Renesas R1Q4A7236ABG-40IA0
- Part No.:
- R1Q4A7236ABG-40IA0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
R1Q4A7236ABG-40IA0.pdf
- Description:
- STANDARD SRAM, 2MX36, 0.45NS
- Quantity:
- Payment:

- Shipping:

Inventory:3,340
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R1Q4A7236ABG-40IA0 from Renesas Electronics is a 72-Mbit DDR II synchronous SRAM with 2,097,152-word × 36-bit organization, fabricated in advanced CMOS using full six-transistor memory cells. It operates at 1.8 V core and 1.4–1.5 V I/O supply, supports 250 MHz max frequency (4 ns cycle time), features HSTL I/O, burst-of-two operation, and is packaged in a 165-pin FBGA (15 × 17 × 1.4 mm) for high-speed networking buffer applications.
For engineers reviewing the R1Q4A7236ABG-40IA0 datasheet, R1Q4A7236ABG-40IA0 pinout, R1Q4A7236ABG-40IA0 application, or R1Q4A7236ABG-40IA0 equivalent, key selection criteria include DDR II burst timing, dual clock pair (K/̅K and C/̅C) synchronization, programmable output impedance via ZQ, DLL/PLL-enabled data valid window, and industrial temperature support (−40°C to +85°C).
Technical Context
This device implements a synchronous double-data-rate architecture where all inputs-including address (SAx), control (/LD, R/̅W, /BWx), and clocks (K, /K, C, /C)-are registered on rising edges. It uses pipelined DDR I/O with common DQ bus and echo clocks (CQ, /CQ) for precise data capture in high-bandwidth systems.
The internal burst counter and self-timed write control enable deterministic two-tick burst transactions. Clock-stop capability with microsecond restart and /DOFF pin allow low-power operation without loss of state, while JTAG 1149.1 support enables boundary-scan testability in complex PCB assemblies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 72 Mbit (2,097,152 words × 36 bits) |
| Max Frequency | 250 MHz (4 ns cycle time) - defines maximum sustained throughput of 1.8 Gbps per data line |
| Supply Voltages | VDD = 1.7–1.9 V (core); VDDQ = 1.4–1.5 V (I/O) - enables low-power, noise-immune HSTL signaling |
| Burst Length | 2-word linear burst - minimizes transaction overhead for packet buffering and streaming applications |
| Read Latency | 1.5 cycles (L15) - determines minimum clock-to-data delay for first valid output word |
| Package | 165-pin FBGA, 15 × 17 × 1.4 mm - standard footprint for high-density routing in telecom and switch fabric designs |
| Temperature Range | Industrial: −40°C to +85°C - qualified for base station, industrial controller, and automotive infotainment environments |
Pinout & Package
Package: 165-pin plastic FBGA (15 mm × 17 mm × 1.4 mm, ball pitch 0.8 mm), Pb-free, RoHS-compliant (6/6).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, /K | Input clock pair | Registers all address/control inputs and input data on rising edges; defines synchronous timing reference for entire device |
| C, /C | Output clock pair | Controls output data timing (first/third words referenced to /C, second/fourth to C); may be tied high to use K/̅K instead |
| CQ, /CQ | Output echo clocks | Edge-aligned with DQ outputs; used as data-valid strobes in high-speed receivers without added skew |
| SA0–SA10 | Synchronous address inputs | Registered on K/̅K rising edge; SA0/SA1 enable random burst start address for ×36 configuration |
| DQ0–DQ35 | Bi-directional data I/O | Shared bus for burst read/write; each bit synchronized to K/̅K or C/̅C depending on mode |
| /LD, R/̅W, /BW0–/BW3 | Control inputs | Define burst cycle type (read/write), direction, and byte-enable mask per 9-bit nibble in ×36 mode |
| ZQ | Impedance calibration input | Connects to external resistor (RQ) to set DQ/CQ output impedance to 0.2 × RQ; critical for signal integrity on 100+ MHz buses |
| /DOFF | DLL/PLL disable | When low, bypasses DLL/PLL for stable low-frequency operation (<120 MHz); required for power-down sequencing |
Key Features
| Feature | Design Value |
|---|---|
| HSTL-compatible I/O | Supports 1.5 V differential signaling with programmable drive strength, enabling clean signal integrity on dense backplanes |
| Dual clock domain (K/̅K + C/̅C) | Decouples input registration from output timing, allowing independent optimization of setup/hold and data valid windows |
