - qualified for base station, industrial controller, and automotive infotainment environments

Pinout & Package

Package: 165-pin plastic FBGA (15 mm × 17 mm × 1.4 mm, ball pitch 0.8 mm), Pb-free, RoHS-compliant (6/6).

Pin/TerminalCircuit RoleDesign Meaning
K, /KInput clock pairRegisters all address/control inputs and input data on rising edges; defines synchronous timing reference for entire device
C, /COutput clock pairControls output data timing (first/third words referenced to /C, second/fourth to C); may be tied high to use K/̅K instead
CQ, /CQOutput echo clocksEdge-aligned with DQ outputs; used as data-valid strobes in high-speed receivers without added skew
SA0–SA10Synchronous address inputsRegistered on K/̅K rising edge; SA0/SA1 enable random burst start address for ×36 configuration
DQ0–DQ35Bi-directional data I/OShared bus for burst read/write; each bit synchronized to K/̅K or C/̅C depending on mode
/LD, R/̅W, /BW0–/BW3Control inputsDefine burst cycle type (read/write), direction, and byte-enable mask per 9-bit nibble in ×36 mode
ZQImpedance calibration inputConnects to external resistor (RQ) to set DQ/CQ output impedance to 0.2 × RQ; critical for signal integrity on 100+ MHz buses
/DOFFDLL/PLL disableWhen low, bypasses DLL/PLL for stable low-frequency operation (<120 MHz); required for power-down sequencing

Key Features

FeatureDesign Value
HSTL-compatible I/OSupports 1.5 V differential signaling with programmable drive strength, enabling clean signal integrity on dense backplanes
Dual clock domain (K/̅K + C/̅C)Decouples input registration from output timing, allowing independent optimization of setup/hold and data valid windows
Programmable output impedanceZQ pin calibrates DQ/CQ driver impedance to match system trace impedance (e.g., 50 Ω), reducing reflections and jitter
Two-tick burst operationMinimizes command overhead and latency for small-packet applications like Ethernet frame buffering and PCIe endpoint caching
JTAG 1149.1 test access portEnables IEEE-standard boundary-scan testing without dedicated test pads, simplifying validation of high-pin-count BGA layouts

Applications

Telecom Packet BufferingHigh-Speed Switch Fabric

Use Scenario: Storing ingress/egress Ethernet or SONET frames in Layer 2/L3 switches before forwarding decisions.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared-memory buffer interfacing directly to SerDes PHYs and traffic managers.

Use Value: 250 MHz DDR interface delivers 1.8 Gbps per DQ line, supporting full-duplex 10G Ethernet line-rate buffering with minimal latency penalty.

Use Scenario: Interconnecting multiple ASICs or FPGAs in modular chassis-based routers via parallel high-speed interconnects.

IC Role / Device Role / Timing Role: Synchronous shared memory node providing deterministic burst access between crossbar controllers and line cards.

Use Value: Burst-of-two operation and echo clocks (CQ/̅CQ) eliminate external FIFOs and simplify timing closure across multi-board backplane links.

Industrial Control Data LoggingAutomotive ADAS Preprocessing Buffer

Use Scenario: Capturing real-time sensor streams (e.g., CAN FD, camera, LiDAR) in ruggedized PLCs or motion controllers.

IC Role / Device Role / Timing Role: Industrial-temperature SRAM acting as temporary storage between high-speed ADCs and slower ARM Cortex-M host processors.

Use Value: −40°C to +85°C rating and clock-stop mode enable reliable operation in uncooled enclosures; /DOFF pin allows seamless low-power sleep/wake transitions.

Use Scenario: Holding intermediate image frames or radar point clouds prior to GPU or DSP processing in autonomous driving ECUs.

IC Role / Device Role / Timing Role: Low-jitter, burst-capable memory buffer synchronizing heterogeneous vision/radar subsystems operating at different clock domains.

Use Value: DLL/PLL circuitry ensures tight data valid window (±50 ps) across temperature, critical for pixel-perfect alignment in sensor fusion pipelines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1551KV18-250BZISame 72-Mbit ×36 density, 250 MHz, but uses QDR II architecture with separate read/write ports and no /LD controlRequires different control logic and address mapping; not drop-in compatible due to distinct burst protocol and pinoutSelect only if migrating to QDR's true simultaneous read/write capability is required; otherwise, R1Q4A7236ABG-40IA0 offers simpler DDR control and lower gate count FPGA logic
IS42S32800J-6BLISDRAM (not DDR SRAM); 256-Mbit ×32, 166 MHz, single-ended SSTL, no echo clocks or burst-of-two modeHigher density but significantly lower bandwidth per pin and higher latency; lacks deterministic timing for real-time bufferingChoose only for cost-sensitive, non-real-time applications where burst predictability and sub-10 ns read latency are not required

Compared with CY7C1551KV18-250BZI and IS42S32800J-6BLI, R1Q4A7236ABG-40IA0 uniquely balances deterministic DDR II timing, industrial temperature reliability, and minimal control complexity-making it optimal for telecom buffers and switch fabrics where burst predictability and echo-clock–assisted capture are essential.