| Programmable output impedance | ZQ pin calibrates DQ/CQ driver impedance to match system trace impedance (e.g., 50 Ω), reducing reflections and jitter |
| Two-tick burst operation | Minimizes command overhead and latency for small-packet applications like Ethernet frame buffering and PCIe endpoint caching |
| JTAG 1149.1 test access port | Enables IEEE-standard boundary-scan testing without dedicated test pads, simplifying validation of high-pin-count BGA layouts |
Applications
| Telecom Packet Buffering | High-Speed Switch Fabric |
|---|---|
Use Scenario: Storing ingress/egress Ethernet or SONET frames in Layer 2/L3 switches before forwarding decisions. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared-memory buffer interfacing directly to SerDes PHYs and traffic managers. Use Value: 250 MHz DDR interface delivers 1.8 Gbps per DQ line, supporting full-duplex 10G Ethernet line-rate buffering with minimal latency penalty. | Use Scenario: Interconnecting multiple ASICs or FPGAs in modular chassis-based routers via parallel high-speed interconnects. IC Role / Device Role / Timing Role: Synchronous shared memory node providing deterministic burst access between crossbar controllers and line cards. Use Value: Burst-of-two operation and echo clocks (CQ/̅CQ) eliminate external FIFOs and simplify timing closure across multi-board backplane links. |
| Industrial Control Data Logging | Automotive ADAS Preprocessing Buffer |
Use Scenario: Capturing real-time sensor streams (e.g., CAN FD, camera, LiDAR) in ruggedized PLCs or motion controllers. IC Role / Device Role / Timing Role: Industrial-temperature SRAM acting as temporary storage between high-speed ADCs and slower ARM Cortex-M host processors. Use Value: −40°C to +85°C rating and clock-stop mode enable reliable operation in uncooled enclosures; /DOFF pin allows seamless low-power sleep/wake transitions. | Use Scenario: Holding intermediate image frames or radar point clouds prior to GPU or DSP processing in autonomous driving ECUs. IC Role / Device Role / Timing Role: Low-jitter, burst-capable memory buffer synchronizing heterogeneous vision/radar subsystems operating at different clock domains. Use Value: DLL/PLL circuitry ensures tight data valid window (±50 ps) across temperature, critical for pixel-perfect alignment in sensor fusion pipelines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1551KV18-250BZI | Same 72-Mbit ×36 density, 250 MHz, but uses QDR II architecture with separate read/write ports and no /LD control | Requires different control logic and address mapping; not drop-in compatible due to distinct burst protocol and pinout | Select only if migrating to QDR's true simultaneous read/write capability is required; otherwise, R1Q4A7236ABG-40IA0 offers simpler DDR control and lower gate count FPGA logic |
| IS42S32800J-6BLI | SDRAM (not DDR SRAM); 256-Mbit ×32, 166 MHz, single-ended SSTL, no echo clocks or burst-of-two mode | Higher density but significantly lower bandwidth per pin and higher latency; lacks deterministic timing for real-time buffering | Choose only for cost-sensitive, non-real-time applications where burst predictability and sub-10 ns read latency are not required |
Compared with CY7C1551KV18-250BZI and IS42S32800J-6BLI, R1Q4A7236ABG-40IA0 uniquely balances deterministic DDR II timing, industrial temperature reliability, and minimal control complexity-making it optimal for telecom buffers and switch fabrics where burst predictability and echo-clock–assisted capture are essential.
Availability
R1Q4A7236ABG-40IA0 is available at Aetrix Electronics and suitable for telecom packet buffering, high-speed switch fabric, and industrial control data logging requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.
Supply support for R1Q4A7236ABG-40IA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The R1Q4A7236ABG-40IA0 belongs to Renesas' DDR II SRAM product line, designed specifically for high-bandwidth, low-latency buffering in networking equipment, telecom infrastructure, and real-time embedded systems demanding deterministic timing and industrial-grade reliability.