Availability

R1Q4A7236ABG-40IA0 is available at Aetrix Electronics and suitable for telecom packet buffering, high-speed switch fabric, and industrial control data logging requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.

Supply support for R1Q4A7236ABG-40IA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The R1Q4A7236ABG-40IA0 belongs to Renesas' DDR II SRAM product line, designed specifically for high-bandwidth, low-latency buffering in networking equipment, telecom infrastructure, and real-time embedded systems demanding deterministic timing and industrial-grade reliability.

FAQ

What is the maximum operating frequency and corresponding cycle time for R1Q4A7236ABG-40IA0?

R1Q4A7236ABG-40IA0 is rated for a maximum operating frequency of 250 MHz, corresponding to a minimum cycle time of 4 ns. This specification is validated under industrial temperature conditions (−40°C to +85°C) with VDD = 1.8 V ±0.1 V and VDDQ = 1.5 V, and reflects guaranteed performance across the full speed bin defined by the "-40" suffix in the part number.

Does R1Q4A7236ABG-40IA0 support both DDR II and QDR II protocols?

No, R1Q4A7236ABG-40IA0 is a DDR II SRAM only. It does not support QDR II functionality such as separate read/write ports or quad data rate operation. The "Q" in the part number denotes membership in Renesas' broader QDR/DDR SRAM family naming convention, but this specific variant implements DDR II timing with common DQ bus, burst-of-two, and dual clock pairs (K/̅K and C/̅C) as defined in the R1Q4A7236ABG datasheet.

How is output impedance calibrated on R1Q4A7236ABG-40IA0?

Output impedance on R1Q4A7236ABG-40IA0 is calibrated via the ZQ pin, which must be connected to ground through an external precision resistor (RQ). The device sets DQ and CQ output impedance to 0.2 × RQ; for example, a 250 Ω RQ yields ~50 Ω driver impedance. Total ZQ net capacitance must remain below 7.5 pF to ensure accurate calibration, and RQ tolerance should be ≤1% for ±15% impedance matching accuracy.

What is the function of the /DOFF pin on R1Q4A7236ABG-40IA0?

The /DOFF (DLL/PLL Disable) pin on R1Q4A7236ABG-40IA0 disables the internal DLL/PLL when driven low, forcing the device into a bypass mode with fixed delay paths. This enables stable operation at frequencies below 120 MHz and supports low-power clock-stop modes with microsecond restart. When /DOFF is high, the DLL/PLL is active, providing jitter-reduced output timing and scalable data valid windows for high-frequency operation.

Is R1Q4A7236ABG-40IA0 pin-compatible with other members of the R1Q4A72xxABG series?

Yes, R1Q4A7236ABG-40IA0 shares identical pinout and package (165-pin FBGA) with R1Q4A7218ABG-40IA0 and other R1Q4A72xxABG variants in the same generation. However, functional differences exist: R1Q4A7236ABG-40IA0 uses all 36 DQ lines (DQ0–DQ35), whereas R1Q4A7218ABG-40IA0 uses only DQ0–DQ17 and treats DQ18–DQ35 as NC. Address and control pin assignments are fully compatible across the series.

R1Q4A7236ABG-40IA0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

R1Q4A7236ABG-40IA0 FAQ

1.How can I place an order for R1Q4A7236ABG-40IA0 through Aetrix?

Please submit a Request for Quotation (RFQ) for R1Q4A7236ABG-40IA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R1Q4A7236ABG-40IA0 reliable?

The price and inventory of R1Q4A7236ABG-40IA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1Q4A7236ABG-40IA0 is usually 5 days.

3.What payment methods are accepted for R1Q4A7236ABG-40IA0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1Q4A7236ABG-40IA0 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R1Q4A7236ABG-40IA0?

R1Q4A7236ABG-40IA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R1Q4A7236ABG-40IA0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R1Q4A7236ABG-40IA0?

For technical support, including R1Q4A7236ABG-40IA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1Q4A7236ABG-40IA0 requirements.

6.How does Aetrix verify that R1Q4A7236ABG-40IA0 is sourced from the original manufacturer or authorized distributors?

All R1Q4A7236ABG-40IA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1Q4A7236ABG-40IA0 meets industry standards.

7.What is the process for return or replacement of R1Q4A7236ABG-40IA0?

All R1Q4A7236ABG-40IA0 units undergo pre-shipment inspection (PSI). If there is an issue with R1Q4A7236ABG-40IA0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R1Q4A7236ABG-40IA0 part is unused and in its original packaging.

Return procedure for R1Q4A7236ABG-40IA0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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