FAQ
What is the maximum operating frequency and corresponding cycle time for R1Q4A7236ABG-40IA0?
R1Q4A7236ABG-40IA0 is rated for a maximum operating frequency of 250 MHz, corresponding to a minimum cycle time of 4 ns. This specification is validated under industrial temperature conditions (−40°C to +85°C) with VDD = 1.8 V ±0.1 V and VDDQ = 1.5 V, and reflects guaranteed performance across the full speed bin defined by the "-40" suffix in the part number.
Does R1Q4A7236ABG-40IA0 support both DDR II and QDR II protocols?
No, R1Q4A7236ABG-40IA0 is a DDR II SRAM only. It does not support QDR II functionality such as separate read/write ports or quad data rate operation. The "Q" in the part number denotes membership in Renesas' broader QDR/DDR SRAM family naming convention, but this specific variant implements DDR II timing with common DQ bus, burst-of-two, and dual clock pairs (K/̅K and C/̅C) as defined in the R1Q4A7236ABG datasheet.
How is output impedance calibrated on R1Q4A7236ABG-40IA0?
Output impedance on R1Q4A7236ABG-40IA0 is calibrated via the ZQ pin, which must be connected to ground through an external precision resistor (RQ). The device sets DQ and CQ output impedance to 0.2 × RQ; for example, a 250 Ω RQ yields ~50 Ω driver impedance. Total ZQ net capacitance must remain below 7.5 pF to ensure accurate calibration, and RQ tolerance should be ≤1% for ±15% impedance matching accuracy.
What is the function of the /DOFF pin on R1Q4A7236ABG-40IA0?
The /DOFF (DLL/PLL Disable) pin on R1Q4A7236ABG-40IA0 disables the internal DLL/PLL when driven low, forcing the device into a bypass mode with fixed delay paths. This enables stable operation at frequencies below 120 MHz and supports low-power clock-stop modes with microsecond restart. When /DOFF is high, the DLL/PLL is active, providing jitter-reduced output timing and scalable data valid windows for high-frequency operation.
Is R1Q4A7236ABG-40IA0 pin-compatible with other members of the R1Q4A72xxABG series?
Yes, R1Q4A7236ABG-40IA0 shares identical pinout and package (165-pin FBGA) with R1Q4A7218ABG-40IA0 and other R1Q4A72xxABG variants in the same generation. However, functional differences exist: R1Q4A7236ABG-40IA0 uses all 36 DQ lines (DQ0–DQ35), whereas R1Q4A7218ABG-40IA0 uses only DQ0–DQ17 and treats DQ18–DQ35 as NC. Address and control pin assignments are fully compatible across the series.
R1Q4A7236ABG-40IA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
R1Q4A7236ABG-40IA0 FAQ
1.How can I place an order for R1Q4A7236ABG-40IA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R1Q4A7236ABG-40IA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R1Q4A7236ABG-40IA0 reliable?
The price and inventory of R1Q4A7236ABG-40IA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1Q4A7236ABG-40IA0 is usually 5 days.
3.What payment methods are accepted for R1Q4A7236ABG-40IA0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1Q4A7236ABG-40IA0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R1Q4A7236ABG-40IA0?
R1Q4A7236ABG-40IA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R1Q4A7236ABG-40IA0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R1Q4A7236ABG-40IA0?
For technical support, including R1Q4A7236ABG-40IA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1Q4A7236ABG-40IA0 requirements.
6.How does Aetrix verify that R1Q4A7236ABG-40IA0 is sourced from the original manufacturer or authorized distributors?
All R1Q4A7236ABG-40IA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1Q4A7236ABG-40IA0 meets industry standards.
7.What is the process for return or replacement of R1Q4A7236ABG-40IA0?
All R1Q4A7236ABG-40IA0 units undergo pre-shipment inspection (PSI). If there is an issue with R1Q4A7236ABG-40IA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R1Q4A7236ABG-40IA0 part is unused and in its original packaging.
Return procedure for R1Q4A7236ABG-40IA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R1Q4A7236ABG-40IA0 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

